发布求助
文献互助 智能选刊 最新文献

Journal of Japan Institute of Electronics Packaging最新文献

筛选
英文 中文
The 37th JIEP Annual Meeting JIEP第37届年会
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-05-01 DOI: 10.5104/jiep.16.232
{"title":"The 37th JIEP Annual Meeting","authors":"","doi":"10.5104/jiep.16.232","DOIUrl":"https://doi.org/10.5104/jiep.16.232","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"44481255","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The 37th JIEP Annual Meeting 第37届JIEP年会
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-05-01 DOI: 10.5104/jiep.26.305
{"title":"The 37th JIEP Annual Meeting","authors":"","doi":"10.5104/jiep.26.305","DOIUrl":"https://doi.org/10.5104/jiep.26.305","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"136048447","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
目次 目次
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-05-01 DOI: 10.5104/jiep.26.c31
{"title":"目次","authors":"","doi":"10.5104/jiep.26.c31","DOIUrl":"https://doi.org/10.5104/jiep.26.c31","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"136048454","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
創立20周年を迎えたNPO C-NETの活動とこれから 迎接创立20周年的NPO C-NET的活动和今后
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-05-01 DOI: 10.5104/jiep.26.300
{"title":"創立20周年を迎えたNPO C-NETの活動とこれから","authors":"","doi":"10.5104/jiep.26.300","DOIUrl":"https://doi.org/10.5104/jiep.26.300","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"42944246","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Agile Manufacturing and Education in the DX Era 数字化转型时代的敏捷制造与教育
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-05-01 DOI: 10.5104/jiep.26.p3
Tetsuya Asai
{"title":"Agile Manufacturing and Education in the DX Era","authors":"Tetsuya Asai","doi":"10.5104/jiep.26.p3","DOIUrl":"https://doi.org/10.5104/jiep.26.p3","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"47782313","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
特集に寄せて 寄来特辑
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-05-01 DOI: 10.5104/jiep.26.235
Ryo Nagase
{"title":"特集に寄せて","authors":"Ryo Nagase","doi":"10.5104/jiep.26.235","DOIUrl":"https://doi.org/10.5104/jiep.26.235","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":"252 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"136048450","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Near Infrared Light-Induced Self-Written Optical Waveguide and Its Application for Multi-Channel Waveguides 近红外光致自写光波导及其在多通道波导中的应用
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-05-01 DOI: 10.5104/jiep.26.262
Hidetaka Terasawa, Tsuyoshi Namekawa, K. Kondo, O. Sugihara
{"title":"Near Infrared Light-Induced Self-Written Optical Waveguide and Its Application for Multi-Channel Waveguides","authors":"Hidetaka Terasawa, Tsuyoshi Namekawa, K. Kondo, O. Sugihara","doi":"10.5104/jiep.26.262","DOIUrl":"https://doi.org/10.5104/jiep.26.262","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"44257390","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
微細バンプ接合による積層チップ間接続技術 基于微细凸块接合层叠芯片间连接技术
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-05-01 DOI: 10.5104/jiep.26.293
Masahiro Aoyagi
{"title":"微細バンプ接合による積層チップ間接続技術","authors":"Masahiro Aoyagi","doi":"10.5104/jiep.26.293","DOIUrl":"https://doi.org/10.5104/jiep.26.293","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"47521180","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Organic Materials for 3DIC Package —Focusing on Organic Insulating Materials for RDL— 3DIC封装用有机材料——聚焦RDL用有机绝缘材料--
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-03-01 DOI: 10.5104/jiep.26.211
T. Nonaka
{"title":"Organic Materials for 3DIC Package —Focusing on Organic Insulating Materials for RDL—","authors":"T. Nonaka","doi":"10.5104/jiep.26.211","DOIUrl":"https://doi.org/10.5104/jiep.26.211","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":"2001 3","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"41331190","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Contents (in English) 内容(英文)
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-03-01 DOI: 10.5104/jiep.26.c22
{"title":"Contents (in English)","authors":"","doi":"10.5104/jiep.26.c22","DOIUrl":"https://doi.org/10.5104/jiep.26.c22","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":"418 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"136181514","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
首页 上一页
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们：info@booksci.cn Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号：481959085
Book学术官方微信