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2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)最新文献

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Study on power supply noise and electromagnetic radiation in relation to chip-package anti-resonance 电源噪声和电磁辐射与芯片封装反谐振的关系研究
2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) Pub Date : 2014-12-01 DOI: 10.1109/EDAPS.2014.7030814
S. Kiyoshige, W. Ichimura, T. Sudo
{"title":"Study on power supply noise and electromagnetic radiation in relation to chip-package anti-resonance","authors":"S. Kiyoshige, W. Ichimura, T. Sudo","doi":"10.1109/EDAPS.2014.7030814","DOIUrl":"https://doi.org/10.1109/EDAPS.2014.7030814","url":null,"abstract":"Electromagnetic radiation is strongly related to power integrity of digital electronic systems. In order to estimate power supply noise exactly, chip-package-board co-design becomes more important to estimate the properties of chip-package anti-resonance. In particular, power supply noise is very sensitive to Q factor value of the anti-resonance. In this paper, three test chips were designed with different on-chip PDN properties. These three chips were intended to have typical characteristics; oscillatory region and critical damped conditions. By using these chips, the relationships between power supply noises and Q factor values of chip-package anti-resonances were extensively studied by using QFP and BGA packages. Furthermore, both electromagnetic near-field and far-field radiation were evaluated. It has been proved that electromagnetic radiation was dramatically reduced by establishing the critical damping condition in chip-package-board co-design.","PeriodicalId":387223,"journal":{"name":"2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","volume":"93 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126360565","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Crosstalk reduction for compact optical transceiver module 紧凑型光收发模块的串扰抑制
2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) Pub Date : 2014-12-01 DOI: 10.1109/EDAPS.2014.7030825
Norio Cujo, G. Shinkai, Y. Matsuoka, H. Yamashita, M. Yasunaga
{"title":"Crosstalk reduction for compact optical transceiver module","authors":"Norio Cujo, G. Shinkai, Y. Matsuoka, H. Yamashita, M. Yasunaga","doi":"10.1109/EDAPS.2014.7030825","DOIUrl":"https://doi.org/10.1109/EDAPS.2014.7030825","url":null,"abstract":"We propose crosstalk reduction for the compact optical transceiver module. Crosstalk is composed of three elements: crosstalk resulting from electromagnetic coupling between adjacent signal lines, crosstalk resulting from electromagnetic coupling between transmission and reception, and crosstalk resulting from source impedance. Each element was reduced by adding a shield pattern and reducing the impedance of the pattern and that of the source pattern. We fabricated a module and demonstrated error-free transmission with simultaneous operation at 25 Gb/s by using a 231-1 pseudo random bit stream (PRBS).","PeriodicalId":387223,"journal":{"name":"2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126760240","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A novel wideband common-mode suppression filter for differential signal transmission 一种用于差分信号传输的新型宽带共模抑制滤波器
2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) Pub Date : 2014-12-01 DOI: 10.1109/EDAPS.2014.7030832
Fangxu Yang, M. Tang, Linsheng Wu, J. Mao
{"title":"A novel wideband common-mode suppression filter for differential signal transmission","authors":"Fangxu Yang, M. Tang, Linsheng Wu, J. Mao","doi":"10.1109/EDAPS.2014.7030832","DOIUrl":"https://doi.org/10.1109/EDAPS.2014.7030832","url":null,"abstract":"A novel wideband filter is designed for common mode noise (CMN) suppression in high-speed differential signaling. The dumbbell-shaped defected ground structure (DGS) is periodically etched in the return path of differential line to suppress CMN. In order to improve the signal quality of the differential transmission, a periodic stub-loaded structure is designed to compensate the discontinuity of the odd-mode characteristic impedance. Furthermore, a slow-wave structure is employed to decrease the Bragg frequency and then enhance the bandwidth of CMN suppression effectively without enlarging the circuit size. The simulated and measured results of the prototype indicate that the CMN can be suppressed over 20 dB from 3.2 to 8.6 GHz by the filter, while good transmission characteristic can be achieved for the differential signals.","PeriodicalId":387223,"journal":{"name":"2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","volume":"55 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133913822","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
