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IEEE/LEOS International Conference on Optical MEMs最新文献

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Fabrication of optical MEMS in sol-gel materials 溶胶-凝胶材料制备光学MEMS
IEEE/LEOS International Conference on Optical MEMs Pub Date : 2002-11-07 DOI: 10.1109/OMEMS.2002.1031432
S. Obi, M. T. Gale, A. Kuoni, W. Noell, N. D. de Rooij
{"title":"Fabrication of optical MEMS in sol-gel materials","authors":"S. Obi, M. T. Gale, A. Kuoni, W. Noell, N. D. de Rooij","doi":"10.1109/OMEMS.2002.1031432","DOIUrl":"https://doi.org/10.1109/OMEMS.2002.1031432","url":null,"abstract":"A method for fabricating optical MEMS in sol-gel-materials is presented. The basic process involves deposition and patterning of a sacrificial spacer layer and a combined molding and photolithography step. The method described allows the fabrication of micromechanical elements incorporating micro-optical structures such as lenses (diffractive or refractive), gratings (for polarizers or resonant filters), waveguides or other micro-optical relief structures fabricated by UV-curing replication processes.","PeriodicalId":285115,"journal":{"name":"IEEE/LEOS International Conference on Optical MEMs","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129740720","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Damage free dicing method for MEMS devices MEMS器件的无损伤切割方法
IEEE/LEOS International Conference on Optical MEMs Pub Date : 2002-11-07 DOI: 10.1541/IEEJSMAS.123.255
Y. Awatani, Y. Matsumoto, K. Kato
{"title":"Damage free dicing method for MEMS devices","authors":"Y. Awatani, Y. Matsumoto, K. Kato","doi":"10.1541/IEEJSMAS.123.255","DOIUrl":"https://doi.org/10.1541/IEEJSMAS.123.255","url":null,"abstract":"A damage free dicing method for MEMS devices has been researched in this paper. The method is based on the bonding and detachment of a glass plate cap by using a thermoplastic adhesive. The sand blast technique was used for fabrication of the glass cap wafer, which has concavities with depth of 100 /spl mu/m. The thermoplastic adhesive (STAYSTIK373, Techno Alpha Co. Ltd.) was screen printed on the glass cap wafer. The glass cap wafer was thermocompression-bonded to silicon wafer at 210/spl deg/C and diced to individual chips. The glass cap plate was easily detached at 300/spl deg/C. This method prevented MEMS devices from suffering contamination by water or dicing dust during the dicing process. The method is easily applied to current mass-production processes, because the method is accomplished with inexpensive materials and well-established equipment. The process conditions and examples have been explained in the paper.","PeriodicalId":285115,"journal":{"name":"IEEE/LEOS International Conference on Optical MEMs","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130926864","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 15
Microlenses array fabrication by hot embossing process 热压花工艺制备微透镜阵列
IEEE/LEOS International Conference on Optical MEMs Pub Date : 2002-11-07 DOI: 10.1109/OMEMS.2002.1031449
Hyupwoo Lee, Sung-Keun Lee, T. Kwon, S.S. Lee
{"title":"Microlenses array fabrication by hot embossing process","authors":"Hyupwoo Lee, Sung-Keun Lee, T. Kwon, S.S. Lee","doi":"10.1109/OMEMS.2002.1031449","DOIUrl":"https://doi.org/10.1109/OMEMS.2002.1031449","url":null,"abstract":"For the mass production of microlenses array, the hot embossing process has been successfully utilized with a mold insert that is fabricated by Ni-electroplating based on a PMMA microstructure of microlenses array that is fabricated by the modified LIGA process.","PeriodicalId":285115,"journal":{"name":"IEEE/LEOS International Conference on Optical MEMs","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130160758","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
Design and fabrication of a micromirror using silicon bulk micromachining for out-of-plane right angle reflection 用硅体微加工设计和制造面外直角反射微镜
IEEE/LEOS International Conference on Optical MEMs Pub Date : 2002-11-07 DOI: 10.1109/OMEMS.2002.1031452
Y. Jang, Yong-Kweon Kim
