Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)最新文献_第9页

Localized plastic bonding for micro assembly, packaging and liquid encapsulation 用于微组装、包装和液体封装的本地化塑料粘接

Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090) Pub Date : 2001-01-21 DOI: 10.1109/MEMSYS.2001.906476

Yu-Chuan Su, Liwei Lin

{"title":"Localized plastic bonding for micro assembly, packaging and liquid encapsulation","authors":"Yu-Chuan Su, Liwei Lin","doi":"10.1109/MEMSYS.2001.906476","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906476","url":null,"abstract":"Localized plastic bonding schemes for plastics-to-silicon, plastics-to-glass, and plastics-to-plastics assembly, packaging and liquid encapsulation have been successfully demonstrated. Aluminum thin films are deposited and patterned as resistive heaters for the purpose of localized heating and bonding. In the experiments, plastic thin films are successfully bonded on silicon, glass, and plastic substrates in 0.25 seconds under a contact pressure of 0.4 MPa. Local temperature at the bonding interface can reach more than 140/spl deg/C for bonding and the global substrate remains at room temperature. The approach of localized heating for bonding of plastic materials while maintaining low temperature globally enables direct sealing of polymer based MEMS processing without using additional adhesive and without damaging pre-existing, temperature-sensitive substances on the bonding substrate. Water encapsulation by plastics-to-plastics bonding is performed to demonstrate the capability of low temperature processing. As such, this technique can be applied broadly in plastic assembly, packaging and liquid encapsulation for microsystems, including microfluidic devices.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130831117","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 25

Flexible microelectrode arrays with integrated insertion devices 具有集成插入装置的柔性微电极阵列

Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090) Pub Date : 2001-01-21 DOI: 10.1109/MEMSYS.2001.906517

D.P. O'Brien, T. Nichols, M. Allen

{"title":"Flexible microelectrode arrays with integrated insertion devices","authors":"D.P. O'Brien, T. Nichols, M. Allen","doi":"10.1109/MEMSYS.2001.906517","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906517","url":null,"abstract":"Flexible microelectrode arrays (FMAs) allow interfacing to delicate living tissues such as neural tissue with a minimum of physical disruption of that tissue during and after insertion. This physical disruption is minimized since the compliant FMAs can deform along with the tissue. However, a problem with these arrays is the insertion and subsequent precise positioning of the arrays in the tissue. Previous FMAs required hand assembly of the flexible array with another rigid structure. This may not be feasible if the dimensions of the flexible array are too small. In this work, FMAs with integrated rigid insertion devices were designed, fabricated, and assessed. Thin-film technology and electrodeposition were used to create flexible arrays with attached rigid insertion devices in a single sequence of fabrication steps. These arrays can be designed in two different configurations. The first type allows for flexible electrodes to be sewn through a nerve. The second allows for insertion into a surface such as the cerebral cortex or the spinal cord. After insertion, the rigid portion of the FMA is removed from the tissue with the flexible portion remaining behind. These two implantation schemes were tested on tissue models and found to be straightforward and reliable. In addition, comparisons of the potential to cause tissue damage between flexible and rigid arrays of similar dimensions were made under three different conditions of mechanical perturbation. In all cases, FMAs caused no damage to the tissue model above that caused by the original electrode insertion track while rigid arrays caused significant tearing. Finally, FMAs were shown to successfully stimulate neural tissue in an experimental setting.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126638421","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 40

High throughput optical near-field aperture array for data storage 用于数据存储的高通量光学近场孔径阵列

Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090) Pub Date : 2001-01-21 DOI: 10.1109/MEMSYS.2001.906540

P. N. Minh, T. Ono, S. Tanaka, K. Goto, M. Esashi

引用次数: 4

A centrally-clamped parallel-beam bistable MEMS mechanism 一种中心箝位平行光束双稳MEMS机构

Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090) Pub Date : 2001-01-21 DOI: 10.1109/MEMSYS.2001.906551

J. Qiu, Jeffrey H. Lang, Alexander H. Slocum

引用次数: 100

Polyimide as the pedestal of batch fabricated micro-ball lens and micro-mushroom array 聚酰亚胺作为批量制造微球透镜和微蘑菇阵列的基座

Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090) Pub Date : 2001-01-21 DOI: 10.1109/MEMSYS.2001.906547

