Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718)最新文献_第5页

Electronics industry environmental roadmap 电子工业环境路线图

Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Pub Date : 1995-05-01 DOI: 10.1109/ISEE.1995.514991

S. Pedersen

{"title":"Electronics industry environmental roadmap","authors":"S. Pedersen","doi":"10.1109/ISEE.1995.514991","DOIUrl":"https://doi.org/10.1109/ISEE.1995.514991","url":null,"abstract":"In the last few years, the electronics industry has become increasingly aware of the need to develop cost-effective, long-term solutions for environmental issues. Many organizations have invested resources to address environmental issues and business opportunities, and it has become apparent that a strategic, coordinated approach-a roadmap-is needed. Such a roadmap will help the electronics industry maintain a competitive edge in the international market and keep up with foreign competitors who benefit from well-established government/industry partnerships for addressing environmental issues. Bringing key stakeholders together to set priorities, determine future needs, and leverage resources devoted to environmental challenges will result in a cost-efficient strategy and solutions. The resulting cost savings will allow companies to invest in other key business areas and products, thus enhancing their worldwide market position. The purpose of this paper is to present the results of a comprehensive, focused approach to environmental management in the electronics industry. The roadmap describes the process of building electronic systems, highlights those points of primary environmental sensitivity throughout the process, and identifies specific actions that should be taken to achieve the level of environmental excellence which is both imperative for business success and a responsibility of corporate stewardship.","PeriodicalId":338075,"journal":{"name":"Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718)","volume":"89 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129656711","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 31

Green design on thermal management of notebook computer product 笔记本电脑产品热管理的绿色设计

Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Pub Date : 1995-05-01 DOI: 10.1109/ISEE.1995.514986

F. Chao, Jieh-Cheng Kuo, Hwa-Ton Liou, Jain-Hua Wu, Odo Klose

引用次数: 0

Organizing for successful DFE: lessons from winners and losers 组织成功的DFE:成功者和失败者的经验教训

Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Pub Date : 1995-05-01 DOI: 10.1109/ISEE.1995.514938

R. D. Shelton

引用次数: 19

Innovative uses of tools in the design for the environment 在环境设计中创新地使用工具

Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Pub Date : 1995-05-01 DOI: 10.1109/ISEE.1995.514961

D. Franke, K. Monroe

{"title":"Innovative uses of tools in the design for the environment","authors":"D. Franke, K. Monroe","doi":"10.1109/ISEE.1995.514961","DOIUrl":"https://doi.org/10.1109/ISEE.1995.514961","url":null,"abstract":"Software tools are designed for specific applications and specific audiences. Once the tools are available, their use may broaden or diminish due to various unanticipated factors. When these factors deter the use of the tool, innovative ways can be found to facilitate usage. When the factors are positive, then the new uses can be promoted. Using existing tools for new functions can save on software development. This paper will discuss the unplanned uses of two software tools, S_olvent A_lternatives G_uide_ (SAGE) and Architectural Design and Assessment System (ADAS), developed by the Research Triangle Institute (RTI) for manufacturing and design. Innovative design for the environment uses of standard utilities will also be discussed. A secondary concern is computer technology that can change faster than software applications. Applications that can transcend multiple technologies are most useful. Finding the proper technical delivery vehicles to provide environmental information to consumers is a challenge. With the SAGE program, the U.S. Environmental Protection Agency (EPA) and RTI are trying several mechanisms to reach the various audiences for the information.","PeriodicalId":338075,"journal":{"name":"Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718)","volume":"91 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132153350","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Recycling of thermosetting plastic waste from electronic component production processes 电子元件生产过程中热固性塑料废料的回收利用

Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Pub Date : 1995-05-01 DOI: 10.1109/ISEE.1995.514964

