2021 IEEE International Symposium on Smart Electronic Systems (iSES) (Formerly iNiS)最新文献_第5页

Timing Side-Channel Attack Resistant Key Derivation Functions for Cryptosystems 密码系统的时序侧信道抗攻击密钥派生函数

2021 IEEE International Symposium on Smart Electronic Systems (iSES) (Formerly iNiS) Pub Date : 2021-12-01 DOI: 10.1109/iSES52644.2021.00096

K. Lata, A. Bansal

{"title":"Timing Side-Channel Attack Resistant Key Derivation Functions for Cryptosystems","authors":"K. Lata, A. Bansal","doi":"10.1109/iSES52644.2021.00096","DOIUrl":"https://doi.org/10.1109/iSES52644.2021.00096","url":null,"abstract":"In today’s digital world, security is required at each level of the implementation, even for Cryptographic algorithms, as we depend digitally on various needs of our daily life. Also, hackers are trying many ways to hack confidential information, and side-channel attacks are one of them. Key Derivation Functions (KDFs) are the basic and essential components of cryptographic systems; therefore, their security becomes more crucial for such systems. This paper presents the implementation of KDFs based on Block Ciphers and Hash functions (AES-128 and SHA-256, SHA- 512). The key feature of this implementation is that it generates a unique and secure key. Moreover, the generated key is less prone to the Timing side-channel attacks. These KDFs are implemented using high-level language C in Xilinx Vivado HLS. The results show that the proposed design offers a highly secure generated key while mitigating the Timing side-channel attacks possibility. Security analysis is done in terms of Hamming Distance and Avalanche Effects. The reported KDF based on AES-128 operates at 152.3 MHz with a max throughput of 9.728 Gbps, whereas KDF based on Hash Function, i.e., SHA-256 and SHA-512, operate at 108.6 MHz and 118.1 MHz with the max throughput of 2.28 Mbps and 2.28 Mbps, respectively.","PeriodicalId":293167,"journal":{"name":"2021 IEEE International Symposium on Smart Electronic Systems (iSES) (Formerly iNiS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130248701","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Smart Solid Waste Management System Using Blockchain and IoT for Smart Cities 基于区块链和物联网的智慧城市固体废物管理系统

2021 IEEE International Symposium on Smart Electronic Systems (iSES) (Formerly iNiS) Pub Date : 2021-12-01 DOI: 10.1109/iSES52644.2021.00107

Mohinish Paturi, Sampath Puvvada, Badhari Sai Ponnuru, Mounika Simhadri, B. S. Egala, A. K. Pradhan

{"title":"Smart Solid Waste Management System Using Blockchain and IoT for Smart Cities","authors":"Mohinish Paturi, Sampath Puvvada, Badhari Sai Ponnuru, Mounika Simhadri, B. S. Egala, A. K. Pradhan","doi":"10.1109/iSES52644.2021.00107","DOIUrl":"https://doi.org/10.1109/iSES52644.2021.00107","url":null,"abstract":"Because of urbanization and industrialization, non-biodegradable garbage is growing at an exponential rate. Industries have their own waste management and treatment divisions to take care of their waste products. However, civilian entities are facing many issues in waste management due to the lack of proper systems for segregating waste materials. This article proposed a unique smart waste management system using Blockchain and Internet of Things (IoT) to simplify the waste segregation with the help of smart bins. The proposed system distributes rewards to users for proper disposal of waste into smart bins using smart contracts. We deployed a prototype model on different test networks to compare its real-time performance. From the experimental analysis, we can conclude that the proposed model performs better on the Matic test network than the Binance Smart Chain (BSC) and Ropsten test networks. Finally, the proposed solution ensures system transparency, traceability, and scalability, as well as eliminating single points of failure (SPoF).","PeriodicalId":293167,"journal":{"name":"2021 IEEE International Symposium on Smart Electronic Systems (iSES) (Formerly iNiS)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130260653","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 14

Approximate Multiplier Architectures for Error Resilient Applications 误差弹性应用的近似乘法器架构

2021 IEEE International Symposium on Smart Electronic Systems (iSES) (Formerly iNiS) Pub Date : 2021-12-01 DOI: 10.1109/iSES52644.2021.00031

U. A. Kumar, Ratna Kumari Chintakunta, Surinder Kumar, K. Jamal, Syed Ershad Ahmed

引用次数: 3

SRTLock: A Sensitivity Resilient Two-Tier Logic Encryption Scheme SRTLock:一种敏感弹性的两层逻辑加密方案

2021 IEEE International Symposium on Smart Electronic Systems (iSES) (Formerly iNiS) Pub Date : 2021-12-01 DOI: 10.1109/iSES52644.2021.00095

N. Saxena, Ram Venkat Narayanan, Juneet Kumar Meka, R. Vemuri

引用次数: 1

Bilayer Graphene Field Effect Transistor Modelling with Improved Mobility Analysis 改进迁移率分析的双层石墨烯场效应晶体管模型

