2017 30th IEEE International System-on-Chip Conference (SOCC)最新文献

筛选
英文 中文
Hybrid multi-swarm optimization based NoC synthesis 基于混合多群优化的NoC合成
2017 30th IEEE International System-on-Chip Conference (SOCC) Pub Date : 2017-09-01 DOI: 10.1109/SOCC.2017.8226008
Muhammad Obaidullah, G. Khan
{"title":"Hybrid multi-swarm optimization based NoC synthesis","authors":"Muhammad Obaidullah, G. Khan","doi":"10.1109/SOCC.2017.8226008","DOIUrl":"https://doi.org/10.1109/SOCC.2017.8226008","url":null,"abstract":"Network-on-Chip (NoC) has been proposed as an interconnection framework for connecting large number of cores for a System-on-Chip (SoC). Assuming a mesh-based NoC, we explore the assignment of cores to cross-points and produce a best NoC configuration with minimum average communication traffic, power consumption and chip area. We use pre-synthesized network components data to estimate power and chip area of the NoC. NoC configuration and mapping problem belongs to NP-hard complexity set, therefore we propose a hybrid scheme of swarm optimization that combines Tabu-search, force-directed swapping, sub-swarms, and Discrete Particle Swarm Optimization (DPSO). The main goal of the optimization is to configure the NoC such that the total NoC latency, power consumption, and area occupied are minimal. DPSO is used as the main optimization scheme and modified so that each particle move is also influenced by a force derived from the NoC traffic matrix. The methodology is tested for some multimedia application core graphs as well as large network of randomly generated cores. It is determined that on average our hybrid technique required less number of iterations and time to reach an optimal solution when compared with existing NoC synthesis algorithms.","PeriodicalId":366264,"journal":{"name":"2017 30th IEEE International System-on-Chip Conference (SOCC)","volume":"98 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123077202","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
A 13.5 bit 1.6 mW 3rd order CT ΣΔ ADC for integrated capacitance sensor interface 用于集成电容传感器接口的13.5位1.6 mW三阶CT ΣΔ ADC
2017 30th IEEE International System-on-Chip Conference (SOCC) Pub Date : 2017-09-01 DOI: 10.1109/SOCC.2017.8226003
Javed S. Gaggatur, Gaurab Banerjee
{"title":"A 13.5 bit 1.6 mW 3rd order CT ΣΔ ADC for integrated capacitance sensor interface","authors":"Javed S. Gaggatur, Gaurab Banerjee","doi":"10.1109/SOCC.2017.8226003","DOIUrl":"https://doi.org/10.1109/SOCC.2017.8226003","url":null,"abstract":"An integrated capacitance sensor interface is proposed with three programmable gain stages to measure femto-farad capacitance. The capacitance sensor interface is a differential measurement set-up to measure the change in capacitance over a fixed nominal capacitance. The programmable gain stages are used to change the gain settings to operate for a wide-range capacitance measurement. The implemented continuous time ΣΔ ADC is a third-order cascade of integrators feedforward topology with a signal bandwidth of 10 kHz. The ADC has a measured peak dynamic range of 84.5 dB while consuming 1.6 mW. The measured figure of merit (FoM) is 3.107 pJ-mm2/conversion at a clock frequency of 6.4 MHz having an active area of 0.45 mm2. The ADC was applied in the femto-farad capacitance measurement using a 0.3 pF–1.2 pF variable capacitor typically encountered in MEMS-based sensor applications like pressure/humidity/flow sensing in System-in-Package (SiP) or Systems-on-Chip (SoC).","PeriodicalId":366264,"journal":{"name":"2017 30th IEEE International System-on-Chip Conference (SOCC)","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126621837","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Investigation of diode triggered silicon control rectifier turn-on time during ESD events ESD事件中二极管触发硅控整流器导通时间的研究
2017 30th IEEE International System-on-Chip Conference (SOCC) Pub Date : 2017-09-01 DOI: 10.1109/SOCC.2017.8226031
Ahmed Y. Ginawi, R. Gauthier, T. Xia
