Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718)最新文献_第4页

Influence of computer chassis design on metal fabrication waste streams 计算机机箱设计对金属加工废弃物流的影响

Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Pub Date : 1995-05-01 DOI: 10.1109/ISEE.1995.514977

P. Sheng, B. Willis, A. Shiovitz

{"title":"Influence of computer chassis design on metal fabrication waste streams","authors":"P. Sheng, B. Willis, A. Shiovitz","doi":"10.1109/ISEE.1995.514977","DOIUrl":"https://doi.org/10.1109/ISEE.1995.514977","url":null,"abstract":"There is growing interest in studying the influence of design decisions within a product life cycle, especially in designing for ease of disassembly and recycling. However, a significant life-cycle component of the wastes associated with the product occur at the primary manufacturing stages. This paper examines the environmental impact of chassis design features on process flow for metal fabrication. Critical processes include blanking, punch, metal deformation , finishing and welding. The availability of data at several levels of aggregation is supplemented by the development of analytical models of process physics to derive a process-level inventory of energy utilization, primary scrap and secondary catalysts (tool, fluid and vapor waste streams). The mass flows of waste streams can be weighted by impact on factors such as toxicity, carcinogenesis, reactivity, flammability, and irritation using material safety data and survey of site-specific factors. A case study of a chassis assembly for a network server is presented with several design alternatives to illustrate the impact of feature changes and component consolidation on waste streams. The trade-offs between environmental, manufacturing and product performance factors are discussed.","PeriodicalId":338075,"journal":{"name":"Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125563412","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Evaluation approach for environmental impact and yield trade-offs for electronics manufacturing product and process alternatives 电子制造产品和工艺替代的环境影响和产量权衡评价方法

Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Pub Date : 1995-05-01 DOI: 10.1109/ISEE.1995.514969

J. A. Stuart, J. Ammons, L.J. Turbini, F. Saunders, M. Saminathan

引用次数: 9

Coating technology process redesign: a systems approach to capturing environmental benefits 涂层技术流程的重新设计:一种获取环境效益的系统方法

Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Pub Date : 1995-05-01 DOI: 10.1109/ISEE.1995.514976

R. Finsterwalder, P. Calkins, A. Perez

引用次数: 0

"Green" process and productivity improvements in a GaAs light emitting diode wafer fab 砷化镓发光二极管晶圆厂的“绿色”工艺和生产率改进

Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Pub Date : 1995-05-01 DOI: 10.1109/ISEE.1995.514985

K. Evans, T. Alcorn, P. Hadizad, K. Edwards, R. Fischer, D. Nielsen, F. Richie, N. Saha

引用次数: 0

Systematic estimation of disassembly difficulties: application to computer monitors 拆卸困难的系统估计:在计算机显示器上的应用

Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Pub Date : 1995-05-01 DOI: 10.1109/ISEE.1995.514955

S. McGlothlin, E. Kroll

引用次数: 35

Cost model for the end-of-life stage of electronic goods for consumers 面向消费者的电子产品报废阶段的成本模型

Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Pub Date : 1995-05-01 DOI: 10.1109/ISEE.1995.514990

W. Brouwers, A. Stevels

引用次数: 13

Xerox CO/sub 2/ cleaning system pilot 施乐CO/ sub2 /清洁系统试点

Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Pub Date : 1995-05-01 DOI: 10.1109/ISEE.1995.514958

C.M. Genca

{"title":"Xerox CO/sub 2/ cleaning system pilot","authors":"C.M. Genca","doi":"10.1109/ISEE.1995.514958","DOIUrl":"https://doi.org/10.1109/ISEE.1995.514958","url":null,"abstract":"The carbon dioxide (CO/sub 2/) Cleaning System was adapted by Xerox from a jet-engine cleaning technology and is being used for removal of grease,dirt, and oil from used (field-returned) equipment to enable machine remanufacturing. Prior to the introduction of CO/sub 2/ blasting at Xerox, machine cleaning was a two-stage process, which required a variety of chemicals. In the first stage, loose dirt was removed by compressed air blow-off and vacuum suction. In the second stage, a blend of chlorinated solvents was applied, typically in a handwipe application. In the 1980s, Xerox replaced the solvent blend with a citrus-based material for general cleaning but continued to use 1,1,1-trichloroethane on encrusted, stubborn dirt. Xerox made a significant financial investment in adapting CO/sub 2/ blasting technology for use in its remanufacturing facility and the cleaning of mechanically and electronically sensitive machine parts. This development effort entailed redesign of the current process equipment and recalibration of the blasting parameters. Furthermore, ergonomic refinement of the equipment was required to permit its use by an operator over an 8 to 12 hour work shift. Development and implementation of this new system allowed Xerox to meet an internal requirement of eliminating all ozone depleting substances from its manufacturing processes by the end of 1992, years ahead of any regulatory initiatives. Moreover, CO/sub 2/ blast cleaning resulted in unanticipated cost-savings of 40% and productivity improvements of 50%.","PeriodicalId":338075,"journal":{"name":"Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718)","volume":"102 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124703196","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Evaluating environmental performance: a case study in the flat-panel display industry 评估环境绩效:平板显示器行业的案例研究

Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Pub Date : 1995-05-01 DOI: 10.1109/ISEE.1995.514968

J. Koch, G. Keoleian

引用次数: 4

Application principles for the use of DFE tools DFE工具的使用原则

Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Pub Date : 1995-05-01 DOI: 10.1109/ISEE.1995.514960

P. Eagan, J. Koning, Gary W. Hawk

引用次数: 3

Common structures in international environmental labelling programs 国际环境标签计划的共同结构

Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Pub Date : 1995-05-01 DOI: 10.1109/ISEE.1995.514947

A. Modl

引用次数: 4