{"title":"Design and fabrication of a micromirror using silicon bulk micromachining for out-of-plane right angle reflection","authors":"Y. Jang, Yong-Kweon Kim","doi":"10.1109/OMEMS.2002.1031452","DOIUrl":"https://doi.org/10.1109/OMEMS.2002.1031452","url":null,"abstract":"A matter of prime importance in silicon micromirror fabrication is how to get a silicon mirror plate under structure and fabrication restrictions. Deep silicon etch, silicon-glass anodic bonding and thinning process are used in this research for a silicon mirror plate. This approach offers a flat silicon mirror plate and the thickness of a silicon plate can be thinned up to 25 /spl mu/m. The micromirror should rotate with 45 degrees for out-of-plane right angle reflection. Therefore it is difficult to use stiff materials as a torsional spring. Aluminum is a good candidate for such a large angular motion though its residual stress may also affect operation performances.","PeriodicalId":285115,"journal":{"name":"IEEE/LEOS International Conference on Optical MEMs","volume":"157 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126995724","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Development of nano-photonic devices and their integration by optical near field 纳米光子器件的发展及其光学近场集成
IEEE/LEOS International Conference on Optical MEMs Pub Date : 2002-11-07 DOI: 10.1109/OMEMS.2002.1031510
T. Yatsui, M. Ohtsu
{"title":"Development of nano-photonic devices and their integration by optical near field","authors":"T. Yatsui, M. Ohtsu","doi":"10.1109/OMEMS.2002.1031510","DOIUrl":"https://doi.org/10.1109/OMEMS.2002.1031510","url":null,"abstract":"Ultrahigh integration of photonic switching arrays is necessary to increase data transmission rates and capacity of future optical transmission system. To accomplish this, the size of all switching devices must be reduced beyond the diffraction limit of light. We have already proposed a nano-photonic integrated circuit (IC) that is composed of nanometer-scale dots and wires. For the works of nano-photonics, a key device is a probe for generating/detecting optical near field with high efficiency and high resolution. To meet this requirement, we realized the successful fabrication of an optical near-field probe with extremely high throughput and small spot size, produced by introducing a pyramidal silicon structure and localized surface plasmon resonance at the metallized probe tip.","PeriodicalId":285115,"journal":{"name":"IEEE/LEOS International Conference on Optical MEMs","volume":"1674 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127450636","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Characterization of a micro optical distance sensor 一种微光学距离传感器的特性
IEEE/LEOS International Conference on Optical MEMs Pub Date : 2002-11-07 DOI: 10.1109/OMEMS.2002.1031428
U. Wallrabe, U. Hollenbach, P. Krippner, J. Mohr, T. Oka
{"title":"Characterization of a micro optical distance sensor","authors":"U. Wallrabe, U. Hollenbach, P. Krippner, J. Mohr, T. Oka","doi":"10.1109/OMEMS.2002.1031428","DOIUrl":"https://doi.org/10.1109/OMEMS.2002.1031428","url":null,"abstract":"A micro optical distance sensor with a PSD receiver built in a modular set-up using two planar chips has been characterized. Results from spot size, measurement range, linearity, resolution, and repeatability are described.","PeriodicalId":285115,"journal":{"name":"IEEE/LEOS International Conference on Optical MEMs","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130875233","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Galvanometric silicon scanning mirror of 2 DOF 2 DOF硅振镜扫描镜
IEEE/LEOS International Conference on Optical MEMs Pub Date : 2002-11-07 DOI: 10.1109/OMEMS.2002.1031456
Si-Hong Ahn, Yong-Kweon Kim
