Study on power supply noise and electromagnetic radiation in relation to chip-package anti-resonance

Abstract

Electromagnetic radiation is strongly related to power integrity of digital electronic systems. In order to estimate power supply noise exactly, chip-package-board co-design becomes more important to estimate the properties of chip-package anti-resonance. In particular, power supply noise is very sensitive to Q factor value of the anti-resonance. In this paper, three test chips were designed with different on-chip PDN properties. These three chips were intended to have typical characteristics; oscillatory region and critical damped conditions. By using these chips, the relationships between power supply noises and Q factor values of chip-package anti-resonances were extensively studied by using QFP and BGA packages. Furthermore, both electromagnetic near-field and far-field radiation were evaluated. It has been proved that electromagnetic radiation was dramatically reduced by establishing the critical damping condition in chip-package-board co-design.