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2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects最新文献

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An Improved EM-Based Design Procedure for Single-Layer Substrate Integrated Waveguide Interconnects with Microstrip Transitions 一种改进的微带跃迁单层基板集成波导互连设计方法
2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects Pub Date : 2009-04-14 DOI: 10.1109/IMWS.2009.4814902
J. Rayas-Sánchez
{"title":"An Improved EM-Based Design Procedure for Single-Layer Substrate Integrated Waveguide Interconnects with Microstrip Transitions","authors":"J. Rayas-Sánchez","doi":"10.1109/IMWS.2009.4814902","DOIUrl":"https://doi.org/10.1109/IMWS.2009.4814902","url":null,"abstract":"A practical, computationally efficient technique to EM-based design of single-layer SIW interconnects with microstrip transitions is presented in this work. The design technique efficiently exploits a simplified EM model of the SIW interconnect (surrogate model). The initial design of the SIW structure is obtained by using available empirical equations. A low-resolution EM model with solid walls (grooves) is proposed as an efficient SIW surrogate model for direct EM optimization using a few frequency points. The complete EM optimization of the surrogate model consumes much less time (≪ 20%) than just one simulation of the original EM model (with vias) using a high-resolution grid. The proposed practical technique is illustrated by designing a 10-50 GHz SIW interconnect with microstrip transitions on a standard FR4-based substrate.","PeriodicalId":368866,"journal":{"name":"2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128137683","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 19
Miniaturized Metamaterial Filters Using Ring Resonators 使用环形谐振器的小型化超材料滤波器
2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects Pub Date : 2009-04-14 DOI: 10.1109/IMWS.2009.4814906
Isaias Zagoya-Mellado, A. Corona‐Chavez, I. Llamas-Garro
{"title":"Miniaturized Metamaterial Filters Using Ring Resonators","authors":"Isaias Zagoya-Mellado, A. Corona‐Chavez, I. Llamas-Garro","doi":"10.1109/IMWS.2009.4814906","DOIUrl":"https://doi.org/10.1109/IMWS.2009.4814906","url":null,"abstract":"In this paper extremely compact metamaterial closed loop resonators are demonstrated and implemented in a 3 pole Chebyshev filter and a 4 pole quasi elliptic filter at 800MHz for mobile communications. Simulated and experimental results are shown.","PeriodicalId":368866,"journal":{"name":"2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects","volume":"242 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131869262","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
QFN-based Millimeter Wave Packaging to 80GHz 基于qfn的毫米波封装到80GHz
2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects Pub Date : 2009-04-14 DOI: 10.1109/IMWS.2009.4814898
E. A. Sanjuan, S. Cahill
{"title":"QFN-based Millimeter Wave Packaging to 80GHz","authors":"E. A. Sanjuan, S. Cahill","doi":"10.1109/IMWS.2009.4814898","DOIUrl":"https://doi.org/10.1109/IMWS.2009.4814898","url":null,"abstract":"This paper describes a low-cost plastic QFN package capable of addressing increasing frequency needs. This package has low-loss, high-bandwidth and is based around MicroCoax interconnect technology. Since this package structure is broadband, it will easily allow for a variety of chipsets to be assembled using the same process sequence and I/O configuration, thereby eliminating costly overhead. With less than 0.5 dB insertion-loss and ≫ 15dB return-loss per RF interconnect at 50GHz, this 5×5 mm QFN package will allow existing bare-die only applications to enter the world of high-speed PCB assembly. Process technology, I/O performance, active device performance, PCB board material selection and test protocol are discussed.","PeriodicalId":368866,"journal":{"name":"2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133205270","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Size Reduction and Dispersion/Impedance Engineering with Resonant Type Metamaterial Transmission Lines: Current Status and Future Applications 谐振型超材料传输线的尺寸减小与色散/阻抗工程:现状与未来应用
2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects Pub Date : 2009-04-14 DOI: 10.1109/IMWS.2009.4814905
G. Sisó, M. Gil, F. Aznar, J. Bonache, F. Martín
