N. Iwasaki, Y. Shimosato, K. Tamiguchi, K. Shimano
{"title":"Q-TAT production and CIM systems for the packaging process within IC fabrication","authors":"N. Iwasaki, Y. Shimosato, K. Tamiguchi, K. Shimano","doi":"10.1109/ISSM.1995.524349","DOIUrl":"https://doi.org/10.1109/ISSM.1995.524349","url":null,"abstract":"The time required for the processes from die bonding through molding could be reduced to less than half a day by introducing improved production systems, new processes, and the CIM system. Thus, a CIM line capable of flexible small-lot production of multiple product variations could be constructed. In addition, the time required for input to the packaging process through packing was reduced to half that of the conventional system, thus achieving a QTAT line. Productivity was also enhanced to 1.5 times that of the conventional system.","PeriodicalId":289961,"journal":{"name":"Proceedings of International Symposium on Semiconductor Manufacturing","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125639917","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Recycling of IC molding resin wastes from IC package production processes","authors":"M. Iji","doi":"10.1109/ISSM.1995.524390","DOIUrl":"https://doi.org/10.1109/ISSM.1995.524390","url":null,"abstract":"Reported here is a study for recycling of residue of molding resin for IC packages (molding resin waste). Molding resin waste pulverized into a powder showed good surface reactivity almost comparable to that of silica powder. When the waste powder of low-stress type molding resin was recycled into standard type molding resin, the thermal resistance of the resulting product was superior to that of the standard molding resin. Moreover, the waste powder of molding resin was found to be useful as a general filler for resin type construction materials, paints and adhesives, and as a decorating agent for construction materials.","PeriodicalId":289961,"journal":{"name":"Proceedings of International Symposium on Semiconductor Manufacturing","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117041053","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A highly automated testing facility for calibration and performance testing of mass flow controllers","authors":"T. McKnight","doi":"10.1109/ISSM.1995.524380","DOIUrl":"https://doi.org/10.1109/ISSM.1995.524380","url":null,"abstract":"A highly automated testing laboratory has been developed at the Oak Ridge National Laboratory towards the goal of improving the mass flow controller (MFC) and its impact on the semiconductor community. Developed initially for SEMATECH, this facility has validated and implemented many of the SEMATECH Semaspec test methods for mass flow controllers, which are now becoming SEMI standards. The facility features several testbeds for the evaluation of MFC reliability, accuracy, surrogate gas factors, and process gas calibrations, in addition to many other aspects of mass flow controllers and other low flow devices. The facility is highly automated, with many test methods being performed in a virtually \"hands-off\" mode. Integral in this facility is the gravimetric calibrator, a true mass flow device which allows the rapid calibration of flow devices against hazardous and corrosive process gases to the level of approximately 0.3% of reading. The capabilities of this facility have been demonstrated through baseline MFC performance for the SEMI-SEMATECH member companies. The facility is now being opened as a Department of Energy National User Facility, enabling MFC manufacturers, equipment suppliers, and end users access to all facility capabilities for development and evaluation work of the MFC.","PeriodicalId":289961,"journal":{"name":"Proceedings of International Symposium on Semiconductor Manufacturing","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114887714","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Cost of \"ad hoc\" wafer release policies","authors":"P. Nag, W. Maly","doi":"10.1109/ISSM.1995.524368","DOIUrl":"https://doi.org/10.1109/ISSM.1995.524368","url":null,"abstract":"Modern manufacturing operations must, on one hand, be very flexible in order to react to the rapidly changing market needs, and on the other hand, as cost effective as possible. The chaotic nature of the market, however, does not allow systematic minimization of manufacturing costs. This paper studies manufacturing flexibility, manufacturing cost trade-off. The analysis is performed using a simulation technique and assuming that the chaotic nature of the market can be modeled by 'ad hoc' wafer release policies.","PeriodicalId":289961,"journal":{"name":"Proceedings of International Symposium on Semiconductor Manufacturing","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116276204","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
T. Seto, S. Yokoyama, K. Okuyama, M. Hirose, T. Fujii, H. Suzuki
{"title":"Control of fine particulate and gaseous contaminants by UV/photoelectron method","authors":"T. Seto, S. Yokoyama, K. Okuyama, M. Hirose, T. Fujii, H. Suzuki","doi":"10.1109/ISSM.1995.524360","DOIUrl":"https://doi.org/10.1109/ISSM.1995.524360","url":null,"abstract":"In semiconductor manufacturing processes, surface contamination is a very important issue because it decreases the product yield of the LSI. In this study, a new method to remove fine airborne particles and gaseous contaminants in the wafer stocker using a UV/photoelectron method has been investigated. Two kinds of wafer stockers are used for investigating the efficiency of the UV/photoelectron method for controlling (1) particulate and gaseous contaminants under atmospheric conditions and (2) particulate contaminants under low pressure conditions.","PeriodicalId":289961,"journal":{"name":"Proceedings of International Symposium on Semiconductor Manufacturing","volume":"80 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122879721","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Ultra-pure and environmentally friendly wet chemistry made possible through on-site recycling and reprocessing","authors":"J. A. Adams, D.W. Persichini","doi":"10.1109/ISSM.1995.524387","DOIUrl":"https://doi.org/10.1109/ISSM.1995.524387","url":null,"abstract":"Corporations are facing the ever increasing demands to reduce the environmental impact from Semiconductor manufacturing. At the same time, the latest wafer designs require ever increasing purity of chemicals and processes. Many times these two requirements are contradictory, however, in the area of wet chemistry, both the reduction of environmental wastes and the improvement of chemical purity can be readily and cost effectively achieved through the use of on-site reclaim and reprocessing. Sulfuric acid, Hydrofluoric acid, and Isopropyl alcohol are leading chemicals for recycling due to their ultra-high purity requirements, large consumption volumes, high cost, waste created, and their disposal challenge. This paper is an overview of the technologies employed to enable reprocessing and includes several case studies to demonstrate the economic and environmental benefits of reprocessing.","PeriodicalId":289961,"journal":{"name":"Proceedings of International Symposium on Semiconductor Manufacturing","volume":"305 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132347900","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