Yuh-Sheng Lin, C. Pan, K. Lin, Shih-Chou Chen, Jauh-Jung Yang, Jei-Pin Yang

引用次数: 23

AFM bending testing of nanometric single crystal silicon wire at intermediate temperatures for MEMS 用于MEMS的纳米单晶硅线在中温下的AFM弯曲测试

Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090) Pub Date : 2001-01-21 DOI: 10.1109/MEMSYS.2001.906497

Y. Isono, T. Namazu, T. Tanaka

{"title":"AFM bending testing of nanometric single crystal silicon wire at intermediate temperatures for MEMS","authors":"Y. Isono, T. Namazu, T. Tanaka","doi":"10.1109/MEMSYS.2001.906497","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906497","url":null,"abstract":"This paper focuses on revealing specimen size and temperature effects on plasticity of nanometric self-supported single crystal silicon (Si) wires for the design of high-density electronic and MEMS devices. Mechanical properties of nanometric Si wires were characterized by AFM bending testing at intermediate temperatures ranged from 295 to 573 K in high vacuum. The fabrication process of the nanometric Si wire has been previously reported at MEMS 2000, wherein the elastic properties at room temperature were also investigated by using specimen sizes ranging from nano- to millimeter-scale. This paper investigates elastic-plastic deformation behavior of the nanometric Si wires. Young's modulus of the nanometric Si shows temperature dependence but has no size effect. However, the bending strength, critical resolved shear stress and plastic strain range depend on specimen size and temperature. This research shows for the first time, that it is possible to induce plastic deformation in the nanometric wire at even 373 K, which is close to room temperature. AFM observations show that the slip line density depending on the specimen size and deformation temperature can determine the plastic strain range and the yield point of the nanometric Si wire at the intermediate temperatures.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"112 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115587443","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 13

Applications of MEMS to industrial inspection MEMS在工业检测中的应用

Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090) Pub Date : 2001-01-21 DOI: 10.1109/MEMSYS.2001.906510

M. Takeda

引用次数: 60

Performance of a MEMS based micro capillary pumped loop for chip-level temperature control 基于MEMS的微毛细管泵浦回路的芯片级温度控制性能

Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090) Pub Date : 2001-01-21 DOI: 10.1109/MEMSYS.2001.906569

K. Pettigrew, J. Kirshberg, K. Yerkes, D. Trebotich, D. Liepmann

引用次数: 38

A new monolithic micro biosensor for blood analysis 用于血液分析的新型单片微型生物传感器

Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090) Pub Date : 2001-01-21 DOI: 10.1109/MEMSYS.2001.906573

Joon-Ho Kim, Byoung-Gyun Kim, E. Yoon, Chul‐Hi Han

引用次数: 11

Magnetoelastic microsensors for environmental monitoring 用于环境监测的磁弹性微传感器

Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090) Pub Date : 2001-01-21 DOI: 10.1109/MEMSYS.2001.906532

C. Grimes, M. Jain, R.S. Singh, Q. Cai, A. Mason, K. Takahata, Y. Gianchandani

{"title":"Magnetoelastic microsensors for environmental monitoring","authors":"C. Grimes, M. Jain, R.S. Singh, Q. Cai, A. Mason, K. Takahata, Y. Gianchandani","doi":"10.1109/MEMSYS.2001.906532","DOIUrl":"https://doi.org/10.1109/MEMSYS.2001.906532","url":null,"abstract":"This paper reports on the operational characteristics, and application, of a new passive wireless micro-sensor platform based on magnetoelastic materials. We have used micro-electro-discharge machining (micro-EDM) to fabricate magnetoelastic micro-sensor arrays. In response to a time varying magnetic field, amorphous ferromagnetic magnetoelastic thin films efficiently convert magnetic energy into elastic energy. The elastic waves mechanically deform the sensor which, for ribbon shaped elements, has a characteristic mechanical resonant frequency that is a function of its length, elasticity, and material density. Since the magnetoelastic material is also magnetostrictive, as the sensor mechanically deforms it generates magnetic flux that extends remotely about the device, which can be detected by a pickup coil. The remote query capability of this sensor technology enables a host of new monitoring applications including in-situ and in-vivo experiments. The bare sensor is capable of measuring ambient temperature and pressure, liquid density, liquid viscosity, and fluid flow velocity. The sensor platform can be used for chemical sensing when used in combination with mass-changing chemically responsive layers. Using an array of the magnetoelastic sensors one can determine multiple environmental conditions simultaneously.","PeriodicalId":311365,"journal":{"name":"Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128556939","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 29