First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)最新文献_第6页

Accelerated testing of flip chip packages under dynamic load 倒装封装在动态负载下的加速测试

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973308

I. Rău, R. Miessner, G. Liebing, K. Becker

{"title":"Accelerated testing of flip chip packages under dynamic load","authors":"I. Rău, R. Miessner, G. Liebing, K. Becker","doi":"10.1109/POLYTR.2001.973308","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973308","url":null,"abstract":"Reliability testing of electronic packages is a crucial time factor within the development process of electronic components for automotive applications. Especially during the early stages, a variety of materials has to be evaluated and a faster, more sensitive alternative to established testing procedures is needed. In this study, sinusoidal vibrations of flip chip test boards are investigated within the scope of underfill induced failure modes. Since flip chip devices with modern underfills fail due to delaminations of underfill from the die, a combination of proper preconditioning and vibrational testing was done. It is shown that adhesion of the underfill in flip chip packages can effectively be tested under dynamic load at room temperature. Flip chips at different stages of aging were analyzed using scanning acoustic microscopy, infrared microscopy, scanning electron microscopy and four terminal probing of single bumps. A significant reduction of testing times for the proposed combination of preconditioning and vibration was achieved compared to thermal cycling tests.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131587981","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

mTest-a new approach to measure material properties from microscopic specimens mtest -一种从微观样品中测量材料特性的新方法

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973310

D. Vogel, A. Gollhardt, H. Walter, R. Dudek, R. Kuhnert, B. Michel

{"title":"mTest-a new approach to measure material properties from microscopic specimens","authors":"D. Vogel, A. Gollhardt, H. Walter, R. Dudek, R. Kuhnert, B. Michel","doi":"10.1109/POLYTR.2001.973310","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973310","url":null,"abstract":"Thermo-mechanical reliability analysis for advanced electronic packaging requires additional material testing approaches. A new approach based on image correlation algorithms has been tested and established as the mTest method. It allows one to measure strains on microscopic images picked up from test specimens. These average strains over microscopically small areas can be used to determine different kinds of material properties, where strain values are required as essential input data. The method has been introduced by an automated measurement system for the determination of CTE values and Poisson ratios. The authors present measurement results for CTE values on composite materials like flip chip underfills as well as on thermoplastics with anisotropic CTE behavior. The mTest equipment and the achievable measurement capability are demonstrated. A discussion of typical CTE measurement errors illustrates how to provide adequate measurement data for real material behavior. The advantage of mTest measurements over classical TMA is shown for the CTE determination on flip chip underfill materials.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"71 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132861282","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

VTE - A new method for the characterisation of thin film thermophysical properties VTE——表征薄膜热物理性质的新方法

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973309

O. Kahle, C. Uhlig, M. Bauer

{"title":"VTE - A new method for the characterisation of thin film thermophysical properties","authors":"O. Kahle, C. Uhlig, M. Bauer","doi":"10.1109/POLYTR.2001.973309","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973309","url":null,"abstract":"Variable temperature ellipsometry (VTE) is a new non-destructive method for the thermophysical characterisation of (polymeric) materials in the thin film state by combining spectroscopic ellipsometry with temperature dependency. The variation of temperature opens a complete new use of ellipsometry to investigate thin film properties. The method is suitable especially for characterisation of polymeric layers which play an increasing role in microelectronic and microsystem technique. Polymeric materials often show different properties in the nanometer scale compared to the well investigated bulk state or don't exists in the bulk state like plasma polymers or CVDs. For this reason, VTE was developed to investigate the physical properties in the thin film state directly. The method can be used to investigate the following thin film polymeric properties and their thickness dependence in the thickness range from 50 nm to some /spl mu/m: coefficient of thermal expansion, glass transition temperature, thermal degradation, kinetic of evaporation of volatiles (low molecular weight components, solvents), absorption of water, thermal stresses, changes in optical properties.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131063958","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

