S. Min, Seunghyun Hwang, Daehyun Chung, M. Swaminathan, V. Sridharan, H. Chan, Fuhan Liu, V. Sundaram, R. Tummala
{"title":"在超薄有机衬底上通过3D缝合电容器集成滤波器","authors":"S. Min, Seunghyun Hwang, Daehyun Chung, M. Swaminathan, V. Sridharan, H. Chan, Fuhan Liu, V. Sundaram, R. Tummala","doi":"10.1109/EDAPS.2009.5404004","DOIUrl":null,"url":null,"abstract":"This paper presents filters integrated in ultra thin multilayer organic substrate using 3D stitched capacitor alleviating shunt parasitics and providing tunable capacitors. Insertion loss of less than 2.2dB, return loss of greater than 15dB at 2.4 GHz and attenuation of greater than 30dB below 2.0 GHz and at 4.7 GHz were measured. The measured results showed good agreement with simulated results. This paper demonstrated 2.4 GHz bandpass filters with size of 2.2mm × 3.0mm × 0.2mm (1.2mm3) in ultra thin organic RXP substrate.","PeriodicalId":370741,"journal":{"name":"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","volume":"81 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"Filter integration in ultra thin organic substrate via 3D stitched capacitor\",\"authors\":\"S. Min, Seunghyun Hwang, Daehyun Chung, M. Swaminathan, V. Sridharan, H. Chan, Fuhan Liu, V. Sundaram, R. Tummala\",\"doi\":\"10.1109/EDAPS.2009.5404004\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents filters integrated in ultra thin multilayer organic substrate using 3D stitched capacitor alleviating shunt parasitics and providing tunable capacitors. Insertion loss of less than 2.2dB, return loss of greater than 15dB at 2.4 GHz and attenuation of greater than 30dB below 2.0 GHz and at 4.7 GHz were measured. The measured results showed good agreement with simulated results. This paper demonstrated 2.4 GHz bandpass filters with size of 2.2mm × 3.0mm × 0.2mm (1.2mm3) in ultra thin organic RXP substrate.\",\"PeriodicalId\":370741,\"journal\":{\"name\":\"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)\",\"volume\":\"81 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDAPS.2009.5404004\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS.2009.5404004","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Filter integration in ultra thin organic substrate via 3D stitched capacitor
This paper presents filters integrated in ultra thin multilayer organic substrate using 3D stitched capacitor alleviating shunt parasitics and providing tunable capacitors. Insertion loss of less than 2.2dB, return loss of greater than 15dB at 2.4 GHz and attenuation of greater than 30dB below 2.0 GHz and at 4.7 GHz were measured. The measured results showed good agreement with simulated results. This paper demonstrated 2.4 GHz bandpass filters with size of 2.2mm × 3.0mm × 0.2mm (1.2mm3) in ultra thin organic RXP substrate.
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