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ウェハ接合界面における水分の影響 水分在晶片接合界面上的影响
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-08-01 DOI: 10.5104/jiep.26.434
Kai Takeuchi
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引用次数: 0
あいちシンクロトロン光センター２次元X線照射ビームラインBL8S2の現状 爱地同步加速器光中心二维X射线照射光束线BL8S2的现状
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-08-01 DOI: 10.5104/jiep.26.477
I. Sakurai, Kenji Hanada
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引用次数: 0
投稿規定 投稿规定
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-08-01 DOI: 10.5104/jiep.26.i51
{"title":"投稿規定","authors":"","doi":"10.5104/jiep.26.i51","DOIUrl":"https://doi.org/10.5104/jiep.26.i51","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135931064","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Trends and Challenges in Wide-Band-Gap Power Semiconductors Packaging 宽带隙功率半导体封装的趋势与挑战
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-08-01 DOI: 10.5104/jiep.26.454
Castellazzi Alberto
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引用次数: 0
（扉のページ） (扉页)
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-08-01 DOI: 10.5104/jiep.26.411
{"title":"（扉のページ）","authors":"","doi":"10.5104/jiep.26.411","DOIUrl":"https://doi.org/10.5104/jiep.26.411","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"43937133","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
大電力密度パワーモジュールの実現へ向けた銀焼成接合劣化メカニズムの理解 面向实现大功率密度功率模块的银烧结劣化机制的理解
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-08-01 DOI: 10.5104/jiep.26.448
K. Wakamoto
{"title":"大電力密度パワーモジュールの実現へ向けた銀焼成接合劣化メカニズムの理解","authors":"K. Wakamoto","doi":"10.5104/jiep.26.448","DOIUrl":"https://doi.org/10.5104/jiep.26.448","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"44721473","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Self-Propagating Exothermic Function in Metallic Multilayered Films and Its Reactive Bonding Applications 金属多层膜中的自传播放热函数及其反应键合应用
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-08-01 DOI: 10.5104/jiep.26.413
T. Namazu
{"title":"Self-Propagating Exothermic Function in Metallic Multilayered Films and Its Reactive Bonding Applications","authors":"T. Namazu","doi":"10.5104/jiep.26.413","DOIUrl":"https://doi.org/10.5104/jiep.26.413","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"48108133","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
分子センシング・マイクロ化学システムの創製と応用 分子传感微化学系统的创制与应用
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-08-01 DOI: 10.5104/jiep.26.488
Akinobu Yamaguchi
{"title":"分子センシング・マイクロ化学システムの創製と応用","authors":"Akinobu Yamaguchi","doi":"10.5104/jiep.26.488","DOIUrl":"https://doi.org/10.5104/jiep.26.488","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"43114712","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
酸化応答性水透過膜の作製 酸化应答性水透过膜の作制
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-08-01 DOI: 10.5104/jiep.26.502
Kaito Tani, Kenji Iimura, S. Yusa
{"title":"酸化応答性水透過膜の作製","authors":"Kaito Tani, Kenji Iimura, S. Yusa","doi":"10.5104/jiep.26.502","DOIUrl":"https://doi.org/10.5104/jiep.26.502","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"45874540","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
ICEP2023セッションサマリー ICEP2023会话摘要
Journal of Japan Institute of Electronics Packaging Pub Date : 2023-08-01 DOI: 10.5104/jiep.26.516
{"title":"ICEP2023セッションサマリー","authors":"","doi":"10.5104/jiep.26.516","DOIUrl":"https://doi.org/10.5104/jiep.26.516","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":" ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"42402448","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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