{"title":"Size Reduction and Dispersion/Impedance Engineering with Resonant Type Metamaterial Transmission Lines: Current Status and Future Applications","authors":"G. Sisó, M. Gil, F. Aznar, J. Bonache, F. Martín","doi":"10.1109/IMWS.2009.4814905","DOIUrl":"https://doi.org/10.1109/IMWS.2009.4814905","url":null,"abstract":"In this paper the most relevant applications derived from dispersion and impedance engineering in resonant type metamaterial transmission lines are highlighted. Essentially, this includes enhanced bandwidth components and dual-band components. Due to the small electrical size of the considered metamaterial resonators, size reduction is also obtained. We will provide some recent results obtained by the authors, and we will also point out future developments.","PeriodicalId":368866,"journal":{"name":"2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131378154","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Spherical Near-Field to Far-Field Transformations for the Half-Space Problem with a PEC Boundary 具有PEC边界的半空间问题的球面近场到远场变换
2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects Pub Date : 2009-04-14 DOI: 10.1109/IMWS.2009.4814919
J. R. Camacho-Perez, P. Moreno-Villalobos
{"title":"Spherical Near-Field to Far-Field Transformations for the Half-Space Problem with a PEC Boundary","authors":"J. R. Camacho-Perez, P. Moreno-Villalobos","doi":"10.1109/IMWS.2009.4814919","DOIUrl":"https://doi.org/10.1109/IMWS.2009.4814919","url":null,"abstract":"This paper demonstrates the equivalence of spherical near-field to far-field transformations for antennas above a perfect electric conducting (PEC) ground with that of a free-space problem when the ground is replaced by the image of the measured field on the upper hemisphere. The image of the electric field is derived exactly by invoking the equivalence principle and image theory.","PeriodicalId":368866,"journal":{"name":"2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116047751","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Analysis of Hybrid-Integrated High-Speed Electro-Absorption Modulated Lasers Based on EM/Circuit Co-simulation 基于EM/Circuit联合仿真的混合集成高速电吸收调制激光器分析
2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects Pub Date : 2009-04-14 DOI: 10.1109/IMWS.2009.4814903
T. Johansen, V. Krozer, C. Kazmierski, C. Jany, Chenhui Jiang
{"title":"Analysis of Hybrid-Integrated High-Speed Electro-Absorption Modulated Lasers Based on EM/Circuit Co-simulation","authors":"T. Johansen, V. Krozer, C. Kazmierski, C. Jany, Chenhui Jiang","doi":"10.1109/IMWS.2009.4814903","DOIUrl":"https://doi.org/10.1109/IMWS.2009.4814903","url":null,"abstract":"An improved electromagnetic simulation (EM) based approach has been developed for optimization of the electrical to optical (E/O) transmission properties of integrated electro-absorption modulated lasers (EMLs) aiming at 100 Gbit/s Ethernet applications. Our approach allows for an accurate analysis of the EML performance in a hybrid microstrip assembly. The established EM-based approach provides a design methodology for the future hybrid integration of the EML with its driving electronics.","PeriodicalId":368866,"journal":{"name":"2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131988842","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A FDTD method for Nonuniform Transmission Line Analysis Using Yee's-lattice and Wavelet Expansion 基于Yee晶格和小波展开的非均匀传输线时域有限差分分析方法
2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects Pub Date : 2009-04-14 DOI: 10.1109/IMWS.2009.4814914
Kazunori Watanabe, T. Sekine, Yasuhiro Takahashi
{"title":"A FDTD method for Nonuniform Transmission Line Analysis Using Yee's-lattice and Wavelet Expansion","authors":"Kazunori Watanabe, T. Sekine, Yasuhiro Takahashi","doi":"10.1109/IMWS.2009.4814914","DOIUrl":"https://doi.org/10.1109/IMWS.2009.4814914","url":null,"abstract":"A 1D finite-difference time-domain (FDTD) method for nonuniform transmission line analysis by using wavelet expansion is presented. The approach are based on scaling functions only or on a combination of scaling functions and wavelets leading to a variable mesh griding. The proposed schemes compared to the conventional Yee's FDTD scheme shows a good capability to approximate the exact solution with negligible error for sampling rates approaching the Nyquist limit. A linear tapered transmission line that is one of models of interconnect is analyzed in order to illustrate the application of this method and to demonstrate the advantages over Yee's FDTD scheme with respect to memory requirements and execution time. And to show the stableness, eye diagram analysis for lossy uniform transmission line is shown.","PeriodicalId":368866,"journal":{"name":"2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121949832","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
