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19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)最新文献

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Stochastic thermal modeling by polynomial chaos expansion 基于多项式混沌展开的随机热建模
19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2013-09-01 DOI: 10.1109/THERMINIC.2013.6675234
L. Codecasa, L. Di Rienzo
{"title":"Stochastic thermal modeling by polynomial chaos expansion","authors":"L. Codecasa, L. Di Rienzo","doi":"10.1109/THERMINIC.2013.6675234","DOIUrl":"https://doi.org/10.1109/THERMINIC.2013.6675234","url":null,"abstract":"In this paper an effective approach is proposed for generating stochastic compact thermal models of electronics components and packages. The approach exhibits high levels of accuracy for very small state space dimensions of the model. It is also efficient since it requires the solution of few deterministic thermal problems in the frequency domain. The achieved stochastic compact models can be used to accurately determining not only the stochastic properties of junction temperatures but also of the whole spatio-temporal distribution of thermal variables within the electronics component or package, for all waveforms of injected powers.","PeriodicalId":369128,"journal":{"name":"19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"407 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133247486","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 14
Dynamic sub-compact model and global compact model reduction for multichip components 多芯片组件的动态子压缩模型和全局压缩模型简化
19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2013-09-01 DOI: 10.1109/THERMINIC.2013.6675190
C. Dia, E. Monier-Vinard, N. Laraqi, V. Bissuel, O. Daniel
{"title":"Dynamic sub-compact model and global compact model reduction for multichip components","authors":"C. Dia, E. Monier-Vinard, N. Laraqi, V. Bissuel, O. Daniel","doi":"10.1109/THERMINIC.2013.6675190","DOIUrl":"https://doi.org/10.1109/THERMINIC.2013.6675190","url":null,"abstract":"The trend at the level of electronic component is to gather several active chips inside the same enclosing package. The thriving development of this technology allows reducing the volume in space as well as shortening the interconnection between the elements of the device. In this article, we analyze two methods of reduction of a detailed representation of a component, embedding three chips. The first approach is based upon the sub-compact vision, which consists in generating thermal compact models of different pseudo parts and plugged them within the over-molding resin of the package. This one gives good results but the size of the deducted model remains large. The second way uses a global reduction process by generating a whole network at once by means of genetic algorithm and superposition principle. The predictions of the behavioral models are relevant, poorly dependant of boundary conditions but the number of mandatory fitting scenarios becomes quite significant as well as the parameters to be optimized.","PeriodicalId":369128,"journal":{"name":"19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"286 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121374356","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Thermal characterization of multichip structures 多芯片结构的热表征
19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2013-09-01 DOI: 10.1109/THERMINIC.2013.6675241
F. Ender, G. Hantos, D. Schweitzer, P. Szabó
{"title":"Thermal characterization of multichip structures","authors":"F. Ender, G. Hantos, D. Schweitzer, P. Szabó","doi":"10.1109/THERMINIC.2013.6675241","DOIUrl":"https://doi.org/10.1109/THERMINIC.2013.6675241","url":null,"abstract":"The advances in electronic packaging made it possible to encapsulate several independent semiconductor dice into a single package. In the last decade many packaging configurations are realized which range from the multichip modules to the 3D stack-die structures. Thermal aware design of such structures become complex, though. To understand the thermal behavior of multichip structure containing multiple dissipating elements placed on different dice, the couplings between individual dice have to be characterized. To determine their thermal transfer impedance matrix (TTIM) is a practical way to describe the thermal relations. In this paper we demonstrate the method utilized for TTIM measurements and also show how thermal surroundings (e.g. the PCB the chip is mounted on) affect the thermal relations inside the package. In addition, the temperature dependent non-linearity of the TTIMs is also described.","PeriodicalId":369128,"journal":{"name":"19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126914041","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