De-embedding method and segmentation approach using full wave solver for high speed channels in PCB/package co-design PCB/封装协同设计中高速通道全波解算器的去嵌入和分割方法
2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) Pub Date : 2014-12-01 DOI: 10.1109/EDAPS.2014.7030808
LianKheng Teoh, C. Chiang, A. Scogna, Klaus Khrone, HsuenYen Lee
{"title":"De-embedding method and segmentation approach using full wave solver for high speed channels in PCB/package co-design","authors":"LianKheng Teoh, C. Chiang, A. Scogna, Klaus Khrone, HsuenYen Lee","doi":"10.1109/EDAPS.2014.7030808","DOIUrl":"https://doi.org/10.1109/EDAPS.2014.7030808","url":null,"abstract":"This paper proposes an accurate and effective modeling approach by incorporating a de-embedding method when de-composing electrically large PCB/Package models into smaller sub-models. The proposed technique allows to accurately taking into account the discontinuities at the PCB/package interface while reducing the simulation effort.","PeriodicalId":387223,"journal":{"name":"2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"113976980","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
A novel common-mode filter (CMF) design based on signal interference technique 一种基于信号干扰技术的新型共模滤波器设计
2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) Pub Date : 2014-12-01 DOI: 10.1109/EDAPS.2014.7030831
C.-H. Hung, Chih-Ying Hsiao, Tzong-Lin Wu
{"title":"A novel common-mode filter (CMF) design based on signal interference technique","authors":"C.-H. Hung, Chih-Ying Hsiao, Tzong-Lin Wu","doi":"10.1109/EDAPS.2014.7030831","DOIUrl":"https://doi.org/10.1109/EDAPS.2014.7030831","url":null,"abstract":"The signal interference technique is firstly employed to design the common-mode filter (CMF) for differential digital circuit applications. Using the network analysis, design curves for three common-mode transmission zeros are available by simple steps. A test sample is realized in two-layer PCB. The fractional bandwidth of common-mode suppression band (|Scc21| <; -10 dB) is 63 %, from 3.85 GHz to 7.4 GHz. The transmission coefficient of differential mode (|Sdd21|) is better than -3 dB from DC up to 10 GHz in measurement. The flat differential-mode group delay implies this CMF can preserve good signal integrity, which is obvious by eye diagram measurement in time domain.","PeriodicalId":387223,"journal":{"name":"2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123869336","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Null field preconditioner for fast 3D full-wave MoM package-board extraction 空场预调节器快速3D全波MoM包装板提取
2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) Pub Date : 2014-12-01 DOI: 10.1109/EDAPS.2014.7030822
Y. K. Negi, N. Balakrishnan, S. Rao, D. Gope
{"title":"Null field preconditioner for fast 3D full-wave MoM package-board extraction","authors":"Y. K. Negi, N. Balakrishnan, S. Rao, D. Gope","doi":"10.1109/EDAPS.2014.7030822","DOIUrl":"https://doi.org/10.1109/EDAPS.2014.7030822","url":null,"abstract":"In this paper, a preconditioning technique based on the null field method is presented to accelerate the convergence of fast near-linear complexity iterative Method of Moments (MoM) solution. For large-scale package-board 3D full-wave parasitic extraction, the solution time is often prohibitive for use in a design-cycle which might necessitate several analysis stages. The bottleneck is often the slow-convergence of the Krylov subspace-based iterative solution. Since the null field method scales the near field interactions to a block-diagonal form it can be used as an efficient preconditioner as shown in the numerical experiments.","PeriodicalId":387223,"journal":{"name":"2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130542547","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Silicon-package power delivery co-simulation with Fully Integrated Voltage Regulators on microprocessors 微处理器上全集成电压调节器的硅封装功率输出联合仿真
2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) Pub Date : 2014-12-01 DOI: 10.1109/EDAPS.2014.7030828
S. Govindan, S. Venkataraman
{"title":"Silicon-package power delivery co-simulation with Fully Integrated Voltage Regulators on microprocessors","authors":"S. Govindan, S. Venkataraman","doi":"10.1109/EDAPS.2014.7030828","DOIUrl":"https://doi.org/10.1109/EDAPS.2014.7030828","url":null,"abstract":"Fully Integrated Voltage Regulator (FIVR) has been introduced on Intel® Xeon® microprocessors which are switching power converters on die. The FIVR design includes air core inductor structures implemented on the package along with output capacitor, compensators, power transistors and control circuits implemented on-die. FIVR analysis has to comprehend and co-optimize both the package and the die. The power delivery analysis of FIVR is presented and design optimizations are discussed.","PeriodicalId":387223,"journal":{"name":"2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127479883","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
