Electronic adhesives new solutions for short cycled manufacturing process

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 1900-01-01 DOI:10.1109/POLYTR.2001.973289

R. Most

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Abstract

Reactive adhesives, casting resins and encapsulants become more and more important in electronics manufacturing and development. The reasons for this are the trend towards miniaturisation and functional components and weight reduction. The task to bond very different material on a minimum of space securely, permanently and economy-priced with each other, makes the usage of classical joining techniques, such as screwing, riveting or welding nearly impossible. The adhesive, however, which is optimally adjusted to the respective application, is ideally suitable. Due to the markets globalisation and the trend towards outsourcing, the image of modem production firms is more and more dominated by industrial mass production. This leads towards the demand to serve adhesive applications with products which enable mass production with very short cycle times. Photoinitiated curing adhesives perfectly fulfil the requirements. In addition dual curing and heat curing adhesives which represent a further development of photoinitiated products are available for appliers now. The adhesives afford the ability of a quick heat curing at low temperatures. Dam and Fill products based on UV-curing epoxy resins, heat curing Die-Attach adhesives with a quick curing time, are represented in detail as well as new developments in the anisotropic and isotropic area of conductive adhesives for high volume mass production. We observe the range of properties and the reliability of different adhesives in detail.

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电子胶粘剂短周期制造工艺的新解决方案

反应性胶粘剂、铸造树脂和密封剂在电子制造和发展中变得越来越重要。其原因是小型化和功能部件以及重量减轻的趋势。将不同的材料在最小的空间内安全、永久、经济地粘合在一起的任务，使得使用传统的连接技术，如螺丝、铆接或焊接几乎不可能。粘合剂，然而，这是最佳调整到各自的应用，是理想的合适。由于市场的全球化和外包的趋势，现代生产企业的形象越来越被工业大规模生产所主导。这导致了对粘合剂应用的需求，这些产品可以在很短的周期内实现大规模生产。光引发固化胶粘剂完全满足要求。此外，双固化和热固化胶粘剂代表了光引发产品的进一步发展，现在可供应用。胶粘剂提供了在低温下快速热固化的能力。详细介绍了基于光固化环氧树脂的Dam和Fill产品、快速固化的热固化模贴胶以及导电胶在各向异性和各向同性领域的新进展。我们详细观察了不同胶粘剂的性能范围和可靠性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)

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