OLED matrix displays: technology and fundamentals OLED矩阵显示器:技术和基础

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973250

W. Kowalsky, E. Becker, T. Benstem, T. Dobbertin, D. Heithecker, H. Johannes, D. Metzdorf, H. Neuner

{"title":"OLED matrix displays: technology and fundamentals","authors":"W. Kowalsky, E. Becker, T. Benstem, T. Dobbertin, D. Heithecker, H. Johannes, D. Metzdorf, H. Neuner","doi":"10.1109/POLYTR.2001.973250","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973250","url":null,"abstract":"For more than a decade, considerable effort has been put into the development of light emitting devices based on evaporated layers of organic semiconductors. To date, the properties of matrix displays consisting of organic light emitting diodes (OLEDs) basically meet automotive and consumer product requirements. OLED matrix displays offer high contrast, wide viewing angle and a broad temperature range at low power consumption. In contrast to polymer devices, OLEDs are processed in ultrahigh vacuum systems. The organic source materials are sublimated from effusion cells. Due to the sensitivity of organic thin films, device structuring by conventional etching techniques is not feasible and alternative structuring techniques were developed. Electrical current in organic devices is limited by the low conductivity of organic semiconductors and by energy barriers at the metal-organic semiconductor interface. Photoelectric measurements facilitate the determination of barrier height differences between various electrode set-ups. Further insights into the energy band alignment at organic heterointerfaces are gained by ultraviolet photoelectron spectroscopy (UPS). In addition to widely employed electrical (I-V, C-V) and optical (PI) measurements, thermally stimulated current (TSC) and luminescence (TSL) allow the characterization and a more detailed understanding of carrier traps and charge transport in organic devices. Energy transfer in a doped OLED emitting layer can be investigated by time-resolved photoluminescence measurements.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"156 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133073001","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 13

Advanced micro-dispensing system for conductive adhesives 先进的导电胶粘剂微点胶系统

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973253

T. Gaugel, S. Bechtel, J. Neumann-Rodekirch

引用次数: 7

Fast flip chip assembly for reel-to-reel manufacturing 快速倒装芯片组装卷轴到卷轴制造

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973302

M. Konig, G. Klink, M. Feil

引用次数: 4

The underfill processing technologies for flip chip packaging 倒装芯片封装的下填料加工技术

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973268

K. Chai, L. Wu

{"title":"The underfill processing technologies for flip chip packaging","authors":"K. Chai, L. Wu","doi":"10.1109/POLYTR.2001.973268","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973268","url":null,"abstract":"Flip chip technology has been developed for more than 30 years and is widely used in the assembly of high-performance devices that require good functionality on substrate space. Compared to traditional wire bonding interconnection, flip chip technology offers tremendous advantages such as eliminating wire bond connections, increasing input/output (I/O) density, and using less space on substrates. With the rapid growth in flip chip technology, the need for assembly services has been developed. The key challenge in flip chip technology development is to improve the reliability of flip chip assembly. To enhance reliability, underfill materials are applied to the gap between die and substrate to provide mechanical support as well as environmental protection to the assembly. Capillary flow underfill material is used to fill the gap and protect the flip chip bumps for better reliability performance for years, but it has the limitations of lower throughput, higher cost and storage. Transfer molded underfill was developed to replace liquid type underfill materials to provide a high productivity process, less expensive materials and reliable performance. This study compares capillary underfill and molded underfill processes. Suggestions for various flip chip package types and performance concerns are then provided.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125948368","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 12

Electronic adhesives new solutions for short cycled manufacturing process 电子胶粘剂短周期制造工艺的新解决方案

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 1900-01-01 DOI: 10.1109/POLYTR.2001.973289

