2019 IEEE 20th Wireless and Microwave Technology Conference (WAMICON)最新文献

{"title":"Wideband Doherty Power Amplifier in Quasi-Balanced Configuration","authors":"Yuchen Cao, Haifeng Lyu, Kenle Chen","doi":"10.1109/WAMICON.2019.8765468","DOIUrl":"https://doi.org/10.1109/WAMICON.2019.8765468","url":null,"abstract":"A new architecture of wideband Doherty power amplifier is presented based on a quasi-balanced configuration. It is revealed that by grounding the isolation port of the branch-line quadrature coupler at the output of a balanced PA, a standard Doherty circuitry can be formed. Based on this discovery, this paper exhibits the design of wideband Doherty power amplifier using wideband standalone PAs and wideband quadrature couplers. It is further unveiled that by loading the isolation port with different reactance, an optimal Doherty behavior can be maintained across the entire frequency range. As a proof-of-concept demonstration, a first-pass prototype experimentally presents desired Doherty characteristics across a wide bandwidth from 1.9 to 2.5 GHz, achieving 50–78% of peak efficiency and 43–56% of efficiency at 6-dB power back-off.","PeriodicalId":328717,"journal":{"name":"2019 IEEE 20th Wireless and Microwave Technology Conference (WAMICON)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128419630","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"[WAMICON 2019 Blank Page]","authors":"Jennifer Arendell, Holden Clark, N. Jeong, Seongcheol Jeong, T. Weller","doi":"10.1109/wamicon.2019.8765435","DOIUrl":"https://doi.org/10.1109/wamicon.2019.8765435","url":null,"abstract":"","PeriodicalId":328717,"journal":{"name":"2019 IEEE 20th Wireless and Microwave Technology Conference (WAMICON)","volume":"58 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129533420","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Challenges of Designing Heterogenous (multi-PDK) Packages","authors":"John Park","doi":"10.1109/WAMICON.2019.8765438","DOIUrl":"https://doi.org/10.1109/WAMICON.2019.8765438","url":null,"abstract":"Given the complexity of today’s chips, packages and boards, ICs based on both silicon and non-silicon materials are now required to design optimal high-performance systems. As a result, engineers are integrating multiple heterogeneous technologies in a single product, which not only affects the performance and functionality of ICs but also introduces a new set of challenges for semiconductor companies. In 2017, Cadence announced a novel, front-to-back cross-platform solution that streamlines and automates the design of a package or module featuring off-chip devices and multiple ICs based on differing process design kits (PDKs).In addition to streamlining the front-to-back design of chips and packages, this solution allows IC designers the ability to seamlessly include system-level layout parasitics in the IC verification flow. This help to reduce design cycles by seamlessly combining package/board layout connectivity data with the IC layout parasitic electrical model. The resulting automatically generated “system-aware” schematic can then be easily used to create a testbench for final circuit-, system-level simulation. Previously, designers were only able to include system-level layout parasitics based on time-consuming ad hoc methods. By automating this entire flow, the new Cadence solution eliminates the highly manual and error-prone process of integrating system-level layout parasitic models back into the IC designer’s flow, reducing days of work to mere minutes.In late 2018, Cadence announced a partnership with National Instruments coupled to the second generation of this solution. The new solution further streamlines the concurrent design of multi-die systems and sub-systems while adding additional 3D electromagnetic (EM) extraction/modeling capabilities and additional capabilities for package/module-level layout. This effort takes designing chips, packages and boards to a whole new level…something we call “System Design Enablement”. This presentation will cover the current challenges of designing heterogenous packages/modules and provide an overview of the new Cadence Virtuoso RF Solution.","PeriodicalId":328717,"journal":{"name":"2019 IEEE 20th Wireless and Microwave Technology Conference (WAMICON)","volume":"91 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127174291","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A NEW Approach to 5G/LTE OTA Production Testing","authors":"M. Diessner","doi":"10.1109/WAMICON.2019.8765459","DOIUrl":"https://doi.org/10.1109/WAMICON.2019.8765459","url":null,"abstract":"With smaller geometries, higher operating frequencies and greater levels of integration, manufacturers of 5G devices are forced to perform over the air testing. Peak power sensors and noise sources are an ideal alternative to expensive test equipment for 5G OTA calibration, verification, and measurements. The presentation will offer why Amplified AWGN Noise Modules offer an alternative OFDM-like signal to calibrate, verify, and make measurements in over-the-air (OTA) applications. We will also discuss how RF Power Sensors offer a fast, simple, cost-effective alternative for measuring signals with high peak-to-average ratios or crest factors as figure of merit.","PeriodicalId":328717,"journal":{"name":"2019 IEEE 20th Wireless and Microwave Technology Conference (WAMICON)","volume":"74 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115412074","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Design of Cladded Dielectric Rod Antennas","authors":"Gabriel L. Saffold, T. Weller","doi":"10.1109/WAMICON.2019.8765464","DOIUrl":"https://doi.org/10.1109/WAMICON.2019.8765464","url":null,"abstract":"A dielectric rod antenna is designed in Kuband using established principles for designing maximum gain surface wave antennas in free space as in [1]. The design principles are modified to their most general form and applied to the design of three dielectric rod antennas embedded in a dielectric cladding of different dielectric constant: ∊r = 1.0 (free space ”cladding”), ∊r = 1.6 (3D printed ABS with 50% in-fill), and ∊r = 2.6 (3D printed ABS with 100% in-fill). The antennas are simulated and measured to determine agreement between them and thereby