{"title":"周期性电磁脉冲存在下硅通孔(TSV)的多物理场特性","authors":"Xiao-Peng Wang, W. Yin","doi":"10.1109/EDAPS.2009.5404006","DOIUrl":null,"url":null,"abstract":"Multi-physics characterization of multi-layered stacked through silicon vias (TSVs) is performed based on the hybrid time-domain finite element method (FEM), with most temperature-dependent material parameters treated appropriately. Using our developed algorithm, numerical computation is carried out so as to capture transient electro-thermo-mechanical responses of different TSV geometries injected by a periodic EMP, where the effects of thermal accumulation and induced thermal stress are predicted accurately and analyzed in detail. The provided information will be useful for us to enhance TSV reliability.","PeriodicalId":370741,"journal":{"name":"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Multi-physics characterization of through silicon vias (TSV) in the presence of a periodic EMP\",\"authors\":\"Xiao-Peng Wang, W. Yin\",\"doi\":\"10.1109/EDAPS.2009.5404006\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Multi-physics characterization of multi-layered stacked through silicon vias (TSVs) is performed based on the hybrid time-domain finite element method (FEM), with most temperature-dependent material parameters treated appropriately. Using our developed algorithm, numerical computation is carried out so as to capture transient electro-thermo-mechanical responses of different TSV geometries injected by a periodic EMP, where the effects of thermal accumulation and induced thermal stress are predicted accurately and analyzed in detail. The provided information will be useful for us to enhance TSV reliability.\",\"PeriodicalId\":370741,\"journal\":{\"name\":\"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)\",\"volume\":\"49 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDAPS.2009.5404006\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS.2009.5404006","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Multi-physics characterization of through silicon vias (TSV) in the presence of a periodic EMP
Multi-physics characterization of multi-layered stacked through silicon vias (TSVs) is performed based on the hybrid time-domain finite element method (FEM), with most temperature-dependent material parameters treated appropriately. Using our developed algorithm, numerical computation is carried out so as to capture transient electro-thermo-mechanical responses of different TSV geometries injected by a periodic EMP, where the effects of thermal accumulation and induced thermal stress are predicted accurately and analyzed in detail. The provided information will be useful for us to enhance TSV reliability.