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IBM T.J. Watson Research Centerでの三次元チップレット集積化技術開発への挑戦

Q4 Engineering
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-09-01 DOI:10.5104/jiep.26.538
Katsuyuki Sakuma
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IBM T.J. Watson Research Center开发三维芯片集成化技术的挑战
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来源期刊
Journal of Japan Institute of Electronics Packaging
Journal of Japan Institute of Electronics Packaging Engineering-Electrical and Electronic Engineering
CiteScore
0.10
自引率
0.00%
发文量
165
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