2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)最新文献_第3页

A fast and precise eye-diagram estimation method for a channel of a pair of differential microstrip lines on PCB with arbitrary terminations 一种快速精确的任意端部PCB差分微带线通道眼图估计方法

2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) Pub Date : 2009-12-01 DOI: 10.1109/EDAPS.2009.5403987

Jeonghyeon Cho, Eakhwan Song, J. Shim, Yujeong Shim, Joungho Kim

引用次数: 3

A package pin-block planner considering chip-package interconnects optimization 考虑芯片封装互连优化的封装引脚块规划

2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) Pub Date : 2009-12-01 DOI: 10.1109/EDAPS.2009.5404013

R. Lee, Hung-Ming Chen

引用次数: 0

A thin film thermoelectric cooler for chip-on-board direct assembly 一种用于片上直接组装的薄膜热电冷却器

2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) Pub Date : 2009-12-01 DOI: 10.1109/EDAPS.2009.5403990

Hyunju Lee, Soonseo Park, Sung-Kyo Cho, Hyojong Kim, Shiho Kim

引用次数: 3

Modeling and analysis of electromagnetic bandgap structures on power distribution network 配电网电磁带隙结构的建模与分析

2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) Pub Date : 2009-12-01 DOI: 10.1109/EDAPS.2009.5403992

Sang-Gyu Kim, H. Kim, Hee-Do Kang, J. Yook

引用次数: 1

Extended analysis of SSN effect on phase-locked loop (PLL) circuit SSN对锁相环(PLL)电路影响的扩展分析

2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) Pub Date : 2009-12-01 DOI: 10.1109/EDAPS.2009.5404005

J. Kho, C. I. Loh, Wui Hung Moo, C. Fong, M. Wong

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引用次数: 3

Filter integration in ultra thin organic substrate via 3D stitched capacitor 在超薄有机衬底上通过3D缝合电容器集成滤波器

2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) Pub Date : 2009-12-01 DOI: 10.1109/EDAPS.2009.5404004

S. Min, Seunghyun Hwang, Daehyun Chung, M. Swaminathan, V. Sridharan, H. Chan, Fuhan Liu, V. Sundaram, R. Tummala

引用次数: 9

Power distribution network co-simulation for cost-effective system design 配电网协同仿真技术在系统设计中的应用

2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) Pub Date : 2009-12-01 DOI: 10.1109/EDAPS.2009.5403995

J. Hsu, Jack Lin, Tung-Yang Chen, Wei-Da Guo, Sam Yang, R. Lee

引用次数: 2

IRDrop analysis in power delivery network design 输电网设计中的IRDrop分析

2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) Pub Date : 2009-12-01 DOI: 10.1109/EDAPS.2009.5403974

W. Dai

引用次数: 1

Investigation of the gyro-resonance region modes by using the MoM for plasma column loaded cylindrical waveguide 等离子体柱载圆柱波导陀螺共振区模的MoM研究

2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) Pub Date : 2009-12-01 DOI: 10.1109/EDAPS.2009.5403978

E. Kelebekler

引用次数: 3

A new FDTD algorithm based on alternating-direction explicit method 一种基于交替方向显式法的时域有限差分新算法

2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) Pub Date : 2009-12-01 DOI: 10.1109/EDAPS.2009.5404012

M. Unno, S. Aono, H. Asai

引用次数: 1