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Journal of Japan Institute of Electronics Packaging最新文献

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特集に寄せて 寄来特辑
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-07-01 DOI: 10.5104/jiep.26.325
Yasumitsu Orii
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引用次数: 0
一般社団法人エレクトロニクス実装学会　第12回定時総会報告 一般社团法人电子安装学会第12回定时大会报告
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-07-01 DOI: 10.5104/jiep.26.382
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引用次数: 0
Pixel-Parallel 3D Integrated CMOS Image Sensors Using Direct Bonding of SOI Wafers 采用SOI晶片直接键合的像素并行3D集成CMOS图像传感器
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-07-01 DOI: 10.5104/jiep.26.356
M. Goto
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引用次数: 0
100 Gb/s 超級が期待できる光デバイスの現状性能と課題 可以期待100Gb/s超级的光器件的现状性能和课题
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-05-01 DOI: 10.5104/jiep.26.241
Nobuo Ohata, Mizuki Shirao, Junichi Suzuki
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引用次数: 0
高温動作及び液浸冷却が可能な高信頼シリコンフォトニクス光トランシーバ“IOCoreTM” 可高温操作和液浸冷却的高可靠硅光子学光收发器“IOCoreTM”
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-05-01 DOI: 10.5104/jiep.26.256
S. Kobayashi, Takashi Muto, Makoto Kuwata, Koichi Takemura, Kazuhiko Kurata
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引用次数: 0
ミッションフェローの広場 教会广场
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-05-01 DOI: 10.5104/jiep.26.304
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引用次数: 0
関西大学化学生命工学部化学・物質工学科原田研究室 関西大学化学生命工学部化学・物質工学科原田研究室
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-05-01 DOI: 10.5104/jiep.26.303
M. Harada
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引用次数: 0
オンボード光電気集積モジュール技術 板载光电集成模块技术
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-05-01 DOI: 10.5104/jiep.26.236
Takashi Yamamoto, Tomoyuki Akahoshi, Saki Tsujino, M. Takahashi, T. Matsubara
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引用次数: 0
Contents (in English) 内容(英文)
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-05-01 DOI: 10.5104/jiep.26.c32
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引用次数: 0
Co-Packaged Optics向け超小型光トランシーバ技術 面向Co-Packaged Optics的超小型光收发器技术
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-05-01 DOI: 10.5104/jiep.26.247
Kazuya Nagashima, Hideyuki Nasu
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引用次数: 0
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