2007 8th International Conference on Electronic Packaging Technology最新文献_第8页

The Growth and Influencing Factors of Voids in SnAg Solder Bump and their Impact on Interfacial Bond Strength SnAg钎料凸起中空隙的生长、影响因素及其对界面结合强度的影响

2007 8th International Conference on Electronic Packaging Technology Pub Date : 2007-08-01 DOI: 10.1109/ICEPT.2007.4441452

Xiaoqin Lin, L. Luo

引用次数: 2

Ultrasonic Applied in Super Precision polishing of Magnetic Recording Heads 超声波在磁头超精密抛光中的应用

2007 8th International Conference on Electronic Packaging Technology Pub Date : 2007-08-01 DOI: 10.1109/ICEPT.2007.4441470

Rulin Shen, J. Zhong

{"title":"Ultrasonic Applied in Super Precision polishing of Magnetic Recording Heads","authors":"Rulin Shen, J. Zhong","doi":"10.1109/ICEPT.2007.4441470","DOIUrl":"https://doi.org/10.1109/ICEPT.2007.4441470","url":null,"abstract":"In the traditionary nanogrinding way, a sub-nanometer smooth surface can be achieved, but the PTR can be only controlled under ten nanometers. To find a new way to reduce the PTR. ultrasonic was applied in the polishing experiment. At first, the experiment with two kinds of samples. AlTiC bulk and NiFe bulk were carried out in free abrasive lapping way with the float-piece polisher. It was discovered that the material removal rate and the roughness of surface is improved in different extent of different material, the material removal rate (MRR) of the AlTiC bulk was increased from 10 nm/m to 16 nm/m. while the MRR of the NiFe bulk was increased from 23 nm/m to 30 nm/m. Encouraged by the result of the experiment, the specimen of 70 mm*1.25 mm rowbar with 60 GMR magnetic head was polished in the same condition, as a result, the PTR was reduced from 65 nm to 45 nm. Furthermore, the ultrasonic was introduced into nanogrinding of recording head. In this way. the PTR was controlled at lnm or so and smoother surface was achieved. Two kinds of mechanism about the role of the ultrasonic were prompt to explain in what way that the material removal rate is improved and why the improved ratio is different in different materials in the polishing.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134243583","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Effect of Aging on the Interfacial Reaction between Sn-9Zn-xCr Solder and Cu Substrate 时效对Sn-9Zn-xCr钎料与Cu衬底界面反应的影响

2007 8th International Conference on Electronic Packaging Technology Pub Date : 2007-08-01 DOI: 10.1109/ICEPT.2007.4441465

Xi Chen, A. Hu, Ming Li, D. Mao

引用次数: 4

Feasibility of Solid State Bonding for Sn-Ag-Cu Solder Bumps in Ambient Air 环境空气中Sn-Ag-Cu钎料凸点固态结合的可行性

2007 8th International Conference on Electronic Packaging Technology Pub Date : 2007-08-01 DOI: 10.1109/ICEPT.2007.4441378

Yinghui Wang, T. Suga

引用次数: 0

The Study for Thermal Analysis Technology of Three-Dimension SRAM Component 三维SRAM元件热分析技术研究

2007 8th International Conference on Electronic Packaging Technology Pub Date : 2007-08-01 DOI: 10.1109/ICEPT.2007.4441402

Yusheng Cao, T. Jiang, Jun Liu, B. Lian

引用次数: 7

Modeling and Simulation of Laser Lift-off Process for LED's Substrates LED基板激光提升过程的建模与仿真

2007 8th International Conference on Electronic Packaging Technology Pub Date : 2007-08-01 DOI: 10.1109/ICEPT.2007.4441496

