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2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)最新文献

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Near zero SSN power delivery networks using Constant Voltage Power Transmission Lines 使用恒压输电线路的近零SSN电力输送网络
2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) Pub Date : 2009-12-01 DOI: 10.1109/EDAPS.2009.5403994
S. Huh, Daehyun Chung, M. Swaminathan
{"title":"Near zero SSN power delivery networks using Constant Voltage Power Transmission Lines","authors":"S. Huh, Daehyun Chung, M. Swaminathan","doi":"10.1109/EDAPS.2009.5403994","DOIUrl":"https://doi.org/10.1109/EDAPS.2009.5403994","url":null,"abstract":"To control SSN in the power delivery network, providing power through transmission line instead of voltage plane can lead to better performance. Several issues arise when the power transmission line is used in a real environment. Amongst them, a practical scheme presented in this paper focuses on supplying a stable voltage to the common power supply node of multiple I/Os switching simultaneously. The simulation results show that the newly suggested scheme generates power supply noise-free eye opening and consumes almost the same amount of power as the conventional power plane scheme.","PeriodicalId":370741,"journal":{"name":"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130922565","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Signal transmission analysis of carbon nanotube bundle interconnects 碳纳米管束互连的信号传输分析
2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) Pub Date : 2009-12-01 DOI: 10.1109/EDAPS.2009.5404001
Jiang-Peng Cui, W. Yin
{"title":"Signal transmission analysis of carbon nanotube bundle interconnects","authors":"Jiang-Peng Cui, W. Yin","doi":"10.1109/EDAPS.2009.5404001","DOIUrl":"https://doi.org/10.1109/EDAPS.2009.5404001","url":null,"abstract":"According to the derived transfer function using different orders of approximation, stability and signal transmission analysis of a driven metallic single-walled carbon nanotube (SWCNT) bundle interconnect are performed in the present study. It is shown that as the length of SWCNT bundle interconnect increases, the poles will be closer to the imaginary axis, which causes the transmitted signal response tends to be more damping. Using the fourth-order approximation of the transfer function, the transmitted pulse waveform along the SWCNT bundle interconnect is captured accurately, with signal overshoot and time delay examined in detail.","PeriodicalId":370741,"journal":{"name":"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","volume":"64 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132782098","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Simulation of human head exposed to handset using hybrid NFM/MoM techniques 使用混合NFM/MoM技术模拟暴露于手机的人类头部
2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) Pub Date : 2009-12-01 DOI: 10.1109/EDAPS.2009.5403971
Lei Zhao, Ke-Li Wu
{"title":"Simulation of human head exposed to handset using hybrid NFM/MoM techniques","authors":"Lei Zhao, Ke-Li Wu","doi":"10.1109/EDAPS.2009.5403971","DOIUrl":"https://doi.org/10.1109/EDAPS.2009.5403971","url":null,"abstract":"The head of the user of a mobile telephone is modeled by a two-layered prolate excited by the near field of a patch antenna. A hybrid Null field method / Method of moments (NFM/MoM) numerical method is investigated in this paper. NFM is used to solve the scattering problem from the head model, and the MoM using the Rao-Wilton Glisson (RWG) basis functions is applied to model the dipole antenna by distributing a voltage source on a virtual surface lying inside the antenna physical surface, in which the delta-function generator is used to model the feed point. The coupling between the head model and a finite-length dipole antenna is considered by an iteration procedure. The accuracy and efficiency of the proposed algorithm are verified by comparing numerical results with other available data.","PeriodicalId":370741,"journal":{"name":"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","volume":"87 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114381223","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A novel power plane topology for wideband suppression of simultaneous switching noise and fast computational method 一种用于宽带同时开关噪声抑制的新型功率平面拓扑和快速计算方法
2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) Pub Date : 2009-12-01 DOI: 10.1109/EDAPS.2009.5403991
Hee-Do Kang, H. Kim, Sang-Gyu Kim, J. Yook