A Modified Model for the Self Inductance of Metal Lines on Si 硅上金属线自感的修正模型
2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects Pub Date : 2009-04-14 DOI: 10.1109/IMWS.2009.4814920
J. Huerta-Chua, R. Murphy‐Arteaga
{"title":"A Modified Model for the Self Inductance of Metal Lines on Si","authors":"J. Huerta-Chua, R. Murphy‐Arteaga","doi":"10.1109/IMWS.2009.4814920","DOIUrl":"https://doi.org/10.1109/IMWS.2009.4814920","url":null,"abstract":"The effects of the self inductance associated with interconnection lines in integrated circuits have become extremely important when judging the performance of RF circuits, and thus, its modeling and characterization is an ongoing effort worldwide. This paper aims to contribute to this effort, proposing a modified model that is both simple and physically based, to calculate the self inductance of the metal lines used in modern IC designs. Most of the published models and techniques were analyzed and compared to experimental data, and one of these was modified to take into account the rectangular geometry of interconnect lines, showing a much better agreement with experiment. Interconnect lines designed for this purpose were fabricated using a standard CMOS process (AMIS 0.35¿m), and measured in the frequency range from 40MHz to 50GHz.","PeriodicalId":368866,"journal":{"name":"2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127826576","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
A 20 Gb/s 1:4 DEMUX with Near-Rail-to-Rail Logic Swing in 90 nm CMOS process 20gb /s 1:4 DEMUX近轨逻辑摆幅90nm CMOS工艺
2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects Pub Date : 2009-04-14 DOI: 10.1109/IMWS.2009.4814922
A. Mineyama, T. Suzuki, Hiroyuki Ito, S. Amakawa, N. Ishihara, K. Masu
{"title":"A 20 Gb/s 1:4 DEMUX with Near-Rail-to-Rail Logic Swing in 90 nm CMOS process","authors":"A. Mineyama, T. Suzuki, Hiroyuki Ito, S. Amakawa, N. Ishihara, K. Masu","doi":"10.1109/IMWS.2009.4814922","DOIUrl":"https://doi.org/10.1109/IMWS.2009.4814922","url":null,"abstract":"A 9.5 mW 20 Gb/s 40×70 ¿m2 inductorless 1:4 DEMUX in 90 nm CMOS process is presented. In order to reduce power and area, the DEMUX uses a multi-phase clock architecture that requires a smaller number of latches operating at a slower clock rate than in the conventional tree architecture. To provide low-voltage scalability, the latches operate with a near-tail-to-rail logic swing. It is realized without significant speed penalty by adopting current-sourceless CML-type latches with unconventional settings. It offers a larger noise margin and elimination of logic level converters too. The well-balanced scalable design could possibly broaden the applications of high-speed SerDes in the coming ultralow-voltage many-core era.","PeriodicalId":368866,"journal":{"name":"2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121249242","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
A New Multi-Dimensional RF and Microwave Modeling Algorithm Based on Rational Interpolants and Hybrid Mapping 一种基于有理插值和混合映射的射频和微波多维建模新算法
2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects Pub Date : 2009-04-14 DOI: 10.1109/IMWS.2009.4814912
A. Kashi, Niladri Roy, Ege Engin, V. Devabhaktuni
{"title":"A New Multi-Dimensional RF and Microwave Modeling Algorithm Based on Rational Interpolants and Hybrid Mapping","authors":"A. Kashi, Niladri Roy, Ege Engin, V. Devabhaktuni","doi":"10.1109/IMWS.2009.4814912","DOIUrl":"https://doi.org/10.1109/IMWS.2009.4814912","url":null,"abstract":"A new adaptive multi-dimensional RF/microwave modeling algorithm based on rational interpolants is proposed. For the first time, the algorithm integrates rational functions, genetic concepts, and frequency mapping into a unified CAD tool, which facilitates accurate and fast EM based RF/microwave modeling. Given an RF/microwave modeling problem, highly non-linear and relatively less non-linear model inputs are distinguishable. The algorithm consists of two phases. Starting with a minimal number of EM data and with lowest-order rational functions, Phase 1 systematically produces a sub-model with highly non-linear inputs alone. In Phase 2, an initial overall model is first constructed based on the above sub-model. A hybrid mapping then fine-tunes the initial model to capture the RF/microwave tendencies w.r.t. the less non-linear inputs. The algorithm is illustrated through a practical example.","PeriodicalId":368866,"journal":{"name":"2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132776026","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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