周期性电磁脉冲存在下硅通孔(TSV)的多物理场特性

Xiao-Peng Wang, W. Yin
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引用次数: 1

摘要

基于混合时域有限元法(FEM)对多层硅通孔堆积材料的多物理场特性进行了研究,并对大多数与温度相关的材料参数进行了适当的处理。利用本文提出的算法,对周期性EMP注入不同形状TSV的瞬态电-热-机械响应进行了数值计算,准确预测了热积累和诱发热应力的影响,并对其进行了详细分析。提供的信息将有助于我们提高TSV的可靠性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Multi-physics characterization of through silicon vias (TSV) in the presence of a periodic EMP
Multi-physics characterization of multi-layered stacked through silicon vias (TSVs) is performed based on the hybrid time-domain finite element method (FEM), with most temperature-dependent material parameters treated appropriately. Using our developed algorithm, numerical computation is carried out so as to capture transient electro-thermo-mechanical responses of different TSV geometries injected by a periodic EMP, where the effects of thermal accumulation and induced thermal stress are predicted accurately and analyzed in detail. The provided information will be useful for us to enhance TSV reliability.
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