Proceedings of International Symposium on Semiconductor Manufacturing最新文献_第4页

Trace moisture measurement in HCl gas by near-infrared diode LASER spectroscopy 近红外二极管激光光谱法测定盐酸气体中的微量水分

Proceedings of International Symposium on Semiconductor Manufacturing Pub Date : 1995-09-17 DOI: 10.1109/ISSM.1995.524395

Y. Ishihara, H. Masusaki, Shang–Qian Wu, K. Matsumoto, T. Kimijima

引用次数: 1

Dry cleaning of Si and SiO/sub 2/ surfaces using SiCl/sub 4/ system 使用SiCl/sub - 4/系统干洗Si和SiO/sub - 2/表面

Proceedings of International Symposium on Semiconductor Manufacturing Pub Date : 1995-09-17 DOI: 10.1109/ISSM.1995.524404

R. Sugino, Y. Okui, M. Shigeno, S. Okubo, K. Takasaki, T. Ito

引用次数: 0

Requirements for contamination control in the G-bit era g位时代对污染控制的要求

Proceedings of International Symposium on Semiconductor Manufacturing Pub Date : 1995-09-17 DOI: 10.1109/ISSM.1995.524359

H. Kitajima, Y. Shiramizu

引用次数: 0

Carrierless systems for wet cleaning 用于湿式清洗的无载体系统

Proceedings of International Symposium on Semiconductor Manufacturing Pub Date : 1995-09-17 DOI: 10.1109/ISSM.1995.524377

S. Kitahara, M. Sugita

引用次数: 0

A review of sensing technologies for semiconductor process applications 半导体过程中传感技术的研究进展

Proceedings of International Symposium on Semiconductor Manufacturing Pub Date : 1995-09-17 DOI: 10.1109/ISSM.1995.524373

A. Iturralde

{"title":"A review of sensing technologies for semiconductor process applications","authors":"A. Iturralde","doi":"10.1109/ISSM.1995.524373","DOIUrl":"https://doi.org/10.1109/ISSM.1995.524373","url":null,"abstract":"In this paper, a review of the current literature on semiconductor process sensor technology is presented. Much of the literature discusses in-situ measurements for film thickness, particles, and/or other conditions which could affect the quality of the product. Instruments such as RGAs (Residual Gas Analyzers), in-situ particle, and in-situ film thickness monitors represent current and future advanced sensors. Prior to implementing sensors, it would be ideal to reduce the number of process measurements as much as possible to ensure sensor effectiveness. It will be ideal to have a working cost of ownership model in place to baseline operations and monitor improvements as sensors move into the production line. There are many new sensors available with highly improved performance, accuracy, and even built-in electronics. These sensors can replace or supplement existing equipment sensors to improve performance, reliability, and extend equipment life. With the increasing costs of maintaining capital equipment, successful implementation could mean substantial savings. These and many other implementation issues are also presented. The paper concludes by discussing future opportunities for new sensor technologies and emerging support technologies such as MEMS (Microelectromechanical Systems).","PeriodicalId":289961,"journal":{"name":"Proceedings of International Symposium on Semiconductor Manufacturing","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128792703","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

A high level treatment of fluorine wastewater to reduce sludge 对含氟废水进行高水平处理，减少污泥

Proceedings of International Symposium on Semiconductor Manufacturing Pub Date : 1995-09-17 DOI: 10.1109/ISSM.1995.524391

A. Toyoda, T. Taira

引用次数: 2

Semiconductor process line scheduling expert system 半导体生产线调度专家系统

Proceedings of International Symposium on Semiconductor Manufacturing Pub Date : 1995-09-17 DOI: 10.1109/ISSM.1995.524366

M. Ohkura, K. Mizuno, J. Yugami, A. Hikichi, T. Nishida

引用次数: 2

Solvent recycling for reuse in semiconductor manufacturing 用于半导体制造的溶剂回收再利用

Proceedings of International Symposium on Semiconductor Manufacturing Pub Date : 1995-09-17 DOI: 10.1109/ISSM.1995.524392

P.E. Dahlgren

引用次数: 4

Single-wafer and mini-batch wet processing for improved process performance and process characterization 单晶圆片和小批量湿处理，以改善工艺性能和工艺表征

Proceedings of International Symposium on Semiconductor Manufacturing Pub Date : 1995-09-17 DOI: 10.1109/ISSM.1995.524393

L. Wilson, D. Dornisch, E. Brown, E. Ward

引用次数: 3

Automatic defect classification system for patterned semiconductor wafers 图像化半导体晶圆缺陷自动分类系统

Proceedings of International Symposium on Semiconductor Manufacturing Pub Date : 1995-09-17 DOI: 10.1109/ISSM.1995.524362

L. Breaux, B. Singh

{"title":"Automatic defect classification system for patterned semiconductor wafers","authors":"L. Breaux, B. Singh","doi":"10.1109/ISSM.1995.524362","DOIUrl":"https://doi.org/10.1109/ISSM.1995.524362","url":null,"abstract":"The automatic detection of defects on patterned wafers is a well-developed technology. There are a number of commercially available defect detection systems which analyze the patterned wafers, determine the defect locations, and provide information on defect size. The next logical step would be to visually (optically or SEM) review the defects and determine the types which comprise the defect distributions obtained from the inspection tool, i.e. classify the defects according to some predetermined scheme. Of strong interest is then to use this information to isolate those problems which result in electrical failures and focus effort on solving those problems. Unfortunately, the process of classification is typically a manual process limited in its effectiveness by human factors. Replacing this manual bottleneck with an automated system is highly desirable. An automatic Defect Classification System (DCS-1) which combines image processing techniques and Fuzzy Logic Expert System (FLES) is now commercially available. The DCS-1 re-detects the defects in the field of view of a review station using image processing techniques and then classifies them using the FLES engine. In this paper we describe the DCS-1 which automates the defect classification process, offering a high degree of adaptivity, customization, and automation.","PeriodicalId":289961,"journal":{"name":"Proceedings of International Symposium on Semiconductor Manufacturing","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129503372","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 24