2007 8th International Conference on Electronic Packaging Technology最新文献_第9页

Effects of Element Partition on the Fatigue Life Predictions of Lead-Free Solder Joints 元素分配对无铅焊点疲劳寿命预测的影响

2007 8th International Conference on Electronic Packaging Technology Pub Date : 2007-08-01 DOI: 10.1109/ICEPT.2007.4441502

W. Jong, H. Tsai, Ching-Tzu Huang

{"title":"Effects of Element Partition on the Fatigue Life Predictions of Lead-Free Solder Joints","authors":"W. Jong, H. Tsai, Ching-Tzu Huang","doi":"10.1109/ICEPT.2007.4441502","DOIUrl":"https://doi.org/10.1109/ICEPT.2007.4441502","url":null,"abstract":"On the complicated manufacturing processes of the high- density packages, the reliability of solder bumped IC chip on substrate and/or PCB has been confirmed by many researchers through thermal cycling tests, mechanical tests and computational modeling. In this study, the high-density package. 256-pin plastic ball grid array (PBGA) on printed circuit board (PCB) subjected to temperature cycling with the effects of element spacing ratio on the thermal- fatigue life of lead-free (95.5Sn-3.9Ag-0.6Cu) solder joints are investigated by using the validated finite-element analyses. Tins research studies the determination of thermal- fatigue life, creep responses and creep strain energy density per cycle with the various spacing ratio (-1, -5. -10, and -15) of the meshed lead-free solder joint for a range of cycling temperatures. Temperature loads are applied to the models that represent the cycling environment of chamber. After starting at room temperature, the model is subject of 5 cycles consisting of 10-minute ramps and 10- minute holds at each of 10 degC and 100 degC. Five cycles are executed in order to confirm the stabilization of the creep responses. For all the cases, the lead-free solder is assumed to obey the Garofalo- Arrhenius creep constitutive law.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124776189","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Application of Robust Design on the Optimal Process Design of Thermo-mechanical Reliability of PBGA Solder Joint 稳健设计在PBGA焊点热机械可靠性工艺优化设计中的应用

2007 8th International Conference on Electronic Packaging Technology Pub Date : 2007-08-01 DOI: 10.1109/ICEPT.2007.4441508

Xiao-qing Xiao, Jicheng Zhou, Y. En, Ni Chen

引用次数: 0

The Effect of Cavities and Channels on the Strength of LTCC Substrate 空腔和孔道对LTCC衬底强度的影响

2007 8th International Conference on Electronic Packaging Technology Pub Date : 2007-08-01 DOI: 10.1109/ICEPT.2007.4441383

Yangfei Zhang, M. Miao, S. Bai, Yu-feng Jin

引用次数: 1

Study of Nano-grinding for GMR Magnetic Recording Head GMR磁记录头的纳米磨削研究

2007 8th International Conference on Electronic Packaging Technology Pub Date : 2007-08-01 DOI: 10.1109/ICEPT.2007.4441476

Rulin Shen, C. Shuai, J. Zhong

{"title":"Study of Nano-grinding for GMR Magnetic Recording Head","authors":"Rulin Shen, C. Shuai, J. Zhong","doi":"10.1109/ICEPT.2007.4441476","DOIUrl":"https://doi.org/10.1109/ICEPT.2007.4441476","url":null,"abstract":"The objective of this research is to better understand in what way the ultra smooth hard disk magnetic head (the individual head also called 'slider') surface is formed in nanogrinding. A float-piece polisher was used to achieve ultra smooth and planar surface in nano-grinding way. The SEM was used to observe the diamond abrasive used in nano-grinding and the plate embedded with diamond abrasive. The slider surface was measured with SEM and AFM before and after nano-grinding. Though the micro-cutting of the continuous plane of the slider surface may exit, it was demonstrated that the un-continuous asperity of the slider surface can't be ignored in nano-grinding. According to the statistic analysis of the slider surface, the asperities are removed and replaced by a series of smaller asperities step by step, in this way, smoother surface is achieved gradually, and finally, a sub-nanometer smooth surface was achieved. A theoretical model was developed to illustrate the removal of single asperity removed by abrasive. The removal force taking by a single abrasive was calculated according to the model. Pole tip can be protected in some extent because of the regular arrange of the abrasive, so more planar slider surface was achieved in nano-grinding. Combined with the model and the distribution of the asperity of slider surface, the quality of the slider surface can be estimated and the nano-grinding procedure can be optimized.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127640715","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Research of 3D Routing System of Electronic Equipment 电子设备三维布线系统研究

2007 8th International Conference on Electronic Packaging Technology Pub Date : 2007-08-01 DOI: 10.1109/ICEPT.2007.4441393

Z. Wu, Dejian Zhou, Yiiifeng Wu

引用次数: 0

Efficiency Evaluation of Full-Wave Electromagnetic Simulation Techniques in 3D WB-PBGA Package Modeling 三维WB-PBGA封装建模全波电磁仿真技术效率评价

2007 8th International Conference on Electronic Packaging Technology Pub Date : 2007-08-01 DOI: 10.1109/ICEPT.2007.4441405