{"title":"Galvanometric silicon scanning mirror of 2 DOF","authors":"Si-Hong Ahn, Yong-Kweon Kim","doi":"10.1109/OMEMS.2002.1031456","DOIUrl":"https://doi.org/10.1109/OMEMS.2002.1031456","url":null,"abstract":"A large scanning mirror is fabricated and tested, with two rotational axes. Galvanometric operation is adopted for large torque with small power. Two independent current paths produce torque by Lorentz force in the external magnetic field. The external magnetic field is applied by permanent magnet beneath the device. The size of movable frame is 5.7 mm /spl times/ 5.7 mm and that of mirror 3.5 mm /spl times/ 3.5 mm. The mirror shows resonance at 380 Hz and the movable frame at 150 Hz. In resonance mode, rotation angle of mirror is 5.44/spl deg/ by applied AC current of 30 mA. In the case of movable frame 51.34/spl deg/ is obtained by applied AC current of 130 mA.","PeriodicalId":285115,"journal":{"name":"IEEE/LEOS International Conference on Optical MEMs","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128195793","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Micro-fabricated system for wavelengths monitoring 用于波长监测的微制造系统
IEEE/LEOS International Conference on Optical MEMs Pub Date : 2002-11-07 DOI: 10.1109/OMEMS.2002.1031425
O. Manzardo, Y. Petremand, H. Herzig, W. Noell, N. D. de Rooij
{"title":"Micro-fabricated system for wavelengths monitoring","authors":"O. Manzardo, Y. Petremand, H. Herzig, W. Noell, N. D. de Rooij","doi":"10.1109/OMEMS.2002.1031425","DOIUrl":"https://doi.org/10.1109/OMEMS.2002.1031425","url":null,"abstract":"Presents a new design of a time-scanning Michelson interferometer realized by silicon micro-machining, more particularly with silicon-on-insulator (SOI) technology. The new design allows auto-calibration of the motion of the scanning mirror. The device is suitable for monitoring about 50 channels at the telecom wavelength (/spl lambda/=1.5/spl mu/m).","PeriodicalId":285115,"journal":{"name":"IEEE/LEOS International Conference on Optical MEMs","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132961797","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Optical waveguide device realised using two SU-8/spl trade/ layers 使用两个SU-8/spl贸易/层实现的光波导器件
IEEE/LEOS International Conference on Optical MEMs Pub Date : 2002-11-07 DOI: 10.1109/OMEMS.2002.1031474
Y. Ansel, F. Gindele, J. Scheurer, F. Schmitz
{"title":"Optical waveguide device realised using two SU-8/spl trade/ layers","authors":"Y. Ansel, F. Gindele, J. Scheurer, F. Schmitz","doi":"10.1109/OMEMS.2002.1031474","DOIUrl":"https://doi.org/10.1109/OMEMS.2002.1031474","url":null,"abstract":"A low cost fabrication process of planar waveguide devices using the SU-8/spl trade/ thick photoresist is presented. This process consist of the deposition of two photo-structurized resist layers filled with epoxy glue to realise the core waveguide. First results have shown acceptable optical propagation.","PeriodicalId":285115,"journal":{"name":"IEEE/LEOS International Conference on Optical MEMs","volume":"146 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123049525","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Birefringence distribution in V-grooved optical parts by hot embossing process 热压成型v形光学零件的双折射分布
IEEE/LEOS International Conference on Optical MEMs Pub Date : 2002-11-07 DOI: 10.1109/OMEMS.2002.1031480
Hyun Sup Lee, Sung-Keun Lee, T. Kwon, S.S. Lee
{"title":"Birefringence distribution in V-grooved optical parts by hot embossing process","authors":"Hyun Sup Lee, Sung-Keun Lee, T. Kwon, S.S. Lee","doi":"10.1109/OMEMS.2002.1031480","DOIUrl":"https://doi.org/10.1109/OMEMS.2002.1031480","url":null,"abstract":"For micro-optical products, hot embossing process seems to have more merits because of small thermal cycle that improves optical and mechanical properties and low material flow that reduces the internal residual stress. This study investigates the effects of processing conditions on the birefringence distribution, directly affecting optical quality, in V-grooved optical products. A hot embossing machine was designed and manufactured. Dimensional accuracy and low birefringence are strongly required with respect to the replication accuracy and optical quality.","PeriodicalId":285115,"journal":{"name":"IEEE/LEOS International Conference on Optical MEMs","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124096158","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
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