19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)最新文献_第2页

Influence of different characterization parameters on the accuracy of LED board thermal models for retrofit bulbs 不同表征参数对改造灯泡LED板热模型精度的影响

19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2013-12-02 DOI: 10.1109/THERMINIC.2013.6675207

X. Jordà, X. Perpiñà, M. Vellvehí, W. Hertog, M. Peralvarez, J. Carreras

引用次数: 7

Fabrication and characterization of a metal matrix polymer fibre composite for thermal interface material applications 热界面材料用金属基聚合物纤维复合材料的制备与表征

19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2013-12-02 DOI: 10.1109/THERMINIC.2013.6675196

C. Zandén, Xin Luo, L. Ye, Johan Liu

{"title":"Fabrication and characterization of a metal matrix polymer fibre composite for thermal interface material applications","authors":"C. Zandén, Xin Luo, L. Ye, Johan Liu","doi":"10.1109/THERMINIC.2013.6675196","DOIUrl":"https://doi.org/10.1109/THERMINIC.2013.6675196","url":null,"abstract":"Dealing with increasing power densities in high performance micro- and power -electronics applications is continuously becoming more challenging. Many applications today need thermal interface materials (TIMs) that can offer significantly higher performance than what is currently available. One of the main challenges for TIMs is to combine material properties that result in the thermo-mechanical characteristics required. Solder TIMs can provide excellent thermal transport, but high stiffness, causing lack of sufficient thermal-mechanical decoupling, limits their applicability. To mitigate these issues we pursue the development of a composite metal matrix based TIM technology concept with potential to combine high thermal conductivity with low joint stiffness. In this work we optimize the fabrication of an indium matrix polyimide fibre composite and investigate its thermal performance as an interface material. The fabricated composite is shown to have high effective thermal conductivity (up to 22 W/mK) and result in low contact resistance (<;1 Kmm<;sup>2<;/sup>/W).","PeriodicalId":369128,"journal":{"name":"19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129775874","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7

Experimental investigation of uninterrupted and interrupted microchannel heat sinks 不间断和间断微通道散热器的实验研究

19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2013-12-02 DOI: 10.1109/THERMINIC.2013.6675195

Ayse Gozde Ulu Soysal, C. Sert, A. G. Yazicioglu

引用次数: 2

Nanoscale thermal transport and phonon dynamics in ultra-thin Si based nanostructures 超薄硅基纳米结构中的纳米尺度热输运和声子动力学

19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2013-12-02 DOI: 10.1109/THERMINIC.2013.6675218

M. R. Wagner, E. Chávez‐Ángel, J. Gomis-Bresco, J. Reparaz, A. Shchepetov, M. Prunnila, J. Ahopelto, F. Alzina, C. Sotomayor‐Torres

引用次数: 0

Electro-thermal co-design of chip-package-board systems 芯片封装板系统的电热协同设计

19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2013-12-02 DOI: 10.1109/THERMINIC.2013.6675192

C. Sohrmann, A. Heinig, Michael Dittrich, R. Jancke, P. Schneider

引用次数: 2

Thermal design of a high current circuit board for automotive applications 汽车用大电流电路板的热设计

19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2013-12-02 DOI: 10.1109/THERMINIC.2013.6675245

R. Mrossko, C. Neeb, T. Hofmann, A. Neumann, J. Keller

引用次数: 5

Development and fabrication of a thin film thermo test chip and its integration into a test system for thermal interface characterization 薄膜热测试芯片的研制及其集成到热界面表征测试系统中

19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2013-12-02 DOI: 10.1109/THERMINIC.2013.6675188

M. AboRas, G. Engelmann, D. May, M. Rothermund, R. Schacht, B. Wunderle, H. Oppermann, T. Winkler, S. Rzepka, B. Michel

{"title":"Development and fabrication of a thin film thermo test chip and its integration into a test system for thermal interface characterization","authors":"M. AboRas, G. Engelmann, D. May, M. Rothermund, R. Schacht, B. Wunderle, H. Oppermann, T. Winkler, S. Rzepka, B. Michel","doi":"10.1109/THERMINIC.2013.6675188","DOIUrl":"https://doi.org/10.1109/THERMINIC.2013.6675188","url":null,"abstract":"This paper deals with the development und fabrication of a thermal test chip (TTC) to be used for thermal characterisation and qualification of materials and packages. The TTC is designed as a modular chip with the smallest full functional chip cell of 3.2mm × 3.2mm and consists of a heater structure and a temperature sensor. The chips can be applied in any required matrix. Heater and temperature sensors are realised by a 70 nm single Titanium layer as adhesion and barrier layer. The Titanium is structured a on 670μm silicon wafer by the cost efficient thin film technology. 3×3 matrix chips have been sawn, assembled on a FR4 substrate by flip chip technology and integrated into a test stand for characterisation of thermal interface materials (TIMA Tester). The calibration curves of the temperature sensors show 4-time higher sensitivity then Si diodes. The homogeneity of the surface temperature was checked by the Lock-In infra-red thermography and compared with a commercial thermo test chip.","PeriodicalId":369128,"journal":{"name":"19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114165699","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Characterization and kinetic monitoring of the reactions between TixAly phases in Ti-Al based ohmic contacts on n-type GaN by Differential Scanning Calorimetry (DSC) 差示扫描量热法(DSC)表征n型GaN上Ti-Al基欧姆接触中tialy相间反应及动力学监测

19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2013-12-02 DOI: 10.1109/THERMINIC.2013.6675181

N. Thierry-Jebali, R. Chiriac, C. Brylinski

引用次数: 1

Multi-physics modelling for power electronics modules - Current status and future challenges 电力电子模块的多物理场建模——现状与未来挑战

19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2013-12-02 DOI: 10.1109/THERMINIC.2013.6675217

C. Bailey

引用次数: 4

Solder joint lifetime of rapid cycled LED components 快速循环LED元件的焊点寿命

19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2013-12-02 DOI: 10.1109/THERMINIC.2013.6675232

W. Luiten

{"title":"Solder joint lifetime of rapid cycled LED components","authors":"W. Luiten","doi":"10.1109/THERMINIC.2013.6675232","DOIUrl":"https://doi.org/10.1109/THERMINIC.2013.6675232","url":null,"abstract":"Solder joint reliability is one of the most important factors in the lifetime of electronic products. Typically solder joint lifetimes are expressed in numbers of cycles to failure, which are derived from accelerated temperature cycle tests. The extrapolation of test results from the test temperature range to the temperature range in operation is well known. In contrast, the effect of the time scale differences between the test and the operational condition is much more complicated and is often not taken into account. The present work addresses the effect of cycle-time on the solder fatigue. A 1D analytical model is made of a shear loaded solder joint, and a spreadsheet is used to calculate time dependent stress relaxation, including the highly nonlinear material behavior of lead free solder. The results are used to estimate safe engineering limits for lead free solder joints of LEDs driven in short time cycles typical for video signals in in a TV product. It is shown that above and below a certain threshold value the cycle time has no influence on the number of cycles to failure. When cycle times are very short, no solder creep occurs, and such cycles have no impact on the total number of cycles to failure. When cycles times are very long, solder creep occurs up to the stress free situation, and a maximum damage per cycle is incurred, corresponding to a minimum number of cycles to failure. Longer cycle times again do not impact this minimum number of cycles to failure. However when the cycle time allows for partial solder creep, the damage incurred in each cycle is less than the maximum and consequently the number of cycles to failure will be correspondingly higher, dependant on the cycle time.","PeriodicalId":369128,"journal":{"name":"19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128352107","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4