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Journal of Japan Institute of Electronics Packaging最新文献

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投稿論文査読・校閲のお礼 投稿论文审读、校阅的致谢
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-11-01 DOI: 10.5104/jiep.26.676
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引用次数: 0
耐熱性を有するSn-Sb系高融点はんだ部品内蔵基板の実用化検討 具有耐热性的Sn-Sb类高熔点焊锡零件内置底板的实用化研究
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-11-01 DOI: 10.5104/jiep.26.650
Mitsuaki Toda
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引用次数: 0
The Device-Embedded Substrate Technology to Implement Heterogeneous Integration 实现异构集成的器件嵌入式衬底技术
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-11-01 DOI: 10.5104/jiep.26.634
Henry H. Utsunomiya
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引用次数: 0
Component-Embedded Substrates for High-Speed, Large-Scale System Modules 用于高速、大规模系统模块的组件嵌入式基板
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-11-01 DOI: 10.5104/jiep.26.644
Shinichi Maeda
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引用次数: 0
Baseball, Music, and Technology Conference 棒球、音乐和技术会议
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-11-01 DOI: 10.5104/jiep.26.p7
Takaaki Ishigure
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引用次数: 0
Contents (in English) 内容(英文)
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-11-01 DOI: 10.5104/jiep.26.c72
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引用次数: 0
目次 目次
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-11-01 DOI: 10.5104/jiep.26.c71
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引用次数: 0
ミッションフェローの広場 教会广场
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-11-01 DOI: 10.5104/jiep.26.685
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引用次数: 0
Merging of Additive Electronics and Low Temperature SMT into a Seamless System 将增材电子和低温SMT融合成无缝系统
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-11-01 DOI: 10.5104/jiep.26.657
Ryojiro Tominaga
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引用次数: 0
投稿規定 投稿规定
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-11-01 DOI: 10.5104/jiep.26.i71
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引用次数: 0
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