2019 IEEE 20th Wireless and Microwave Technology Conference (WAMICON)最新文献_第3页

Next-generation fast algorithms for electromagnetics-based design and analysis of high-performance integrated circuits, packages, and boards 用于高性能集成电路、封装和电路板的基于电磁的设计和分析的下一代快速算法

2019 IEEE 20th Wireless and Microwave Technology Conference (WAMICON) Pub Date : 2019-04-01 DOI: 10.1109/WAMICON.2019.8765460

D. Jiao

{"title":"Next-generation fast algorithms for electromagnetics-based design and analysis of high-performance integrated circuits, packages, and boards","authors":"D. Jiao","doi":"10.1109/WAMICON.2019.8765460","DOIUrl":"https://doi.org/10.1109/WAMICON.2019.8765460","url":null,"abstract":"The fast and large-scale design automation of next-generation IC, packages, and boards calls for a continuous reduction of the computational complexity of electromagnetic solvers. In general, to solve problems with N parameters, the optimal computational complexity is linear complexity O(N). State-of-the-art fast computational methods rely on iterative matrix solutions to solve large-scale problems. The optimal complexity of an iterative solver is O(NN it N rhs ) with N being matrix size, N it the number of iterations and N rhs the number of right-hand sides. How to invert or factorize a dense matrix or a sparse matrix of size N in O(N) (optimal) complexity has been a challenging research problem, but of critical importance to the continual advancement of computational electromagnetics and electronic design automation. In this talk, I will present recent progresses in developing both direct finite element solvers and integral equation-based solvers of optimal complexity for fast and large-scale electromagnetics-based analysis and design of integrated circuits and systems.","PeriodicalId":328717,"journal":{"name":"2019 IEEE 20th Wireless and Microwave Technology Conference (WAMICON)","volume":"83 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114495390","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Simulation Guidelines for Wideband Ground Backed Coplanar Waveguide Transmission Lines 宽带接地共面波导传输线仿真导则

2019 IEEE 20th Wireless and Microwave Technology Conference (WAMICON) Pub Date : 2019-04-01 DOI: 10.1109/WAMICON.2019.8765451

J. Mcdaniel

引用次数: 3

Measurement of the Complex Human Atrial-Ventricular Motions using Contact-Based Doppler Radar 使用接触式多普勒雷达测量复杂的人房室运动

2019 IEEE 20th Wireless and Microwave Technology Conference (WAMICON) Pub Date : 2019-04-01 DOI: 10.1109/WAMICON.2019.8765441

Xiaomeng Gao, Xiaonan Jiang, Songjie Bi, D. Matthews, S. Schaefer, X. Liu

引用次数: 2

Radar Cross Section Measurement Comparison of UAVs at C-band and V-band 无人机c波段和v波段雷达截面测量比较

2019 IEEE 20th Wireless and Microwave Technology Conference (WAMICON) Pub Date : 2019-04-01 DOI: 10.1109/WAMICON.2019.8765431

Oday Bshara, Yuqiao Liu, K. Dandekar

引用次数: 0

Design of a Novel THz Sensor for Structural Health Monitoring Applications 一种用于结构健康监测的新型太赫兹传感器设计

2019 IEEE 20th Wireless and Microwave Technology Conference (WAMICON) Pub Date : 2019-04-01 DOI: 10.1109/WAMICON.2019.8765467

J. Pavia, M. Ribeiro, C. K. Sarikaya, D. Akbar, H. Altan, N. Souto

{"title":"Design of a Novel THz Sensor for Structural Health Monitoring Applications","authors":"J. Pavia, M. Ribeiro, C. K. Sarikaya, D. Akbar, H. Altan, N. Souto","doi":"10.1109/WAMICON.2019.8765467","DOIUrl":"https://doi.org/10.1109/WAMICON.2019.8765467","url":null,"abstract":"In this paper, we propose a study on the characterization, design and simulation of a THz sensor for applications in Structural Health Monitoring (SHM). The proposed sensor is assembled using two frequency selective surfaces (FSSs) based on metamaterial wire resonators. We present a theoretical model to describe its electromagnetics which is used not only to understand the physical principles underlying the functioning of the sensor but also to determine a set of optimized parameters for its operation in the THz window from 395 GHz to 455 GHz. We present our numerical simulations, involving both electromagnetic and mechanical simulation techniques, to determine the reflectance profile of the sensor as a function of applied force. In this study we considered the possibility of using two thermoplastic polymers as host materials: High-Density PolyEthylene (HDPE) and PolyTetraFluoroEthylene (PTFE). The two sensors have a good dynamic range and comparable characteristics. However, we found that with HDPE it is possible to construct a sensor with a more linear response, although not as sensitive as in the case of PTFE. With HDPE we are able to pass from a situation of full transparency to almost full opacity using only its linear operating zone.","PeriodicalId":328717,"journal":{"name":"2019 IEEE 20th Wireless and Microwave Technology Conference (WAMICON)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122744844","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