2021 IEEE International Symposium on Smart Electronic Systems (iSES) (Formerly iNiS) Pub Date : 2021-12-01 DOI: 10.1109/iSES52644.2021.00040

Sai Akash Dusi, B. T. Sundari

{"title":"Bilayer Graphene Field Effect Transistor Modelling with Improved Mobility Analysis","authors":"Sai Akash Dusi, B. T. Sundari","doi":"10.1109/iSES52644.2021.00040","DOIUrl":"https://doi.org/10.1109/iSES52644.2021.00040","url":null,"abstract":"Silicon has been the major driving force behind the technological advancement of humanity for the past 50 years. Silicon is used for manufacturing transistors, memory, Printed Circuit Broads, etc. Gordon Moore predicted that “the number of transistors on a silicon chip would double approximately every eighteen months”. The semiconductor industry had taken this prediction as the primary driving force behind the innovation of faster and efficient electronics manufacturing. This is achieved by miniaturizing devices, also know as scaling. Silicon is limited by performance degradation due to effects such as band to band tunneling, scattering phenomenon, etc, so the search to replace silicon in semiconductors has started. Many different methods to increase performance and efficiency were introduced before jumping wagon to beyond silicon materials such as designing 3-D transistors, FINFETs, replacing Silicon Dioxide with high-k dielectrics, etc. These proved to be increasing the manufacturing costs. The prime candidates for replacing Silicon are Carbon based materials, owing to their extraordinary electronic, thermal, optical and mechanical properties. The most researched are Carbon Nano Tubes and Graphene. The work focuses on modelling a Bilayer Graphene Field Effect Transistor with different mobility of holes and electrons taken into consideration.","PeriodicalId":293167,"journal":{"name":"2021 IEEE International Symposium on Smart Electronic Systems (iSES) (Formerly iNiS)","volume":"296 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115318266","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Unified Countermeasures against Physical Attacks in Internet of Things - A survey 物联网中物理攻击的统一对策研究

2021 IEEE International Symposium on Smart Electronic Systems (iSES) (Formerly iNiS) Pub Date : 2021-12-01 DOI: 10.1109/iSES52644.2021.00053

Jaya Dofe, Aaron Nguyen, Andy Nguyen

{"title":"Unified Countermeasures against Physical Attacks in Internet of Things - A survey","authors":"Jaya Dofe, Aaron Nguyen, Andy Nguyen","doi":"10.1109/iSES52644.2021.00053","DOIUrl":"https://doi.org/10.1109/iSES52644.2021.00053","url":null,"abstract":"The Internet of Things (IoT) impacts how we interact with the world around us for good. While IoT benefits are undeniable, it is a double-edged sword. The security aspect is the major concern in the IoT realm, especially side-channel attacks since there are abundant channels due to physical effects. IoT devices have been widely used in many fields of production and social living, such as healthcare, energy and industrial automation and military application, to name a few. Much research focuses on software, network, and cloud security; however, hardware security in these devices has been overlooked. The low-power, heterogeneous and resource-constrained nature of IoT devices makes incorporating security features extremely challenging. Conventional security measures, such as encryption, are infeasible for deployment under such constraints. This survey paper discusses the existing countermeasures for isolated side-channel attacks (SCA) and then dives into unified countermeasures that benefit IoT devices to address the area footprint and power constraints. Further, to defeat the IoT system from the advanced SCA, we proposed to use 3D integration as an IoT platform. 3D technology provides various advantages such as heterogeneous integration, split manufacturing, disparate technologies for IoT like MEMS sensors, etc., making 3D integration the best choice for IoT platforms.","PeriodicalId":293167,"journal":{"name":"2021 IEEE International Symposium on Smart Electronic Systems (iSES) (Formerly iNiS)","volume":"9 2","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131637559","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

FarmEdge: A Unified Edge Computing Framework Enabling Digital Agriculture FarmEdge:实现数字农业的统一边缘计算框架

2021 IEEE International Symposium on Smart Electronic Systems (iSES) (Formerly iNiS) Pub Date : 2021-12-01 DOI: 10.1109/iSES52644.2021.00065

P. Joshi, Debanjan Das, Venkanna Udutalapally, S. Misra

引用次数: 0

Power Distribution Network Capacitive Decoupling for Side-Channel Resistance 配电网侧道电阻电容解耦

2021 IEEE International Symposium on Smart Electronic Systems (iSES) (Formerly iNiS) Pub Date : 2021-12-01 DOI: 10.1109/iSES52644.2021.00051

