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Journal of Japan Institute of Electronics Packaging最新文献

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ミッションフェローの広場 任务费罗广场
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-07-01 DOI: 10.5104/jiep.26.381
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引用次数: 0
BBCube 3D Integration Technology Utilizes WOW and COW Hybrid Processes BBCube 3D集成技术利用WOW和COW混合工艺
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-07-01 DOI: 10.5104/jiep.26.348
Takayuki Ohba, Norio Chujo, H. Ryoson, Tatsuya Funaki
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引用次数: 0
Hybrid Bonding for 3D Integration 用于三维集成的混合键合
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-07-01 DOI: 10.5104/jiep.26.374
M. Fujino
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引用次数: 0
有機インターポーザを用いた高密度パッケージ基板 使用有机内插器高密度封装基板
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-07-01 DOI: 10.5104/jiep.26.361
Shota Miki, Kosuke Tsukamoto, Yuta Sakaguchi, Atsunori Kajiki
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引用次数: 0
目次 目次
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-07-01 DOI: 10.5104/jiep.26.c41
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引用次数: 0
Solving Social Issues by Electronics Packaging 用电子封装解决社会问题
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-07-01 DOI: 10.5104/jiep.26.p4
A. Fujisaki
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引用次数: 0
サスペンデッド・ブリッジ構造によるチップレット集積 悬吊桥结构的芯片集成
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-07-01 DOI: 10.5104/jiep.26.341
Y. Kurita
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引用次数: 0
投稿規定 投稿规定
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-07-01 DOI: 10.5104/jiep.26.i41
{"title":"投稿規定","authors":"","doi":"10.5104/jiep.26.i41","DOIUrl":"https://doi.org/10.5104/jiep.26.i41","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135265031","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
一般社団法人エレクトロニクス実装学会　2022年度表彰 一般社团法人电子安装学会2022年度表彰
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-07-01 DOI: 10.5104/jiep.26.315
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引用次数: 0
Koshiji Laboratory, Electrical and Electronics Course, Faculty of Engineering, Tokyo Polytechnic University 东京工业大学工程学院电气与电子课程Koshiji实验室
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-07-01 DOI: 10.5104/jiep.26.380
F. Koshiji
{"title":"Koshiji Laboratory, Electrical and Electronics Course, Faculty of Engineering, Tokyo Polytechnic University","authors":"F. Koshiji","doi":"10.5104/jiep.26.380","DOIUrl":"https://doi.org/10.5104/jiep.26.380","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"43688740","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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