发布求助
文献互助 智能选刊 最新文献

Journal of Japan Institute of Electronics Packaging最新文献

筛选
英文 中文
一般社団法人エレクトロニクス実装学会 2022年度表彰 一般社团法人电子封装学会2022年度表彰
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-09-01 DOI: 10.5104/jiep.26.618
{"title":"一般社団法人エレクトロニクス実装学会 2022年度表彰","authors":"","doi":"10.5104/jiep.26.618","DOIUrl":"https://doi.org/10.5104/jiep.26.618","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":"71 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"136309699","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Activity Report of International Standard Setting Organization 国际标准制定组织活动报告
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-09-01 DOI: 10.5104/jiep.26.530
Tiger Ninomiya
{"title":"Activity Report of International Standard Setting Organization","authors":"Tiger Ninomiya","doi":"10.5104/jiep.26.530","DOIUrl":"https://doi.org/10.5104/jiep.26.530","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"45114204","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
学会新役員のご紹介 学会新董事的介绍
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-09-01 DOI: 10.5104/jiep.26.628
{"title":"学会新役員のご紹介","authors":"","doi":"10.5104/jiep.26.628","DOIUrl":"https://doi.org/10.5104/jiep.26.628","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"136354928","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Shimoi Laboratory, Electrical and Electronic Engineering, Faculty of Engineering, Tohoku Institute of Technology 东北工业大学工程学院电气与电子工程Shimoi实验室
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-09-01 DOI: 10.5104/jiep.26.613
Shimoike Norihiro
{"title":"Shimoi Laboratory, Electrical and Electronic Engineering, Faculty of Engineering, Tohoku Institute of Technology","authors":"Shimoike Norihiro","doi":"10.5104/jiep.26.613","DOIUrl":"https://doi.org/10.5104/jiep.26.613","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"42673874","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
エレクトロニクス実装学会との出会い 与电子封装学会的相遇
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-09-01 DOI: 10.5104/jiep.26.p6
Y. Ikeda
{"title":"エレクトロニクス実装学会との出会い","authors":"Y. Ikeda","doi":"10.5104/jiep.26.p6","DOIUrl":"https://doi.org/10.5104/jiep.26.p6","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"44321961","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
投稿規定 投稿规定
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-09-01 DOI: 10.5104/jiep.26.i61
{"title":"投稿規定","authors":"","doi":"10.5104/jiep.26.i61","DOIUrl":"https://doi.org/10.5104/jiep.26.i61","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"48685155","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Features of Packaging Technology of IGBT Modules Applied to Renewable Energy and New Energy Vehicles in the Chinese Market 中国市场应用于可再生能源和新能源汽车的IGBT模块封装技术特点
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-09-01 DOI: 10.5104/jiep.26.526
Kenichiroh Sato
{"title":"Features of Packaging Technology of IGBT Modules Applied to Renewable Energy and New Energy Vehicles in the Chinese Market","authors":"Kenichiroh Sato","doi":"10.5104/jiep.26.526","DOIUrl":"https://doi.org/10.5104/jiep.26.526","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"41500813","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Jisso Festa Kansai 2023 Report Jisso Festa关西2023报告
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-09-01 DOI: 10.5104/jiep.26.616
{"title":"Jisso Festa Kansai 2023 Report","authors":"","doi":"10.5104/jiep.26.616","DOIUrl":"https://doi.org/10.5104/jiep.26.616","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"42127719","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
特集に寄せて 寄来特辑
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-09-01 DOI: 10.5104/jiep.26.525
Takafumi Fukushima
{"title":"特集に寄せて","authors":"Takafumi Fukushima","doi":"10.5104/jiep.26.525","DOIUrl":"https://doi.org/10.5104/jiep.26.525","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"45476231","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
ミッションフェローの広場 教会广场
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-09-01 DOI: 10.5104/jiep.26.614
{"title":"ミッションフェローの広場","authors":"","doi":"10.5104/jiep.26.614","DOIUrl":"https://doi.org/10.5104/jiep.26.614","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"136309694","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
首页 上一页 下一页 尾页
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们：info@booksci.cn Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号：481959085
Book学术官方微信