R. Selvam, A. Tyagi

{"title":"Power Distribution Network Capacitive Decoupling for Side-Channel Resistance","authors":"R. Selvam, A. Tyagi","doi":"10.1109/iSES52644.2021.00051","DOIUrl":"https://doi.org/10.1109/iSES52644.2021.00051","url":null,"abstract":"In power side-channel attacks (SCA), the adversary observes the power leakage at the external power pin to reverse engineer the secrets embedded in sensitive circuits. Mitigation techniques are often integrated into the logic to make power consumption data independent. In this paper, we develop a new design strategy for designing the on-chip power distribution network using a decoupling capacitance to thwart the power side-channel attack. The decoupling capacitances are introduced along the power lanes in a distributed fashion, to suppress the data-leakage from the sensitive-circuit. To facilitate the computer-aided design of such PDNs, we also develop approximate heuristics to extract feature vectors from the current (I) profile of the internal logic blocks, and for feature vector propagation over the on-chip power distribution network. We study the sensitivity of decoupling capacitance value and its placement over the power distribution network. Finally, we evaluate the side-channel resistance with and without decoupling capacitance using Spice level simulations. Machine Learning (ML) classifiers are used to quantify the side-channel strength in terms of success rate for power side-channel adversary. A 100pf decoupling capacitance, in some cases, reduces the ML success rate from 80% to 21% to provide significant SCA resistance.","PeriodicalId":293167,"journal":{"name":"2021 IEEE International Symposium on Smart Electronic Systems (iSES) (Formerly iNiS)","volume":"97 7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122573587","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Data-Driven Decision Making for Smart Cultivation 数据驱动的智能种植决策

2021 IEEE International Symposium on Smart Electronic Systems (iSES) (Formerly iNiS) Pub Date : 2021-12-01 DOI: 10.1109/iSES52644.2021.00064

Puspendu Biswas Paul, S. Biswas, A. Bairagi, Mehedi Masud

{"title":"Data-Driven Decision Making for Smart Cultivation","authors":"Puspendu Biswas Paul, S. Biswas, A. Bairagi, Mehedi Masud","doi":"10.1109/iSES52644.2021.00064","DOIUrl":"https://doi.org/10.1109/iSES52644.2021.00064","url":null,"abstract":"With the advancement of modern technology, traditional agriculture is drastically changing, especially with the utilization of Information and Communication Technology (ICT). Ubiquitous sensors and the Internet of Things (IoT) are being used independently for helping the farmers to understand better the condition of overall field condition targeting to monitor soil characteristics, climatic conditions, humidity, temperature, etc. These sensors and systems work individually and produce different data that requires analysis to understand. The typical process is time-consuming, and farmers should have technological knowledge. Contrary, most of the farmers are not technologically advanced to understand the term. A ready-made result can help farmers quick decision-making. In this paper, we have developed a remote field monitoring and controlling IoT system architecture. The system process and analyze the collected data to prepare a ready-made report for farmers with suggestions for further steps. It leverages the management process with real-time monitoring, nursing (i.e., irrigation, pesticide distribution, etc.), ultimately increasing productivity. The overall system records every successful case, and machine learning-based prediction helps further nursing guidelines.","PeriodicalId":293167,"journal":{"name":"2021 IEEE International Symposium on Smart Electronic Systems (iSES) (Formerly iNiS)","volume":"108 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123416847","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

A Binary Multi-objective CLONAL Algorithm for Band Selection in Hyper-Spectral Images 高光谱图像波段选择的二值多目标克隆算法

2021 IEEE International Symposium on Smart Electronic Systems (iSES) (Formerly iNiS) Pub Date : 2021-12-01 DOI: 10.1109/iSES52644.2021.00033

G. Ramya, S. Nanda

{"title":"A Binary Multi-objective CLONAL Algorithm for Band Selection in Hyper-Spectral Images","authors":"G. Ramya, S. Nanda","doi":"10.1109/iSES52644.2021.00033","DOIUrl":"https://doi.org/10.1109/iSES52644.2021.00033","url":null,"abstract":"A hyperspectral image collects the spectral information across the electromagnetic spectrum as a continuous set of hundreds of bands with a very narrow bandwidths ranging from 5-10nm. The bands are high correlated with each other and some of the bands carry negligible information. So, there is a need to reduce the dimensionality of the hyperspectral image. Thus the aim is to extract only those bands which are informative and eliminate the noisy and redundant bands. If the redundant bands are eliminated, the dimensionality of the hyperspectral image reduces. This reduction in dimensionality reduces the cost of computation and increases the accuracy of the analysis. In this paper, a dimension reduction technique based on binary multi-objective CLONAL algorithm has been proposed. The method uses two objective functions as entropy and Pearson correlation. The extracted spectral bands are taken and extracted hyperspectral image obtained is segmented using K-modes algorithm. Comparative results reveal superior performance of band selection by the proposed method over NSGA-II, BSSO and PCA based reduction.","PeriodicalId":293167,"journal":{"name":"2021 IEEE International Symposium on Smart Electronic Systems (iSES) (Formerly iNiS)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122001401","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3