{"title":"A novel power plane topology for wideband suppression of simultaneous switching noise and fast computational method","authors":"Hee-Do Kang, H. Kim, Sang-Gyu Kim, J. Yook","doi":"10.1109/EDAPS.2009.5403991","DOIUrl":"https://doi.org/10.1109/EDAPS.2009.5403991","url":null,"abstract":"Using spiral resonator mounted on a power plane, simultaneous switching noise and ground bouncing noise can be suppressed through very wideband from 0.22 GHz to 12.5 GHz under noise suppression margin of −25 dB. The area of diameter of 3.2 mm is necessary for the resonator, and is comparable to a clearance pad size, diameter of 3.0 mm, in a ground/power plane. Hence the small size makes discontinuity of return current path reduces, therefore the signal integrity problem of an electromagnetic bandgap structure can be improved. For the analysis of modeling, the effects of inductance and capacitance in the spiral resonator are analyzed. As a result, suppression bandwidth and resonance frequency can be easily controlled by arm length and gap of spiral. Moreover, by applying 2 different sizes of resonators on top and bottom of power via, it is identified that multi-resonance effect is also obtained. Finally, it is shown that computational time can be dramatically decreased using both transmission line method and three-dimensional electromagnetic (3D EM) simulation instead of only 3D EM simulation for analysis.","PeriodicalId":370741,"journal":{"name":"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130285671","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Multi-physics characterization of through silicon vias (TSV) in the presence of a periodic EMP 周期性电磁脉冲存在下硅通孔(TSV)的多物理场特性
2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) Pub Date : 2009-12-01 DOI: 10.1109/EDAPS.2009.5404006
Xiao-Peng Wang, W. Yin
{"title":"Multi-physics characterization of through silicon vias (TSV) in the presence of a periodic EMP","authors":"Xiao-Peng Wang, W. Yin","doi":"10.1109/EDAPS.2009.5404006","DOIUrl":"https://doi.org/10.1109/EDAPS.2009.5404006","url":null,"abstract":"Multi-physics characterization of multi-layered stacked through silicon vias (TSVs) is performed based on the hybrid time-domain finite element method (FEM), with most temperature-dependent material parameters treated appropriately. Using our developed algorithm, numerical computation is carried out so as to capture transient electro-thermo-mechanical responses of different TSV geometries injected by a periodic EMP, where the effects of thermal accumulation and induced thermal stress are predicted accurately and analyzed in detail. The provided information will be useful for us to enhance TSV reliability.","PeriodicalId":370741,"journal":{"name":"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130451078","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Design rules to optimise the layout of the multilayer circuit packages at 60GHz 优化60GHz多层电路封装布局的设计规则
2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) Pub Date : 2009-12-01 DOI: 10.1109/EDAPS.2009.5404018
A. Abeygunasekera, C. Free
{"title":"Design rules to optimise the layout of the multilayer circuit packages at 60GHz","authors":"A. Abeygunasekera, C. Free","doi":"10.1109/EDAPS.2009.5404018","DOIUrl":"https://doi.org/10.1109/EDAPS.2009.5404018","url":null,"abstract":"New practical design data have been obtained relating to the effects of coupling between conductors in highly integrated, multilayer circuits working at millimeter-wave frequencies. Data has been obtained on various cross-over and coupled line structures at 60GHz. The practical circuits were fabricated using photoimageable thick-film technology. Design rules have been developed to provide guidance to the circuit designer on the minimum spacing between conductors in a multilayer package, thus achieving an optimum compromise between good isolation and minimum package size.","PeriodicalId":370741,"journal":{"name":"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128187865","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
GPGPU-based Latency Insertion Method: Application to PDN simulations 基于gpgpu的延迟插入方法:在PDN仿真中的应用
2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) Pub Date : 2009-12-01 DOI: 10.1109/EDAPS.2009.5403996
Y. Inoue, T. Sekine, H. Asai
{"title":"GPGPU-based Latency Insertion Method: Application to PDN simulations","authors":"Y. Inoue, T. Sekine, H. Asai","doi":"10.1109/EDAPS.2009.5403996","DOIUrl":"https://doi.org/10.1109/EDAPS.2009.5403996","url":null,"abstract":"With the progress of high-density integration technology of the circuits, a variety of signal and power integrity problems have become serious and important for the electronic design. This paper describes the fast circuit simulation by GPGPU-LIM (GPGPU-based Latency Insertion Method). First, LIM is reviewed, which is a fast algorithm. Next, implementation of LIM on the general purpose computing on graphic processing unit (GPGPU) is shown. Furthermore, this method is applied to the simulation of power distribution networks (PDNs). Finally, it is confirmed that GPGPU-based LIM is very practical and efficient for the large-scale PDN simulations.","PeriodicalId":370741,"journal":{"name":"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126806256","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
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