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学術機関と企業の共同パッケージで新しい世界は作れるのか 学术机构和企业的联合包装能创造新世界吗?
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-09-01 DOI: 10.5104/jiep.26.582
Atom O. Watanabe
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引用次数: 0
Advanced Molding Solutions for WLP/PLP Scaling Packages 先进的成型解决方案的WLP/PLP缩放封装
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-09-01 DOI: 10.5104/jiep.26.606
Yuichi Kajikawa
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引用次数: 0
新規穴あき銅格子を用いたリターディングフィールドアナライザーの研究開発 使用新型孔隙铜晶格的重定向场分析仪的研究开发
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-09-01 DOI: 10.5104/jiep.26.561
Jun Mizuno, Alaric Yohei Kawai, Tomohiro Matsushita, Mami N. Fujii
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引用次数: 0
北欧フィンランドから最先端実装技術へのチャレンジと成功体験～異文化・女性というダイバーシティ環境にて～ 从北欧芬兰到最尖端安装技术的挑战和成功体验~在异文化·女性的多样性环境中~
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-09-01 DOI: 10.5104/jiep.26.551
A. Gädda
{"title":"北欧フィンランドから最先端実装技術へのチャレンジと成功体験～異文化・女性というダイバーシティ環境にて～","authors":"A. Gädda","doi":"10.5104/jiep.26.551","DOIUrl":"https://doi.org/10.5104/jiep.26.551","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"47712246","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
アメリカ合衆国 半導体業界での第二の人生 美国半导体行业的第二人生
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-09-01 DOI: 10.5104/jiep.26.534
Masako Kodera
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引用次数: 0
What I Think after 25 Years of Working for an American Semiconductor Company 在美国半导体公司工作25年后的感想
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-09-01 DOI: 10.5104/jiep.26.544
Tadashi Kamewada
{"title":"What I Think after 25 Years of Working for an American Semiconductor Company","authors":"Tadashi Kamewada","doi":"10.5104/jiep.26.544","DOIUrl":"https://doi.org/10.5104/jiep.26.544","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"45688092","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
超高速光サブアセンブリ技術 超高速光子组件技术
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-09-01 DOI: 10.5104/jiep.26.590
N. Ohata, M. Shirao, Y. Kamo, Tadayoshi Hata, Y. Morita, T. Yamatoya, Nobuyuki Yasui, Eitaro Ishimura
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引用次数: 0
One Japanese PhD Student in imec, Belgium 比利时imec的一名日本博士生
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-09-01 DOI: 10.5104/jiep.26.577
F. Nagano
{"title":"One Japanese PhD Student in imec, Belgium","authors":"F. Nagano","doi":"10.5104/jiep.26.577","DOIUrl":"https://doi.org/10.5104/jiep.26.577","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"44812163","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
目次 目次
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-09-01 DOI: 10.5104/jiep.26.c61
{"title":"目次","authors":"","doi":"10.5104/jiep.26.c61","DOIUrl":"https://doi.org/10.5104/jiep.26.c61","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"48886678","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
30 Years Life in Asia+ with Electronics Packaging Technology 30年亚洲生活+电子封装技术
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-09-01 DOI: 10.5104/jiep.26.556
T. Onishi
{"title":"30 Years Life in Asia+ with Electronics Packaging Technology","authors":"T. Onishi","doi":"10.5104/jiep.26.556","DOIUrl":"https://doi.org/10.5104/jiep.26.556","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"48051835","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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