Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176最新文献_第9页

In-plane microactuator for fluid control application 用于流体控制应用的平面内微执行器

Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176 Pub Date : 1998-01-25 DOI: 10.1109/MEMSYS.1998.659800

F. Sherman, S. Tung, C. Kim, Chih-Ming Ho, J. Woo

{"title":"In-plane microactuator for fluid control application","authors":"F. Sherman, S. Tung, C. Kim, Chih-Ming Ho, J. Woo","doi":"10.1109/MEMSYS.1998.659800","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659800","url":null,"abstract":"We introduce a new approach that alters the local flow condition using electrostatically driven microactuator moving in the in-plane direction such that form drag of the actuator can be eliminated. This is in contrast to the electromagnetically driven microflap moving normal to the substrate. A 60 /spl mu/m/spl times/200 /spl mu/m plate moving parallel to the substrate surface induces a \"spanwise velocity\" into the flow field. This spanwise velocity, when applied to the near-wall streaks, increases the transport of high-speed fluid away from the wall, therefore causing reduction in viscous drag. The microplate is attached at the end of a microcantilever capable of, even in non-resonance, large tip deflection (>100 /spl mu/m), tested at the operation frequencies of 500-1200 Hz. The cantilever is of a high-aspect-ratio structure (2 /spl mu/m wide, 6-17 /spl mu/m thick silicon) to ensure parallel motion over a long distance and provide robustness against out-of-plane deflection under external disturbances from the flow. We report the design and one-mask fabrication of the in-plane microactuator array made from Silicon-On-Insulator (SOI) wafers and experimental verification of the induced Stoke's flow and a local fluid flow.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126034410","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 9

Development of a new type piezoelectric micromotor 一种新型压电微电机的研制

Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176 Pub Date : 1998-01-25 DOI: 10.1109/MEMSYS.1998.659789

K. Tani, M. Suzuki, K. Furuta, T. Sakuhara, T. Ataka

引用次数: 68

Miniature ice detection sensor systems for aerospace applications 用于航空航天应用的微型冰探测传感器系统

Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176 Pub Date : 1998-01-25 DOI: 10.1109/MEMSYS.1998.659732

S. Roy, R. Deanna, A. Izad, M. Mehregany

{"title":"Miniature ice detection sensor systems for aerospace applications","authors":"S. Roy, R. Deanna, A. Izad, M. Mehregany","doi":"10.1109/MEMSYS.1998.659732","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659732","url":null,"abstract":"Ice detection systems using microfabricated diaphragms as sensing elements and portable capacitance detection circuitry are presented. Finite element analysis (FEA) is used to optimize the sensor geometry for enhanced sensitivity to ice accretion. The sensors are fabricated by bulk micromachining and wafer bonding of silicon and glass substrates. During operation, actuation forces are applied electrostatically to cause diaphragm deformation. Accumulation of ice on a diaphragm leads to an increase in its effective stiffness. Therefore, for a given actuation voltage, an ice-covered diaphragm exhibits a smaller deflection than a corresponding ice-free diaphragm. This deflection is measured using a customized, portable, high-sensitivity, differential capacitance measurement circuit. The sensors are operated with the diaphragms in their stiffness-sensitive mode, enabling discrimination between ice and water (or deicing fluids) films. Calibration experiments reveal that the miniature ice detection sensor system can successfully detect ice and water film thicknesses between approximately 0.5-1.5 mm. Finally, dynamic testing indicates that adhesion of ice to silicon is poor when the sensor is driven continuously.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130178065","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 16

Combining microstereolithography and thick resist UV lithography for 3D microfabrication 结合微立体光刻和厚抗蚀剂UV光刻技术进行三维微加工

Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176 Pub Date : 1998-01-25 DOI: 10.1109/MEMSYS.1998.659722

A. Bertsch, H. Lorenz, P. Renaud

引用次数: 78

A fully integrated micro-opto-mechanical steering device 一种完全集成的微光机械转向装置

Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176 Pub Date : 1998-01-25 DOI: 10.1109/MEMSYS.1998.659737

