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マイクロエレクトロニクスシンポジウム(MES) 2023 セッションサマリー 2023微电子学研讨会(MES)
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-11-01 DOI: 10.5104/jiep.26.680
{"title":"マイクロエレクトロニクスシンポジウム(MES) 2023 セッションサマリー","authors":"","doi":"10.5104/jiep.26.680","DOIUrl":"https://doi.org/10.5104/jiep.26.680","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135215916","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
3D-IC のテスト技術 3d - ic测试技术
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-11-01 DOI: 10.5104/jiep.26.669
Hiroyuki Yotsuyanagi
{"title":"3D-IC のテスト技術","authors":"Hiroyuki Yotsuyanagi","doi":"10.5104/jiep.26.669","DOIUrl":"https://doi.org/10.5104/jiep.26.669","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":"358 2","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135216452","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
東京工業大学物質理工学院材料系北本研究室 東京工業大学物質理工学院材料系北本研究室
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-11-01 DOI: 10.5104/jiep.26.675
Yoshitaka Kitamoto
{"title":"東京工業大学物質理工学院材料系北本研究室","authors":"Yoshitaka Kitamoto","doi":"10.5104/jiep.26.675","DOIUrl":"https://doi.org/10.5104/jiep.26.675","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":"257 2","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135217829","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Activities of IS (International Standards) for Device Embedded Substrate (2) 器件嵌入式衬底IS(国际标准)的活动(2)
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-11-01 DOI: 10.5104/jiep.26.663
Yoshihisa Katoh
{"title":"Activities of IS (International Standards) for Device Embedded Substrate (2)","authors":"Yoshihisa Katoh","doi":"10.5104/jiep.26.663","DOIUrl":"https://doi.org/10.5104/jiep.26.663","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":"55 4","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135162073","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
エレクトロニクス実装学会誌Vol. 26総目次 电子封装学会杂志Vol. 26总目录
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-11-01 DOI: 10.5104/jiep.26.677
{"title":"エレクトロニクス実装学会誌Vol. 26総目次","authors":"","doi":"10.5104/jiep.26.677","DOIUrl":"https://doi.org/10.5104/jiep.26.677","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":"50 3","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135161237","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
特集に寄せて 寄来特辑
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-11-01 DOI: 10.5104/jiep.26.633
Koji Ikawa
{"title":"特集に寄せて","authors":"Koji Ikawa","doi":"10.5104/jiep.26.633","DOIUrl":"https://doi.org/10.5104/jiep.26.633","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":"48 6","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135161728","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Thermal Packaging Technology Research and Energy Conversion 热封装技术研究与能量转换
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-09-01 DOI: 10.5104/jiep.26.569
K. Yazawa
{"title":"Thermal Packaging Technology Research and Energy Conversion","authors":"K. Yazawa","doi":"10.5104/jiep.26.569","DOIUrl":"https://doi.org/10.5104/jiep.26.569","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"41528583","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IBM T.J. Watson Research Centerでの三次元チップレット集積化技術開発への挑戦 IBM T.J. Watson Research Center开发三维芯片集成化技术的挑战
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-09-01 DOI: 10.5104/jiep.26.538
Katsuyuki Sakuma
{"title":"IBM T.J. Watson Research Centerでの三次元チップレット集積化技術開発への挑戦","authors":"Katsuyuki Sakuma","doi":"10.5104/jiep.26.538","DOIUrl":"https://doi.org/10.5104/jiep.26.538","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"44859659","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
変遷がくれたキャリアの道筋：国と分野を跨いで 变迁带来的职业发展路径:跨国家跨领域
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-09-01 DOI: 10.5104/jiep.26.586
Yuya Suzuki
{"title":"変遷がくれたキャリアの道筋：国と分野を跨いで","authors":"Yuya Suzuki","doi":"10.5104/jiep.26.586","DOIUrl":"https://doi.org/10.5104/jiep.26.586","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"42056885","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Contents (in English) 内容(英文)
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-09-01 DOI: 10.5104/jiep.26.c62
{"title":"Contents (in English)","authors":"","doi":"10.5104/jiep.26.c62","DOIUrl":"https://doi.org/10.5104/jiep.26.c62","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"136309696","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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