{"title":"Investigation of diode triggered silicon control rectifier turn-on time during ESD events","authors":"Ahmed Y. Ginawi, R. Gauthier, T. Xia","doi":"10.1109/SOCC.2017.8226031","DOIUrl":"https://doi.org/10.1109/SOCC.2017.8226031","url":null,"abstract":"Diode-triggered silicon-controlled rectifier (DT-SCR) devices protect sensitive circuit nodes, such as high-frequency analog circuits and thin-gate complementary metal-oxide semiconductor (CMOS) circuits with high-speed input [1]. Reducing the turn-on time and overshoot voltage enhances the use of a DTSCR device in high-speed applications. We analyze the two lateral bipolar devices found in CMOS based process SCRS to improve the overall DTSCR turn-on time during an electrostatic discharge (ESD) event. We use technology computer-aided design (TCAD) device-level simulations to accurately predict the turn-on time of these parasitic bipolar devices in a 32nm CMOS technology.","PeriodicalId":366264,"journal":{"name":"2017 30th IEEE International System-on-Chip Conference (SOCC)","volume":"9 6","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120985608","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A 1.41mW on-chip/off-chip hybrid transposition table for low-power robust deep tree search in artificial intelligence SoCs 用于人工智能soc中低功耗鲁棒深度树搜索的1.41mW片上/片外混合换位表
2017 30th IEEE International System-on-Chip Conference (SOCC) Pub Date : 2017-09-01 DOI: 10.1109/SOCC.2017.8226024
Dongjoo Shin, Youchang Kim, H. Yoo
{"title":"A 1.41mW on-chip/off-chip hybrid transposition table for low-power robust deep tree search in artificial intelligence SoCs","authors":"Dongjoo Shin, Youchang Kim, H. Yoo","doi":"10.1109/SOCC.2017.8226024","DOIUrl":"https://doi.org/10.1109/SOCC.2017.8226024","url":null,"abstract":"An on-chip/off-chip hybrid transposition table (TT) is proposed to implement artificial intelligence functions in mobile platforms. In order to meet the power consumption and throughput requirements for realizing the intelligence functions in real-time, the TT is playing a key role to prevent the duplicated evaluations in a tree search by storing search results. Three key features, 1) On-chip/off-chip hybrid TT architecture, 2) On-chip buffer cache, and 3) Progress-based entry replacement policy, are proposed to overcome the design challenges (hit rate, latency and off-chip bandwidth) for implementing the TT. The proposed hybrid TT is fabricated in a 65nm CMOS technology, and achieves 35% hit ratio and 220ns latency with only 1.41mW power consumption and 2.9MB/s off-chip memory bandwidth.","PeriodicalId":366264,"journal":{"name":"2017 30th IEEE International System-on-Chip Conference (SOCC)","volume":"96 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121457590","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Wednesday keynote II: Advanced technology for automotive cockpits, industrial human-machine-interface and IoT systems — Optimization of technology — Architecture — Design 周三主题演讲II:汽车驾驶舱、工业人机界面和物联网系统的先进技术-技术优化-架构-设计
2017 30th IEEE International System-on-Chip Conference (SOCC) Pub Date : 2017-09-01 DOI: 10.1109/SOCC.2017.8225992
Ron Martino
{"title":"Wednesday keynote II: Advanced technology for automotive cockpits, industrial human-machine-interface and IoT systems — Optimization of technology — Architecture — Design","authors":"Ron Martino","doi":"10.1109/SOCC.2017.8225992","DOIUrl":"https://doi.org/10.1109/SOCC.2017.8225992","url":null,"abstract":"Electronic innovation is becoming increasingly important in the evolution of our society. Noble goals of extending lives with improved medical capabilities, eliminating auto fatalities, and creating a connected infrastructure around the “Internet of Things” all center on electronic innovation. These goals are being driven by both legislation and consumer demand, which is leading to accelerated system challenges. New system solutions are requiring the integration of disparate functional blocks, high levels of optimization for energy efficiency and scaling across a large dynamic range of performance. A central focus in this evolution is the enhancements to the human-machine-interface (HMI), enabling seamless interactions between humans and machines. Multimedia applications processors are playing a critical role in introducing solutions with multisensory capabilities such as natural language recognition, vision detection and augmentation of reality through enhanced display functionality. We will explore HMI trends in multiple applications and discuss how FD-SOI technology, novel applications processor architectures, integrated circuit module development and system-on-chip integration create safe and secure systems.","PeriodicalId":366264,"journal":{"name":"2017 30th IEEE International System-on-Chip Conference (SOCC)","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125206445","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Accelerating chip design with machine learning: From pre-silicon to post-silicon
