First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)最新文献_第5页

Reliability of different flex materials in high density flip chip on flex applications 不同挠性材料在高密度倒装芯片挠性应用中的可靠性

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973285

P. Palm, J. Maattanen, Y. de Maquille, A. Picault, J. Vanfleteren, B. Vandecasteele

{"title":"Reliability of different flex materials in high density flip chip on flex applications","authors":"P. Palm, J. Maattanen, Y. de Maquille, A. Picault, J. Vanfleteren, B. Vandecasteele","doi":"10.1109/POLYTR.2001.973285","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973285","url":null,"abstract":"This paper presents the latest results from the reliability tests of high density flip chip on flex application using anisotropically conductive adhesives. Four different types of flexible substrates and two different types of anisotropically conductive adhesives were selected. Both paste and film type anisotropically conductive adhesives were used. Two different test devices were used. The contact areas were 50/spl times/50 /spl mu/m and 50/spl times/90 /spl mu/m. The effective pitch was 80 /spl mu/m in both samples and the number of contacts was 200. The matrix of both anisotropically conductive adhesives was epoxy based and the conductive particles in film type were isolated soft metal-coated polymer particles and in paste type isolated silver particles. The contact resistance was measured with a four-point method and the series resistance with a daisy chain method. The reliability of the flip chip interconnections was tested in thermal cycling tests. Cross section samples were made to analyze the possible failure mechanism of failed contacts.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128596466","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Reliability studies of an isotropic electrically conductive adhesive 各向同性导电胶粘剂的可靠性研究

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973258

J. Morris, F. Anderssohn, S. Kudtarkar, E. Loos

引用次数: 12

Non-migration conductive adhesives 不迁移导电胶粘剂

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973261

Y. Shirai, M. Komagata, K. Suzuki

引用次数: 4

Measurement of residual stresses in flip chip underfill resins 倒装片底填树脂中残余应力的测量

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973274

M. Sham, Jang‐Kyo Kim

引用次数: 1

Interfacial fracture toughness tests suited for reliability enhancements of advanced plastic packages 适用于增强先进塑料包装可靠性的界面断裂韧性试验

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973273

J. Auersperg, E. Kieselstein, A. Schubert, B. Michel

{"title":"Interfacial fracture toughness tests suited for reliability enhancements of advanced plastic packages","authors":"J. Auersperg, E. Kieselstein, A. Schubert, B. Michel","doi":"10.1109/POLYTR.2001.973273","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973273","url":null,"abstract":"The growing use of advanced electronic packages under harsh environmental conditions including extreme temperatures is often a reason for damage, fatigue and failure of entire components and systems. Therefore, their thermo-mechanical reliability is becoming one of the most important preconditions for adopting it in industrial applications. Various kinds of inhomogeneity, residual stresses from several steps of the manufacturing process as well as the fact that microelectronic packages are basically compounds of materials with quite different Young's moduli and thermal expansion coefficients contribute to interface delamination, chip cracking and fatigue of solder interconnects. This paper intends to contribute to the investigation of mixed mode interface delamination phenomena in micro components by using combined numerical investigations by means of nonlinear FEA, several fracture mechanics concepts and experimental investigations using a gray scale correlation method. Interfacial fracture toughness tests commonly utilized are investigated in order to check their characteristics and, in particular, efficiency.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"74 6","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114011411","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

PC 3000-the new generation of isotropic conductive adhesives PC 3000——新一代各向同性导电胶

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973259

J. Neumann-Rodekirch, Hans-Werner Hagedorn

引用次数: 0

Trend of solder-less joint in flip chip bonding 倒装芯片焊接中无焊点的发展趋势

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973275

M. Takeichi, M. Nagashima

{"title":"Trend of solder-less joint in flip chip bonding","authors":"M. Takeichi, M. Nagashima","doi":"10.1109/POLYTR.2001.973275","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973275","url":null,"abstract":"Information devices have recently shown incredible advancements in miniaturization and increased functionality. This has been supported by high density surface mounting technology, build-up technologies for multi-layer boards, the miniaturization of mounted components, advancements in chip mounting equipment, and other innovations. This paper looks specifically at flip chip bonding technology for mounting bare chips directly to the substrate. There are two types of flip chip bonding. One utilizes a metallic bond for the electrical connection, most commonly some sort of solder joint, but always using a metal-to-metal bond such as Sn-Au, conductive paste, or an ultrasonically welded Au-Au joint. Using solder, however, has problems associated with environmental concerns, as well as technical limitations on the usable pitch. The second general method of flip chip bonding uses bumps and an adhesive. In this paper, we term this \"mechanical bonding.\" It is forecast that the usage ratio of mechanical bonding will increase as pitches become finer and the drive to eliminate underfill increases. Mechanical bonding can be divided into four types: ACF (anisotropic conductive film), NCF (nonconductive film), ACP (anisotropic conductive paste), and NCP (nonconductive paste). Advanced ACFs are now in wide general use and are used with many types of electronic equipment. This is a direct result of improvements in reliability and the adoption of ACF in the LCD industry. An example of the reliability of ACF manufactured by Sony Chemicals Corporation is given. This paper also introduces other applications of ACF in the electronics industry.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114593224","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Smart labels-high volume applications using adhesive flip-chip-technologies 智能标签-使用粘合剂倒装芯片技术的大批量应用

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973299

F. Kriebel, T. Seidowski

引用次数: 5

A long-term reliability of adhesive flip chip joints using very thin chips 使用非常薄的芯片的粘接倒装芯片接头的长期可靠性

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973279

A. Seppala, I. Suominen, E. Ristolainen

{"title":"A long-term reliability of adhesive flip chip joints using very thin chips","authors":"A. Seppala, I. Suominen, E. Ristolainen","doi":"10.1109/POLYTR.2001.973279","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973279","url":null,"abstract":"Anisotropic conductive adhesives were used to attach daisy chained test chips on FR-4 test board. The area of the test chips was 5 mm/spl times/5 mm and the pitch was 250 /spl mu/m. Half of the test chips were thinned to the thickness of 50 /spl mu/m. Both test chip types had exactly the same test layout with peripherally situated gold bumps. Contact resistance measurements were performed using four-point and daisy chain methods. The reliability of the joints was studied by subjecting the specimens to temperature cycling and humidity tests. In addition, some of the test samples were subjected to a reflow treatment. Finally, the structure of the joints was studied with scanning electron microscopy. After 1000 cycles of the temperature cycling test both chip types showed good results. The average contact resistance of the joints had decreased, but a couple of open circuits had formed. Humidity tests caused some increase in contact resistance value. Reflow treatment did not cause significant degradation in joints.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125547171","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Smart label uses polymer thick film technology on low-cost substrates 智能标签在低成本基材上使用聚合物厚膜技术

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973301

M. Luniak, Hans-Peter Monser, V. Brod, K. Wolter

引用次数: 4