L.C. Hoxie, L. Solomon, J. Thomison, N. Abt, S. Pittman
{"title":"Impact of tool installation delay on factory ramp-up performance","authors":"L.C. Hoxie, L. Solomon, J. Thomison, N. Abt, S. Pittman","doi":"10.1109/ISSM.1995.524370","DOIUrl":"https://doi.org/10.1109/ISSM.1995.524370","url":null,"abstract":"This study examines the effect of delays in tool installation and qualification on plant performance, specified as discounted cumulative cash flow (DCCF) as the plant is ramped from zero to 20,000 wafer starts/month. Two different ramp strategies are addressed-conservative (24 months) and aggressive (9 months). A specific ramp analysis methodology using a discrete event simulator and cost and yield models, applied to the given assumption set, showed: (1) tool qualification delays impacted investment cost by $34 million/month before the fab breaks even and (2) opting for a 62.5% shorter ramp period effected a 19% reduction in break even time.","PeriodicalId":289961,"journal":{"name":"Proceedings of International Symposium on Semiconductor Manufacturing","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127182687","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Assessing the environment, safety and health impacts of semiconductor manufacturing at the design and process development stages","authors":"L. Mendicino, W. Lashbrook","doi":"10.1109/ISSM.1995.524389","DOIUrl":"https://doi.org/10.1109/ISSM.1995.524389","url":null,"abstract":"The semiconductor industry has traditionally focused on cost, yield and logistics as the primary drivers for decision-making. Environment, safety and health (ESH) issues have resulted in major modifications of manufacturing tools and process steps because they are not routinely considered when making process design and manufacturing choices. ESH impacts are becoming important drivers for the industry; however, to date, they have not been adequately addressed by design and process engineers. To empower process engineers to consider the ESH impacts of their materials and processes at the earliest possible stage, SEMATECH has initiated a project entitled \"Design for Environment, Safety and Health\" (DFESH). The objective of the SEMATECH project is to provide an integrated DFESH tool set to semiconductor engineers which will evaluate the ESH impacts of their operations. The project will develop the framework, metrics, and appropriate training programs to integrate and facilitate the DFESH tool set's use within the semiconductor engineering and manufacturing process. The foundation of this tool set is a software program, Computerized Assessment of Relative Risk Impacts (CARRI), that assesses the ESH impacts of semiconductor manufacturing processes and associated materials. The tool set will also include a comprehensive ESH cost of ownership model (an extension of the SEMATECH equipment Cost of Ownership model) and a materials/energy balance tool.","PeriodicalId":289961,"journal":{"name":"Proceedings of International Symposium on Semiconductor Manufacturing","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128915412","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Applications of queuing theory and simulation to staffing in the semiconductor clean room environment","authors":"A. Raviv","doi":"10.1109/ISSM.1995.524402","DOIUrl":"https://doi.org/10.1109/ISSM.1995.524402","url":null,"abstract":"A major concern of management in the ultra expensive environment of semiconductor fabs and test floors is optimal utilization of equipment. Proper staffing of clean room operators and maintenance technicians in the manufacturing cells and clusters plays a major role in maximizing equipment utilization and overall throughput. This paper is about a more scientific and pro-active approach to the staffing issue than the classic methods used in the industry. It is TOC (Theory of Constraints) oriented, and designed to improve fab throughput. The models described in this paper were developed by engineers from Tefen USA. To date, they have been adopted by management teams in over 30 different fabs and test sites over the past two years, both in the US and in Europe.","PeriodicalId":289961,"journal":{"name":"Proceedings of International Symposium on Semiconductor Manufacturing","volume":"197 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123256663","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A statistical strategy for directing process capability improvement efforts","authors":"K. Hirschman, T.J. Fennelly","doi":"10.1109/ISSM.1995.524355","DOIUrl":"https://doi.org/10.1109/ISSM.1995.524355","url":null,"abstract":"A statistical strategy which can be used to direct process capability improvement efforts is presented. This method is an extension of Quality Engineering by Design (QED) techniques, and incorporates both process simulation techniques and product manufacturing data. The resulting combination provides process engineers and management in a manufacturing environment with a useful weapon against variation. The focus is on reducing process variation in order to achieve device performance specifications. A case study is presented on the variation reduction of the nMOS threshold voltage (Vtn) in the RIT CMOS process. The end result is a plan which will determine where variation reduction efforts will be most rewarded, and possible strategies which can be used to achieve the required product quality.","PeriodicalId":289961,"journal":{"name":"Proceedings of International Symposium on Semiconductor Manufacturing","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114900739","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}