K. Petroz, E. Ollier, H. Grateau, J. Bechtle, P. Labeye, P. Mottier

引用次数: 2

Fabrication of free standing structure using single step electrochemical etching in hydrofluoric acid 氢氟酸中一步电化学腐蚀制备独立结构

Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176 Pub Date : 1998-01-25 DOI: 10.1109/MEMSYS.1998.659762

H. Ohji, P. Trimp, P. French

引用次数: 39

A MEMS fabrication technique for non-planar substrates 一种非平面基板MEMS制造技术

Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176 Pub Date : 1998-01-25 DOI: 10.1109/MEMSYS.1998.659766

W.J. Li, J. Mai, Chih-Ming Ho

{"title":"A MEMS fabrication technique for non-planar substrates","authors":"W.J. Li, J. Mai, Chih-Ming Ho","doi":"10.1109/MEMSYS.1998.659766","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659766","url":null,"abstract":"The integration of MEMS sensors, actuators, and IC devices onto macro mechanical parts is a critical technology necessary for the potential realization of intelligent mechanical structures. The current planar fabrication methods offered by the MEMS/IC industry restrict the possibility of integrating micro devices onto contoured (non-planar) mechanical structures. We have developed a lithographic technique to directly fabricate micron-sized sensing and actuation structures onto a cylindrical surface. This novel technology includes the development of flexible masks, photoresist spraying technique, and customized alignment systems. Results indicate that line resolution of <5 /spl mu/m is possible for structures on the surface of a 2\" (5.08 cm) long cylinder with a diameter of 1.25\" (3.175 cm). This paper describes the procedures developed to fabricate sacrificially release micro structures onto a cylindrical surface. The performance of some micro thermal actuators and shear stress sensors on a quartz cylindrical substrate are also presented.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"82 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124117994","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 8

Mesoscale actuator device with micro interlocking mechanism 带有微联锁机构的中尺度致动装置

Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176 Pub Date : 1998-01-25 DOI: 10.1109/MEMSYS.1998.659787

Quanfang Chen, D. Yao, C. Kim, G. Carman

{"title":"Mesoscale actuator device with micro interlocking mechanism","authors":"Quanfang Chen, D. Yao, C. Kim, G. Carman","doi":"10.1109/MEMSYS.1998.659787","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659787","url":null,"abstract":"A novel proof-of-concept prototype Mesoscale Actuator Device (MAD) has been developed. The MAD is similar to piezoelectric driven inchworm motors with the exception that mechanically interlocking microridges replace the traditional frictional clamping mechanisms. The interlocked microridges, fabricated from single crystal silicon, increase the load carrying capability of the device substantially. Tests conducted on the current design demonstrate that the interlocked microridges support 16 MPa in shear or that a 3/spl times/5 mm locked chip supports a 25 kgf load. To operate the MAD device at high frequencies an open loop control signal is implemented. Synchronizing the locking and unlocking of the microridges with the elongating and contracting actuator requires minor perturbations in the voltage signal supplied. The system was successfully operated from 0.2 Hz to 500 Hz (or speeds from 2 /spl mu/m/s to 5 mm/s). The upper limit (500 Hz) is imposed by software limitations and not related to physical limitations of the current device.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132454275","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 9

Microelectromechanical devices for wireless communications 用于无线通信的微机电装置

Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176 Pub Date : 1998-01-25 DOI: 10.1109/MEMSYS.1998.659719

C. Nguyen

引用次数: 68

New micro stereo lithography for freely movable 3D micro structure-super IH process with submicron resolution 可自由移动三维微结构的新型微立体光刻技术——亚微米分辨率超IH工艺

Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176 Pub Date : 1998-01-25 DOI: 10.1109/MEMSYS.1998.659770

Koji Ikuta, Shoji Maruo, S. Kojima

引用次数: 72