validate the design procedure.","PeriodicalId":328717,"journal":{"name":"2019 IEEE 20th Wireless and Microwave Technology Conference (WAMICON)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116627826","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A 5/10/20/40 MHz 5th Order Active-RC Chebychev LPF for 802.11abg IF Receiver in 0.18 μm CMOS Technology","authors":"S. Delshadpour","doi":"10.1109/WAMICON.2019.8765462","DOIUrl":"https://doi.org/10.1109/WAMICON.2019.8765462","url":null,"abstract":"A programmable 5/10/20/40 MHz BW active-RC filter in 0.18 um CMOS for a dual band 802.11 abg application is presented. This filter has a programmable high pass corner of 0.1/0.35/0.7 MHz and an in-band gain of 12dB. It is a Chebychev Thomas 1 implementation with low sensitivity to components variation with an integrated offset cancellation circuit that removes output offset of the mixer and filter together and sets the high pass corner. It drains 3.8/4.5/5.2/6.04mA for 5/10/20/40MHz BW from a 1.8V supply. The one-time frequency tuning during chip power up and BW adjustment is being done by a programmable capacitor bank.Each 5th order core has an area of 0.49 mm2 while two I & Q filters with RC tuning circuits have an area of 1.42 mm2.It has an IM3 of −41dBC, input referred noise of 18nV/sqrt(Hz) and output offset of 2mV.","PeriodicalId":328717,"journal":{"name":"2019 IEEE 20th Wireless and Microwave Technology Conference (WAMICON)","volume":"68 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131785916","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Frequency-Agile Coplanar-Waveguide-Fed Miniaturized Helical Resonator Filters","authors":"Eivy Arroyo-Diaz, S. Saeedi, H. Sigmarsson","doi":"10.1109/WAMICON.2019.8765449","DOIUrl":"https://doi.org/10.1109/WAMICON.2019.8765449","url":null,"abstract":"A tunable helical resonator filter utilizing varactor diodes is presented for the first time. Coplanar waveguides are employed as a transition from the ports to the tapped connection, to the helical resonators. This novel configuration not only provides external coupling to the resonators but also allows for two transmission zeros (TZs), one on each side of the passband. A helical resonator with variable capacitors was fabricated and characterized as a building block for the proposed filter. The tunable helical resonator yields a measured unloaded quality factor (Q) of 192–227 with a variable center frequency of 150–230 MHz. Also, a 4% second-order bandpass filter was designed, fabricated, and tested to demonstrate the concept. The measured second-order bandpass filter achieves a variable center frequency of 170–230 MHz with an insertion loss of 0.9–1.3 dB.","PeriodicalId":328717,"journal":{"name":"2019 IEEE 20th Wireless and Microwave Technology Conference (WAMICON)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133835657","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Coupling-Cancellation-Antenna for Improving Doppler Radar Motion Measurement Accuracy","authors":"Songjie Bi, Xiaonan Jiang, Xiaomeng Gao, X. Liu","doi":"10.1109/WAMICON.2019.8765442","DOIUrl":"https://doi.org/10.1109/WAMICON.2019.8765442","url":null,"abstract":"One of the challenges in direct conversion Doppler radar lies in the dc offset resulted from antenna coupling. The dc offset may saturate the baseband amplifiers, preventing sufficient amplification of the received signal. In this work, a Coupling-Cancellation-Antenna (CCA) was implemented in the radar front end to enhance radar detection accuracy by minimizing the TX-RX antenna coupling. The idea is to have two transmitting antennas fed by signals with 180° phase difference such that the two signals cancel at the RX antenna. As a result, a larger receiver gain can be used to improve the signal to noise ratio without saturating the baseband output. Experimental validations of the CCA concept demonstrate 37-dB reduction in the TX-RX coupling. Furthermore, the CCA method reduces the detection error from 15.8% to 2.4%.","PeriodicalId":328717,"journal":{"name":"2019 IEEE 20th Wireless and Microwave Technology Conference (WAMICON)","volume":"16 10","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120906132","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Simulation Enabled Design of Microwave Filters and Multiplexers","authors":"T. S. Beukman, Carlos Gahete, C. Vicente, M. Wild","doi":"10.1109/WAMICON.2019.8765461","DOIUrl":"https://doi.org/10.1109/WAMICON.2019.8765461","url":null,"abstract":"In this communication different approaches are illustrated for the design of microwave filters, diplexers and manifold-coupled multiplexers, using commercially available simulation tools and solvers. An integral part to these workflows is the efficient usage of the coupling matrix for the synthesis of coupled-resonator networks.","PeriodicalId":328717,"journal":{"name":"2019 IEEE 20th Wireless and Microwave Technology Conference (WAMICON)","volume":"353 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115920546","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Physics-based Compact Models: An Emerging Trend in Simulation-based GaN HEMT Power Amplifier Design","authors":"S. Khandelwal","doi":"10.1109/WAMICON.2019.8765472","DOIUrl":"https://doi.org/10.1109/WAMICON.2019.8765472","url":null,"abstract":"An important and impactful trend in GaN HEMT transistor model representation is the emergence of physics-based compact models. Developed from device physics, these models offer: high scalability, close connection to technology for deign-technology co-optimization, ability to model statistical manufacturing variations, and ability to model long-term device degradation effects. The novel features of these models will be compared with the traditional empirical modeling approaches. Results achieved so far with these models will be discussed. As the power amplifier design requirements become increasingly stringent, physics-based compact models can become enablers of next generation simulation-based power amplifier designs.","PeriodicalId":328717,"journal":{"name":"2019 IEEE 20th Wireless and Microwave Technology Conference (WAMICON)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121970670","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}