2017 30th IEEE International System-on-Chip Conference (SOCC) Pub Date : 2017-09-01 DOI: 10.1109/SOCC.2017.8226046
Cheng Zhuo, Bei Yu, Di Gao
{"title":"Accelerating chip design with machine learning: From pre-silicon to post-silicon","authors":"Cheng Zhuo, Bei Yu, Di Gao","doi":"10.1109/SOCC.2017.8226046","DOIUrl":"https://doi.org/10.1109/SOCC.2017.8226046","url":null,"abstract":"At sub-22nm regime, chip designs have to go through hundreds to thousands of steps and tasks before shipment. Many tasks are data and simulation intensive, thereby demanding significant amount of resources and time. Unlike conventional methodologies relying on experiences to manually handle data and extract models, recent advances in machine learning techniques enable the successful applications in various complex tasks to accelerate modern chip designs, ranging from pre-silicon verification to post-silicon validation and tuning. The goals are to reduce the amount of time and efforts to process and understand data through automatic and effective learning and enhancing from examples. In this paper we review and discuss several application cases of machine learning techniques, including pre-silicon hotspot detection through classification, post-silicon variation extraction and bug localization through inference, and post-silicon timing tuning through iterative learning and optimization, so as to leverage the potentials and inspire more future innovations.","PeriodicalId":366264,"journal":{"name":"2017 30th IEEE International System-on-Chip Conference (SOCC)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127715939","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Energy-efficient wireless interconnection framework for multichip systems with in-package memory stacks 封装内存储栈多芯片系统的高能效无线互连框架
2017 30th IEEE International System-on-Chip Conference (SOCC) Pub Date : 2017-09-01 DOI: 10.1109/SOCC.2017.8226077
Md Shahriar Shamim, M. Ahmed, N. Mansoor, A. Ganguly
{"title":"Energy-efficient wireless interconnection framework for multichip systems with in-package memory stacks","authors":"Md Shahriar Shamim, M. Ahmed, N. Mansoor, A. Ganguly","doi":"10.1109/SOCC.2017.8226077","DOIUrl":"https://doi.org/10.1109/SOCC.2017.8226077","url":null,"abstract":"Multichip systems with memory stacks and various processing chips are at the heart of platform based designs such as servers and embedded systems. Full utilization of the benefits of these integrated multichip systems need a seamless, and scalable in-package interconnection framework. However, state-of-the-art inter-chip communication requires long wireline channels which increases energy consumption and latency while decreasing data bandwidth. Here, we propose the design of an energy-efficient, seamless wireless interconnection network for multichip systems. We demonstrate with cycle-accurate simulations that such a design reduces the energy consumption and latency while increasing the bandwidth in comparison to modern multichip integration systems.","PeriodicalId":366264,"journal":{"name":"2017 30th IEEE International System-on-Chip Conference (SOCC)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134090182","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
A 0.13 CMOS integrated circuit for electrical impedance spectroscopy from 1 kHz to 10 GHz 一个0.13 CMOS集成电路的电阻抗光谱从1千赫到10千兆赫
2017 30th IEEE International System-on-Chip Conference (SOCC) Pub Date : 2017-09-01 DOI: 10.1109/SOCC.2017.8226022
R. García-Ramírez, A. Chacón-Rodríguez, R. Rímolo-Donadío
