Stochastic thermal modeling by polynomial chaos expansion

Abstract

In this paper an effective approach is proposed for generating stochastic compact thermal models of electronics components and packages. The approach exhibits high levels of accuracy for very small state space dimensions of the model. It is also efficient since it requires the solution of few deterministic thermal problems in the frequency domain. The achieved stochastic compact models can be used to accurately determining not only the stochastic properties of junction temperatures but also of the whole spatio-temporal distribution of thermal variables within the electronics component or package, for all waveforms of injected powers.