Liuxi Tan, Jia Li, Sheng Liu

{"title":"Modeling and Simulation of Laser Lift-off Process for LED's Substrates","authors":"Liuxi Tan, Jia Li, Sheng Liu","doi":"10.1109/ICEPT.2007.4441496","DOIUrl":"https://doi.org/10.1109/ICEPT.2007.4441496","url":null,"abstract":"As high power LEDs develop rapidly, sapphire substrate on which LED's chips are grown, cannot meet the needs of the increasing performance any longer. Therefore, transfer of the devices from the former sapphire substrates to more thermally and electrically conductive receptor substrates is recommended. Laser peeling has been a new technology of separating films of GaN from the substrate on which they are grown. Experience shows that the films can be debonded intactly when the laser parameters are well controlled. In this contribution, the mechanics of the laser-assisted debonding of GaN films on sapphire, silicon and copper substrates is considered so that the specific parameters can be optimized in order to achieve a feasible process scheme that may be used in the industry. During the simulation, the knowledge of interfacial crack generation between dissimilar materials is considered to be the essential principle of the process of \"liftoff\". Failure of the interfaces results in the debonding. Whatever, the films of chips should not be damaged in the duration of the \"lift-off\" process. A few important issues such as temperature distribution, stress distribution and energy release rate are raised in terms of examining whether the films are likely to be damaged.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114606745","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Effect of Thermal-Shearing Induced Microstructural Coarsening on SnAgCu Microelectronic Solder 热剪切诱导SnAgCu微电子焊料显微组织粗化的影响

2007 8th International Conference on Electronic Packaging Technology Pub Date : 2007-08-01 DOI: 10.1109/ICEPT.2007.4441428

L. Qi, Jihua Huang, Xingke Zhao, Huanshui Zhang

引用次数: 0

Predicting the Reliability of Electronic Products 电子产品可靠性预测

2007 8th International Conference on Electronic Packaging Technology Pub Date : 2007-08-01 DOI: 10.1109/ICEPT.2007.4441552

Jie Gu, M. Pecht

引用次数: 17

Design of Solder Joint for Self-Alignment in Optical Fiber Attachment Soldering 光纤附件焊接中自对准焊点的设计

2007 8th International Conference on Electronic Packaging Technology Pub Date : 2007-08-01 DOI: 10.1109/ICEPT.2007.4441441

Wei Zhang, Chunqing Wang, Yanhong Tian

{"title":"Design of Solder Joint for Self-Alignment in Optical Fiber Attachment Soldering","authors":"Wei Zhang, Chunqing Wang, Yanhong Tian","doi":"10.1109/ICEPT.2007.4441441","DOIUrl":"https://doi.org/10.1109/ICEPT.2007.4441441","url":null,"abstract":"The self-alignment motion of optical fiber is critical to the low-cost and high-precision direct-coupling technology in optoelectronic packaging. In this research, the self-alignment method by using surface tension of molten solder and by adopting specific pad shape was proposed. First, the self-alignment model of solder joint in fiber attachment soldering was developed by using the public domain software called Surface Evolver and the three-dimensional (3D) geometry of solder joint with different pad shape was analyzed. Then, the self-alignment behavior of solder joint with an initial yaw misalignment was discussed and the theoretical equilibrium positions of five different pad shapes were calculated. Next, experiments were done to examine the theoretical equilibrium positions of these pads. The numerical results show that the theoretical equilibrium positions of ellipse pad are the major axis of ellipse, and it is much more appropriate for self-alignment. And the diamond pad and the combined pad have also self-alignment effects, but the square and the crisscross pad are not appropriate for self-alignment due to more than two equilibrium positions. The experimental results show the solder joint with initial yaw angle can be self-aligned to the theoretical equilibrium position of these five pads and solder joint of ellipse pad demonstrates smaller alignment error than that of diamond and combined pads.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"26 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125743473","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

The Components Layout Optimization of Circuit Module Based on the Artificial Nerve Network 基于人工神经网络的电路模块元器件布局优化

2007 8th International Conference on Electronic Packaging Technology Pub Date : 2007-08-01 DOI: 10.1109/ICEPT.2007.4441388

H. Huang, De-jian Zhou, Zhaohua Wu

引用次数: 0