{"title":"A 0.13 CMOS integrated circuit for electrical impedance spectroscopy from 1 kHz to 10 GHz","authors":"R. García-Ramírez, A. Chacón-Rodríguez, R. Rímolo-Donadío","doi":"10.1109/SOCC.2017.8226022","DOIUrl":"https://doi.org/10.1109/SOCC.2017.8226022","url":null,"abstract":"The design of an electrical impedance spectroscopy acquisition and processing system using a 0.13 μm CMOS technology with a 1kHz to 10 GHz functional frequency range is presented. The system is based on a quadrature modulator in a lock-in architecture. The design of each one of the modules of the system is explained, and post-layout simulations are used to validate the main features of the design such as frequency response, gain, noise, linearity, and error characterization.","PeriodicalId":366264,"journal":{"name":"2017 30th IEEE International System-on-Chip Conference (SOCC)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125347278","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Digital spiking neuron cells for real-time reconfigurable learning networks 用于实时可重构学习网络的数字脉冲神经元细胞
2017 30th IEEE International System-on-Chip Conference (SOCC) Pub Date : 2017-09-01 DOI: 10.1109/SOCC.2017.8226029
Haipeng Lin, A. Zjajo, R. V. Leuken
{"title":"Digital spiking neuron cells for real-time reconfigurable learning networks","authors":"Haipeng Lin, A. Zjajo, R. V. Leuken","doi":"10.1109/SOCC.2017.8226029","DOIUrl":"https://doi.org/10.1109/SOCC.2017.8226029","url":null,"abstract":"The high level of realism of spiking neuron networks and their complexity require a substantial computational resources limiting the size of the realized networks. Consequently, the main challenge in building complex and biologically-accurate spiking neuron network is largely set by the high computational and data transfer demands. In this paper, we implement several efficient models of the spiking neurons with characteristics such as axon conduction delays and spike timing-dependent plasticity. Experimental results indicate that the proposed real-time data-flow learning network architecture allows the capacity of over 2800 (depending on the model complexity) biophysically accurate neurons in a single FPGA device.","PeriodicalId":366264,"journal":{"name":"2017 30th IEEE International System-on-Chip Conference (SOCC)","volume":"149 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134430859","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Fairness-oriented switch allocation for networks-on-chip 面向公平的片上网络交换机分配
2017 30th IEEE International System-on-Chip Conference (SOCC) Pub Date : 2017-09-01 DOI: 10.1109/SOCC.2017.8226066
Zicong Wang, Xiaowen Chen, Chen Li, Yang Guo
{"title":"Fairness-oriented switch allocation for networks-on-chip","authors":"Zicong Wang, Xiaowen Chen, Chen Li, Yang Guo","doi":"10.1109/SOCC.2017.8226066","DOIUrl":"https://doi.org/10.1109/SOCC.2017.8226066","url":null,"abstract":"Networks-on-Chip (NoC) is becoming the backbone of modern chip multiprocessor (CMP) systems. However, with the number of integrated cores increasing and the network size scaling up, the network-latency imbalance is becoming an important problem, which seriously influences the performance of the network and system. In this paper, we aim to alleviate this problem by optimizing the design of switch allocation. We propose fairness-oriented switch allocation (FOSA), a novel switch allocation strategy to achieve uniform network latencies. FOSA can improve system performance by achieving remarkable improvement in balancing network latencies. We evaluate the network and system performance of FOSA with synthetic traffics and SPEC CPU2006 benchmarks in a full-system simulator. Compared with the canonical separable switch allocator (Round-Robin) and the recently proposed switch allocator (TS-Router), the experiments with benchmarks show that our approach decreases maximum latency (ML) by 45.6% and 15.1%, respectively, as well as latency standard deviation (LSD) by 13.8% and 3.9%, respectively. Besides this, FOSA improves system throughput by 0.8% over that of TS-Router. Finally, we synthesize FOSA and give an evaluation of the additional consumption of area and power.","PeriodicalId":366264,"journal":{"name":"2017 30th IEEE International System-on-Chip Conference (SOCC)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117194544","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信