S. Yokoyama, M. Iji

{"title":"Recycling of thermosetting plastic waste from electronic component production processes","authors":"S. Yokoyama, M. Iji","doi":"10.1109/ISEE.1995.514964","DOIUrl":"https://doi.org/10.1109/ISEE.1995.514964","url":null,"abstract":"This paper describes the recycling of the mold waste from printed wiring boards (PWBs) and the molding resin used for IC packages, which are the main types of thermosetting plastic waste produced in the electronic component production processes. A practical process for pulverizing the PWB waste and separating the resulting powder into a copper rich powder and a powder consisting of glassfiber and resin (glassfiber-resin powder) was developed. Using this process, up to 94% of the copper was recovered from a pulverized PWB of 100-300 /spl mu/m average particle size. The recovered glassfiber-resin powder was found to be more useful than either talc, calcium carbonate or silica at improving the mechanical strength and the thermal expansion properties of polymer products, such as paints and adhesives. The molding resin powder showed good surface reactivity, comparable to that of a silica powder surface. In recycling the molding resin powder to the original molding resin, recycling of the waste powder of the low stress type molding resin to standard mold resin was especially effective in improving the humidity penetration and the thermal impact resistance of the original standard resin. Moreover, the molding resin powder could be used as a general filler for resin type construction materials, and as a decorating agent for improving the surface hardness of construction materials.","PeriodicalId":338075,"journal":{"name":"Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718)","volume":"127 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122496233","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 36

Electronics recycling-another dimension 电子产品回收——另一个维度

Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Pub Date : 1995-05-01 DOI: 10.1109/ISEE.1995.514992

L. Scheidt, N. Abdoolcader, H. Stadlbauer, Shuqiang Zong, P. Doelman

{"title":"Electronics recycling-another dimension","authors":"L. Scheidt, N. Abdoolcader, H. Stadlbauer, Shuqiang Zong, P. Doelman","doi":"10.1109/ISEE.1995.514992","DOIUrl":"https://doi.org/10.1109/ISEE.1995.514992","url":null,"abstract":"New approaches for the recycling of electronic waste have come into effect to reduce the environmental impact of electronic goods. The goal of CARE \"VISION 2000\" (CARE=A Comprehensive Approach for the Recycling of Electronics) is to increase the value of recycling by driving down costs, reducing the amount of electronic waste and hazardous material and thus the impact on the environment. Ultimately, the objective of CARE \"VISION 2000\" is to transform recycling into an industrial system. With a time frame of 5.5 years and at a total cost of approximately 40 million DM, this project involves major manufacturers in the industrial branches of consumer electronics, computing equipment, office automation and telecommunications equipment active in Europe together with European recycling, distribution and reverse logistics companies. To achieve comprehensive results, the project takes under its wings consideration of several issues. These are the marketing and economic considerations of recycling, logistics and take-back scenarios and the technical issues of disassembly, product identification and quality recertification. The final goal of CARE \"VISION 2000\" is to attain suitable results for high-level recycling and reuse and to transform these results into an international standard.","PeriodicalId":338075,"journal":{"name":"Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126175757","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 8

Environmentally-conscious supply chain management 环保的供应链管理

Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Pub Date : 1995-05-01 DOI: 10.1109/ISEE.1995.514982

S. Beckman, P. Worhach, P. Sheng

引用次数: 24

The role of supply chain management within the industrial ecosystem 供应链管理在工业生态系统中的作用

Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Pub Date : 1995-05-01 DOI: 10.1109/ISEE.1995.514981

Joseph Sarkis, Nicole Darnall, G. Nehman, J. Priest

引用次数: 28

Factors affecting product end-of-life management (PELM) opportunities 影响产品报废管理(PELM)机会的因素

Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Pub Date : 1995-05-01 DOI: 10.1109/ISEE.1995.514972

J. R. Kirby, T. Mann, O. Pitts, R. Sanwald

引用次数: 4

Price setting for green design 绿色设计的价格设定

Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Pub Date : 1995-05-01 DOI: 10.1109/ISEE.1995.514995

H. Matthews, L. Lave

引用次数: 6