High Power and High Bandwidth Digital Three-Way Doherty Power Amplifier 大功率、高带宽数字三通多尔蒂功率放大器

2019 IEEE 20th Wireless and Microwave Technology Conference (WAMICON) Pub Date : 2019-04-01 DOI: 10.1109/WAMICON.2019.8765455

Popp Daniel, G. Fischer

{"title":"High Power and High Bandwidth Digital Three-Way Doherty Power Amplifier","authors":"Popp Daniel, G. Fischer","doi":"10.1109/WAMICON.2019.8765455","DOIUrl":"https://doi.org/10.1109/WAMICON.2019.8765455","url":null,"abstract":"This paper introduces an enhanced combiner architecture for high power and high bandwidth Three-Way Doherty Power Amplifier. The combiner is mathematical analyzed and two antithetic digital driven Doherty amplifiers are designed. The first one aims for high Back-off efficiency across the target bandwidth while the second one was designed for direct load matching. Both Doherty amplifiers feature a peak power of 61 dBm. The challenges for designing amplifiers with such high peak power are the absorption of the large transistor parasitics and matching the low impedance environment to the load. The proposed combiner architecture features transformer offset lines at all amplifier cores allowing the cancellation of parasitics as well as optimization for broadband performance. The first Doherty amplifier uses a broadband multi-step transformer for load matching and features high Back-off efficiency across the target bandwidth. It achieves a fractional bandwidth of 36.4% and a peak output power of 61dBm with a power ripple less than 1 dB. The combiner of the second Doherty amplifier transforms the low impedance environment to the desired load termination. It is able to meet the design goals across the frequency band and even covers a broad region outside the band. It has a fractional bandwidth of 43.5% and a peak output power of 61dBm with a power ripple less than 1 dB. Both Doherty amplifiers are using 500W GaN HEMT transistors from Wolfspeed. The designs and simulations are done with the corresponding Wolfspeed non-linear model.","PeriodicalId":328717,"journal":{"name":"2019 IEEE 20th Wireless and Microwave Technology Conference (WAMICON)","volume":"61 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114186524","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Least Square Regressor Selection Based Detection for Uplink 5G Massive MIMO Systems 基于最小二乘回归选择的上行5G海量MIMO系统检测

2019 IEEE 20th Wireless and Microwave Technology Conference (WAMICON) Pub Date : 2019-04-01 DOI: 10.1109/WAMICON.2019.8765469

Robin Chataut, R. Akl, U. K. Dey

引用次数: 14

Toward a High-Power High-Isolation Wideband Plasma Limiter 大功率高隔离宽带等离子体限幅器研究

2019 IEEE 20th Wireless and Microwave Technology Conference (WAMICON) Pub Date : 2019-04-01 DOI: 10.1109/WAMICON.2019.8765450

Z. V. Missen, A. Semnani, D. Peroulis

引用次数: 4

3D Microstrip Line Taper on Ultra-low Dielectric Constant Substrate 超低介电常数基片上的三维微带线锥度

2019 IEEE 20th Wireless and Microwave Technology Conference (WAMICON) Pub Date : 2019-04-01 DOI: 10.1109/WAMICON.2019.8765457

Nawaf R. Almuqati, H. Sigmarsson

引用次数: 0

Simplified Tapped Delay Line Architecture for Active Cancellation in a 2×2 IBFD MIMO Transceiver 用于2×2 IBFD MIMO收发器有源消除的简化抽头延迟线结构

2019 IEEE 20th Wireless and Microwave Technology Conference (WAMICON) Pub Date : 2019-04-01 DOI: 10.1109/WAMICON.2019.8765447

M. Knox

引用次数: 0