EMC-aware analysis and design of a low-cost receiver circuit under injection locking and pulling 基于电磁干扰的低成本接收电路的分析与设计
2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) Pub Date : 2014-12-01 DOI: 10.1109/EDAPS.2014.7030830
Martijn Huynen, Gert-Jan Stockman, F. Declercq, G. Torfs, J. Bauwelinck, D. Vande Ginste
{"title":"EMC-aware analysis and design of a low-cost receiver circuit under injection locking and pulling","authors":"Martijn Huynen, Gert-Jan Stockman, F. Declercq, G. Torfs, J. Bauwelinck, D. Vande Ginste","doi":"10.1109/EDAPS.2014.7030830","DOIUrl":"https://doi.org/10.1109/EDAPS.2014.7030830","url":null,"abstract":"In low-cost receiver applications, the preselect filter is often omitted in order to reduce the footprint of the total system. However, the immunity of the receiver can be severely compromised by this approach. This paper focuses on the effects of co-located sources on the local oscillator (LO), specifically injection locking and pulling. To this end, a low-cost radio receiver (RF) front-end is designed for operation in the 2:45 GHz industrial, scientific and medical (ISM) radio band. In addition to the effects on the oscillator, the consequences on the receiver's performance are evaluated as well. For the first time in literature, this work demonstrates the critical necessity to take the potentially detrimental effects caused by injection locking and pulling into account during Electromagnetic Compatibility (EMC)-aware design.","PeriodicalId":387223,"journal":{"name":"2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123992141","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Novel target impedance for power distribution network of simultaneous switching output (SSO) buffers 配电网同步开关输出缓冲器的新型目标阻抗
2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) Pub Date : 2014-12-01 DOI: 10.1109/EDAPS.2014.7030812
Jingook Kim, Eunkyeong Park, Jongjoo Lee, K. Park, Youngwoo Park
{"title":"Novel target impedance for power distribution network of simultaneous switching output (SSO) buffers","authors":"Jingook Kim, Eunkyeong Park, Jongjoo Lee, K. Park, Youngwoo Park","doi":"10.1109/EDAPS.2014.7030812","DOIUrl":"https://doi.org/10.1109/EDAPS.2014.7030812","url":null,"abstract":"The output voltages at parallel simultaneous switching output (SSO) channels are affected by impedance of power distribution network (PDN) and SSO patterns. In this paper, a target impedance for PDN is directly extracted from the allowable signal output variations due to the SSO patterns.","PeriodicalId":387223,"journal":{"name":"2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114741693","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Effect of layered media on the parallel plate impedance of printed circuit boards 层状介质对印刷电路板平行板阻抗的影响
2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) Pub Date : 2014-12-01 DOI: 10.1109/EDAPS.2014.7030807
David Dahl, S. Muller, C. Schuster
{"title":"Effect of layered media on the parallel plate impedance of printed circuit boards","authors":"David Dahl, S. Muller, C. Schuster","doi":"10.1109/EDAPS.2014.7030807","DOIUrl":"https://doi.org/10.1109/EDAPS.2014.7030807","url":null,"abstract":"This paper evaluates the impact of layered media on the parallel plate impedance of printed circuit boards. In the parallel plate impedance computation using the radial waveguide method (RWM) for infinite planes and a contour integral method (CIM) for finite planes, the layered nature of investigated structures can be accounted for by effective wave numbers. Here, the effective wave numbers are obtained using either an exact solution from the transverse resonance method (TRM) or adopting approximations based on the assumption of quasi-TEM fields and the applicability of suitable averages. The wave numbers obtained with these techniques are compared for typical structures of interest, and the parallel plate impedance computed with effective wave numbers is evaluated and compared to a full wave solution. The results show that a comparatively simple approximation for the effective wave number is sufficient for an accurate parallel plate impedance calculation.","PeriodicalId":387223,"journal":{"name":"2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","volume":"334 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116459726","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
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