R. Most

{"title":"Electronic adhesives new solutions for short cycled manufacturing process","authors":"R. Most","doi":"10.1109/POLYTR.2001.973289","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973289","url":null,"abstract":"Reactive adhesives, casting resins and encapsulants become more and more important in electronics manufacturing and development. The reasons for this are the trend towards miniaturisation and functional components and weight reduction. The task to bond very different material on a minimum of space securely, permanently and economy-priced with each other, makes the usage of classical joining techniques, such as screwing, riveting or welding nearly impossible. The adhesive, however, which is optimally adjusted to the respective application, is ideally suitable. Due to the markets globalisation and the trend towards outsourcing, the image of modem production firms is more and more dominated by industrial mass production. This leads towards the demand to serve adhesive applications with products which enable mass production with very short cycle times. Photoinitiated curing adhesives perfectly fulfil the requirements. In addition dual curing and heat curing adhesives which represent a further development of photoinitiated products are available for appliers now. The adhesives afford the ability of a quick heat curing at low temperatures. Dam and Fill products based on UV-curing epoxy resins, heat curing Die-Attach adhesives with a quick curing time, are represented in detail as well as new developments in the anisotropic and isotropic area of conductive adhesives for high volume mass production. We observe the range of properties and the reliability of different adhesives in detail.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125877242","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Green polytronics 绿色polytronics

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 1900-01-01 DOI: 10.1109/polytr.2001.973266

H. Griese, J. Muller, M. Hageluken, H. Reichl, K. Zuber

{"title":"Green polytronics","authors":"H. Griese, J. Muller, M. Hageluken, H. Reichl, K. Zuber","doi":"10.1109/polytr.2001.973266","DOIUrl":"https://doi.org/10.1109/polytr.2001.973266","url":null,"abstract":"Due to the anticipated high economical relevance of polytronics (low cost, high volume, high innovation rates, short product life, exploding diversity of products), life-cycle engineering is required at an early stage of material and process development. The environmental effects of polytronics are highly variable depending as much on the stage of product life (material production, product assembly, use, and end of life) as on the type of the materials. Due to the expected widespread use of polymers in mobile products, an environmental assessment is necessary to get further criteria for the selection. The high complexity of life-cycle assessment using conventional methods is found to be exemplary for the production of epoxy resin, a versatile pre-product for many applications. Since ecological assessment is key for improvement and optimization, a simplified methodology for the regarded complex products and processes is essential. EE-Toolbox provides a screening method developed especially for electronic products, based on the material content. As polymer materials until now are only considered according to their content of certain additives, a new tool for environmental screening assessment of these materials is introduced. With regard to the need for CO/sub 2/ reduction and energy preservation, characteristic incineration values are used for rating. It is assumed that thermal pretreatment is a major disposal pathway, particularly for future mobile products. The environmental impact of polymer materials is expected to be much lower compared to that of heavy metals and their compounds. Thus, expectations are high for environmental benefits of polytronics, but further examinations are necessary.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"251 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133585434","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Light emitting polymer materials for full color displays 全彩显示用发光高分子材料

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 1900-01-01 DOI: 10.1109/POLYTR.2001.973305

H. Becker, A. Busing, S. Heun, A. Falcou, O. Gelsen, E. Kluge, W. Kreuder, A. Parham, H. Schenk, E. Steiger, H. Spreitzer, P. Stossel, K. Treacher, H. Vestweber

{"title":"Light emitting polymer materials for full color displays","authors":"H. Becker, A. Busing, S. Heun, A. Falcou, O. Gelsen, E. Kluge, W. Kreuder, A. Parham, H. Schenk, E. Steiger, H. Spreitzer, P. Stossel, K. Treacher, H. Vestweber","doi":"10.1109/POLYTR.2001.973305","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973305","url":null,"abstract":"Summary form only given. We have developed a range of polymers based on phenyl-PPVs which are now being commercially exploited in the first polymer LED applications. These materials have been developed systematically to meet the demanding device requirements (e.g. high efficiency and lifetime) and industrial applicability (e.g. processibility, reproducibility and reliability of supply). A wide range of PPVs with different properties (color, efficiency) is manufactured at the Covion production site and is available as a \"ready to use\" formulated product on a commercial scale. We report on progress in the development of red, green and blue materials. The requirements for the different colors vary depending on band gap and therefore the challenges for each color are different. The experience gained in understanding important structure-property relationships in phenyl-PPVs as well as that with high performance small molecule materials (spiro materials) has been employed for the development of these polymers.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128996657","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3