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2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)最新文献

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Design space exploration of Through Silicon Vias for high-speed, low loss vertical links 高速、低损耗垂直链路的硅通孔设计空间探索
2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) Pub Date : 2014-12-01 DOI: 10.1109/EDAPS.2014.7030802
Somesh Kumar, Sarabjeet Kaur, Mayank Bakshi, Mohit Bansal, Mohan Choudhary, Rohit Sharma
{"title":"Design space exploration of Through Silicon Vias for high-speed, low loss vertical links","authors":"Somesh Kumar, Sarabjeet Kaur, Mayank Bakshi, Mohit Bansal, Mohan Choudhary, Rohit Sharma","doi":"10.1109/EDAPS.2014.7030802","DOIUrl":"https://doi.org/10.1109/EDAPS.2014.7030802","url":null,"abstract":"In this paper, performance analysis of Through Silicon Vias (TSVs) considering various bonding techniques is investigated. In that, bonding of TSVs using Cu-Sn microbumps, Cu-Ag microbumps and Cu-Cu direct bonding is considered. We present SPICE-compatible equivalent circuits for these configurations using exhaustive simulations performed on electromagnetic field solver, Ansys Q3D. We analyze these TSV configurations for various interconnect performance metrics, such as delay, energy delay product, energy per bit, insertion loss and bandwidth density. Our analysis gives physical insights into the effect of microbumps/discontinuities on the TSV performance. Our analytical results show that vertical interconnects using Cu-Cu direct bonding significantly outperforms those using Cu-Ag or Cu-Sn microbumps, which makes it an excellent candidate for high-speed, low loss vertical links.","PeriodicalId":387223,"journal":{"name":"2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126343296","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Guard trace with periodic structure taking signal integrity into account 考虑信号完整性的周期结构保护迹线
2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) Pub Date : 2014-12-01 DOI: 10.1109/EDAPS.2014.7030811
Y. Toyota, K. Iokibe, Tetsushi Watanabe
{"title":"Guard trace with periodic structure taking signal integrity into account","authors":"Y. Toyota, K. Iokibe, Tetsushi Watanabe","doi":"10.1109/EDAPS.2014.7030811","DOIUrl":"https://doi.org/10.1109/EDAPS.2014.7030811","url":null,"abstract":"The guard trace is effective for suppressing common-mode generation caused by placing a signal trace too close to the return edge on a printed circuit board. In our previous study, a guard trace with a periodic structure was proposed not only to reduce common-mode radiation but also to maintain signal integrity and was found to be effective. In the current work, the shape of the periodic structure and the termination at both edges to improve the features was investigated through full-wave simulation and measurement from the viewpoint of transmission coefficient as well as far-field radiation. Results show that the smaller the widths of the narrow portion, the further the periodic structure helps reduce common-mode radiation and maintain signal integrity. Also shown is that the periodic guard trace with both ends connected to the return plane is an appropriate structure.","PeriodicalId":387223,"journal":{"name":"2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114966571","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Indirect contact probing method for characterizing via arrays in electronic packaging 电子封装中通孔阵列表征的间接接触探测方法
2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) Pub Date : 2014-12-01 DOI: 10.1109/EDAPS.2014.7030805
Jongwoo Jeong, Jingook Kim, K. Han, N. Kang
{"title":"Indirect contact probing method for characterizing via arrays in electronic packaging","authors":"Jongwoo Jeong, Jingook Kim, K. Han, N. Kang","doi":"10.1109/EDAPS.2014.7030805","DOIUrl":"https://doi.org/10.1109/EDAPS.2014.7030805","url":null,"abstract":"In this paper, an indirect contact probing method for via arrays is proposed. The proposed method characterizes via arrays without contact damage from probe tips, and it does not require additional control and sensor electronics. To execute the indirect contact method, firstly, multiple measurements on specially designed calibration vias are performed to obtain the dielectric contactor characteristic. The characterized contactor layer is de-embedded when the actual via arrays as the device-under-tests (DUTs) are extracted. In simulations at frequencies ranging from 800 MHz to 25 GHz, it is confirmed that defects on via arrays can be successfully identified from the indirect-contact probing.","PeriodicalId":387223,"journal":{"name":"2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116791762","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
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