J. Kong, L. Lau

引用次数: 6

Aromatic Polyimide Resins for High Density Packaging Substrates 高密度封装基板用芳香族聚酰亚胺树脂

2007 8th International Conference on Electronic Packaging Technology Pub Date : 2007-08-01 DOI: 10.1109/ICEPT.2007.4441456

Hongyan Xu, Hai-xia Yang, Jingang Liu, Zhiqiang Tao, L. Fan, Shiyang Yang

{"title":"Aromatic Polyimide Resins for High Density Packaging Substrates","authors":"Hongyan Xu, Hai-xia Yang, Jingang Liu, Zhiqiang Tao, L. Fan, Shiyang Yang","doi":"10.1109/ICEPT.2007.4441456","DOIUrl":"https://doi.org/10.1109/ICEPT.2007.4441456","url":null,"abstract":"Molecular weight-controlled aromatic polyimide resins for fabrication of high density IC packaging substrates have been developed. The aromatic polyimide resins showed good laminate processability, which could easily dissolve in organic solvent to give low viscosity solution for impregnation of E-glass fiber cloths. After completely removal of the organic volatile, the polyimide/glass fiber (PI/GF) cloth prepreg could be plied up and then thermally cured at 280degC to give the PI/GF laminate suitable as packaging substrate core. Experimental results indicated that the polyimide laminates have the desirable characteristics for packaging substrate core, including 1) excellent thermal stability with initial thermal decomposition temperature of >500degC, CLE(in-plane) of 15-19 ppm/degC and glass transition temperature of >220degC; 2) good mechanical properties with flexural strength of >430 Ma and flexural modulus of 20 GPa, tensile strength of >230 MPa and impact toughness of 84 kJ/m2; 3) great electrical insulating and dielectric properties with volume resistivity of >1016 Omegaldrcm, dielectric constant of 4.1 and dissipation factor of 0.005 etc.; and 4) high peel strength of copper foil to laminate in Cu-claded laminate (>1.5N/mm).","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117280093","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Evaluation of Wettability of Composite Solder Alloy Reinforced with Silver and Copper Particles 银、铜颗粒增强复合钎料合金的润湿性评价

2007 8th International Conference on Electronic Packaging Technology Pub Date : 2007-08-01 DOI: 10.1109/ICEPT.2007.4441443

B. An, C.M.L. Wu

{"title":"Evaluation of Wettability of Composite Solder Alloy Reinforced with Silver and Copper Particles","authors":"B. An, C.M.L. Wu","doi":"10.1109/ICEPT.2007.4441443","DOIUrl":"https://doi.org/10.1109/ICEPT.2007.4441443","url":null,"abstract":"Composite solder pastes were made so that composite solders can be manufactured using the reflow process. Using this approach, the wettability of Sn-3.0Ag-0.5Cu (SAC) composite solder reinforced with micro-sized Ag and Cu particles was investigated by three methods: temperature profile, solder beading and copper clad laminate (CCL) wetting. The composite solder on copper coupon showed less wetting force in the temperature profile test than that of SAC due to the depression of flow of the molten solder by the Ag or Cu particles. It is also noted that during the soldering dwell time, the wetting force changed with time in either small step-wise force changes, or mild force increase, indicating some dynamical occurrence in the molten solder with reinforcing particles. The solder beading test revealed that the solder beading duration of the composite solder is fast than that of the SAC solder, possibly due to the excellent thermal conductivity of reinforcing particles. The CCL wetting tests pointed out that with the increase in weight proportion of reinforcing particles, the composite solder exhibited either smaller spreading area, or dull appearance with Ag particles added paste, and leaching of Cu particles into flux residues when Cu particles were used as reinforcement. The examination of the microstructure of SAC reinforced with 1% Ag particles revealed that although Ag particles quickly reacted with the molten solder and formed Ag3Sn intermetallic compounds, which distributed 11011-uniformly through the thickness of the solder. When reinforced with 1% Cu particles, the latter reacted with SAC to form Cu6Sn5 reinforcing particles, which dispersed also non-uniformly in the solder matrix. It is also noted that leaching of Cu particles through the flow of flux occurred. In view of the present results, further exploration for improvement in the manufacturability of the composite solder alloys is needed.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"80 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130872463","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

The Impact of Defect formed in Hot-cutting Process on Reliability of Ceramic Packaging And A Novel Structure Design Concept 热切割过程中形成的缺陷对陶瓷封装可靠性的影响及一种新的结构设计理念

2007 8th International Conference on Electronic Packaging Technology Pub Date : 2007-08-01 DOI: 10.1109/ICEPT.2007.4441525

C. Zeng, Chunqing Wang, Yanhong Tian, Lingchao Kong

引用次数: 0

Characterization and Modelling of Cure Kinetics of A Molding Compound 一种成型化合物固化动力学的表征与建模

2007 8th International Conference on Electronic Packaging Technology Pub Date : 2007-08-01 DOI: 10.1109/ICEPT.2007.4441400

C. Qian, K. Jansen, L. Ernst, C. Bohm, A. Kessler, H. Preu, M. Stecher

引用次数: 4