Low voltage fully integrated dc-dc converter for self-powered temperature sensors 用于自供电温度传感器的低压完全集成dc-dc转换器
19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 1900-01-01 DOI: 10.1109/THERMINIC.2013.6851795
W. P. Manula Randhika Pathirana, A. Muhtaroğlu
{"title":"Low voltage fully integrated dc-dc converter for self-powered temperature sensors","authors":"W. P. Manula Randhika Pathirana, A. Muhtaroğlu","doi":"10.1109/THERMINIC.2013.6851795","DOIUrl":"https://doi.org/10.1109/THERMINIC.2013.6851795","url":null,"abstract":"A low voltage fully integrated DC-DC converter with power management system is presented for self-powered temperature sensors. The proposed circuit uses 0.18 μm CMOS technology, and has been verified in simulations. The system can start up with input voltage as low as 0.17 V, and generates 1 V regulated output with 18% peak efficiency. Off-chip components or non-standards processes are avoided for fully standard CMOS integration in ultra-low voltage and low cost system-on-chip applications.","PeriodicalId":369128,"journal":{"name":"19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115705803","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Mean-time-to-crack model of microbump interconnect in FCGBA package under thermal cyclic test 热循环试验下FCGBA封装微碰撞互连的平均开裂时间模型
19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 1900-01-01 DOI: 10.1109/THERMINIC.2013.6675215
Chien-Chang Chen, Wei-Chen Wu, Ching-Yu Chin, Hung-Ming Chen, V. Lin, E. Chen
{"title":"Mean-time-to-crack model of microbump interconnect in FCGBA package under thermal cyclic test","authors":"Chien-Chang Chen, Wei-Chen Wu, Ching-Yu Chin, Hung-Ming Chen, V. Lin, E. Chen","doi":"10.1109/THERMINIC.2013.6675215","DOIUrl":"https://doi.org/10.1109/THERMINIC.2013.6675215","url":null,"abstract":"By employing the physical characteristics of creep deformation mechanisms for solder joints in a flip-chip ball grid array (FCBGA) package under a thermal cyclic condition, an analytical model for the prediction of mean-time-to-crack (MTTC) is presented in the paper. With the consideration of time-dependent thermal testing functionals, the basic co-analyses of one-cycle Nabarro-Herring and Coble creep rates and the corresponding damage accumulation functionals for the conventional eutectic Sn/Pb micro-solder material are studied using the proposed MTTC model theoretically. For experimentally validation of the MTTC model, a batch of devices filled with resin in FCGBA package had been tested under a -40°C~125°C thermal cyclic test with a period of 1-hour 1000 times. The MTTC model reveals that the solder bumps within the FCGBA can survive about 0.53 year under the cyclic testing circumstance. Under the room temperature, the device even can survive about 2.45 years under continuously operations.","PeriodicalId":369128,"journal":{"name":"19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126707836","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
In-situ measurements of material thermal parameters for accurate LED lamp thermal modelling 用于精确LED灯热建模的材料热参数的原位测量
19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 1900-01-01 DOI: 10.1109/THERMINIC.2013.6675206
M. Vellvehí, X. Perpiñà, X. Jordà, R. Werkhoven, J. Kunen, J. Jakovenko, P. Bancken, P. Bolt
{"title":"In-situ measurements of material thermal parameters for accurate LED lamp thermal modelling","authors":"M. Vellvehí, X. Perpiñà, X. Jordà, R. Werkhoven, J. Kunen, J. Jakovenko, P. Bancken, P. Bolt","doi":"10.1109/THERMINIC.2013.6675206","DOIUrl":"https://doi.org/10.1109/THERMINIC.2013.6675206","url":null,"abstract":"This work deals with the extraction of key thermal parameters for accurate thermal modelling of LED lamps: air exchange coefficient around the lamp, emissivity and thermal conductivity of all lamp parts. As a case study, an 8W retrofit lamp is presented. To assess simulation results, temperature is monitored on the lamp by infrared thermography and by monitoring specific locations with thermocouples. As a result, experimental and simulation results show differences below 15%.","PeriodicalId":369128,"journal":{"name":"19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130860846","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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