Non-migration conductive adhesives

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI:10.1109/POLYTR.2001.973261

Y. Shirai, M. Komagata, K. Suzuki

{"title":"Non-migration conductive adhesives","authors":"Y. Shirai, M. Komagata, K. Suzuki","doi":"10.1109/POLYTR.2001.973261","DOIUrl":null,"url":null,"abstract":"Ag filled isotropic conductive adhesives (ICAs) have been investigated as promising alternatives to lead-containing solders in surface mount technology (SMT) applications. However, one serious concern is the electromigration of silver filled ICAs, especially when used in high density interconnection assembly. This paper investigates electromigration resistance of ICAs using Ag-Sn alloys as conductive fillers. It was found that electromigration resistance depends on Ag:Sn ratios and that Ag-Sn alloys containing 25/spl sim/75 mol% of Sn have excellent resistance. These new ICAs and conventional ICAs (as reference) were evaluated for SMT, using chip components with several kinds of terminations for their stability of contact resistance and adhesion strength during reliability tests. From the test results, it can be concluded that the new ICAs are suitable potential materials for SMT application.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/POLYTR.2001.973261","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 4

Abstract

Ag filled isotropic conductive adhesives (ICAs) have been investigated as promising alternatives to lead-containing solders in surface mount technology (SMT) applications. However, one serious concern is the electromigration of silver filled ICAs, especially when used in high density interconnection assembly. This paper investigates electromigration resistance of ICAs using Ag-Sn alloys as conductive fillers. It was found that electromigration resistance depends on Ag:Sn ratios and that Ag-Sn alloys containing 25/spl sim/75 mol% of Sn have excellent resistance. These new ICAs and conventional ICAs (as reference) were evaluated for SMT, using chip components with several kinds of terminations for their stability of contact resistance and adhesion strength during reliability tests. From the test results, it can be concluded that the new ICAs are suitable potential materials for SMT application.

查看原文本刊更多论文

不迁移导电胶粘剂

Ag填充的各向同性导电胶粘剂(ICAs)已被研究作为表面贴装技术(SMT)应用中含铅焊料的有前途的替代品。然而，一个严重的问题是银填充的ica的电迁移，特别是当用于高密度互连组件时。本文研究了以银锡合金为导电填料的ICAs的电迁移性能。结果表明，Ag-Sn合金的电迁移电阻与银锡比有关，含25/spl sim/75 mol% Sn的Ag-Sn合金具有优异的电迁移电阻。在可靠性测试中，对这些新型ICAs和传统ICAs(作为参考)进行了评估，使用具有几种终端的芯片组件进行了接触电阻稳定性和粘附强度的测试。从测试结果可以得出结论，新型ica是适合SMT应用的潜在材料。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)

自引率

0.00%

发文量