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Points to Consider in Measuring Thermal Conductivity of Heat-Dissipating Materials 测量散热材料导热系数应注意的问题
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-08-01 DOI: 10.5104/jiep.26.420
S. Miyake, Tetsuya Ohtsuki, Kimihito Hatori
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引用次数: 0
物流のトレーサビリティを担保するナノ構造体 保证物流可追溯性的纳米结构体
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-08-01 DOI: 10.5104/jiep.26.506
Takao Fukuoka, Toshiya Yasunaga, Akinobu Yamaguchi
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引用次数: 0
Jisso Technology, Connecting New Functions, Connecting New People 吉索科技，连接新功能，连接新人群
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-08-01 DOI: 10.5104/jiep.26.p5
S. Yamamichi
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引用次数: 0
半導体デバイス基板と高熱伝導率材料の直接接合技術について 关于半导体器件基板与高热传导率材料直接接合技术
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-08-01 DOI: 10.5104/jiep.26.441
T. Matsumae, Hitoshi Umezawa, Y. Kurashima, H. Takagi
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引用次数: 0
Non-Contact Electrical Semiconductor Inspection Technology in Micro Areas Using Photoelectron Beams from Semiconductor Photocathodes 利用半导体光电阴极光电子束的微区域非接触电半导体检测技术
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-08-01 DOI: 10.5104/jiep.26.460
T. Nishitani
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引用次数: 0
ニュースバルにおけるX線リソグラフィー微細加工 纽斯巴鲁的X射线光刻显微加工
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-08-01 DOI: 10.5104/jiep.26.483
Shota Amano
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引用次数: 0
Establishment of “JOINT2” Consortium for Next Generation Semiconductor Package Evaluation and Development of Packaging Technology 成立“JOINT2”新一代半导体封装评估与封装技术开发联盟
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-07-01 DOI: 10.5104/jiep.26.367
Keiko Ueno, Sadaaki Katoh
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引用次数: 0
R&D of 3D-IC Technology for System Integration 用于系统集成的3D-IC技术的研发
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-07-01 DOI: 10.5104/jiep.26.326
K. Kikuchi
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引用次数: 0
Contents (in English) 内容(英文)
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-07-01 DOI: 10.5104/jiep.26.c42
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引用次数: 0
チップレットの概念と3D-ICのラピッドプロトタイピング 芯片概念与3d - ic快速成型
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-07-01 DOI: 10.5104/jiep.26.333
Takafumi Fukushima
{"title":"チップレットの概念と3D-ICのラピッドプロトタイピング","authors":"Takafumi Fukushima","doi":"10.5104/jiep.26.333","DOIUrl":"https://doi.org/10.5104/jiep.26.333","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"43913136","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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