First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)最新文献_第4页

Paper electronics and electronic paper 电子纸和电子纸

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973298

M. Berggren, T. Kugler, T. Remonen, D. Nilsson, Miaoxiang Chen, P. Norberg

引用次数: 16

Structural mechanics of polymer coated optical glass fibres: review 聚合物涂层光学玻璃纤维的结构力学研究进展

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973293

E. Suhir

引用次数: 7

New fabrication technology of polymer/metal lamination and its application in electronic packaging 聚合物/金属层合新工艺及其在电子封装中的应用

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973251

T. Suga, A. Takahashi, K. Saijo, S. Oosawa

引用次数: 16

Three-dimensional (3D) ICs: a technology platform for integrated systems and opportunities for new polymeric adhesives 三维集成电路:集成系统的技术平台和新聚合物粘合剂的机会

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973276

R. Gutmann, J. Lu, Y. Kwon, J. McDonald, T. Cale

引用次数: 41

Micro dispensing of adhesives and other polymers 粘合剂和其他聚合物的微点胶

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973252

W. Meyer

{"title":"Micro dispensing of adhesives and other polymers","authors":"W. Meyer","doi":"10.1109/POLYTR.2001.973252","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973252","url":null,"abstract":"Due to the progress in miniaturization of electronic and optoelectronic devices, new processing methods are needed for micro dispensing of adhesives and other polymers. Applications are found in fields like joining, marking and coating. Here, micro dispensing is defined in volume ranges of 30-500 pl (/spl sim/30-500 ng). Not only small volumes but also precision and flexibility are in high demand. For a certain range of adhesives and other polymers used especially in optoelectronic devices, microdrop provides equipment for microdispensing. The basic technique is a spin-off from inkjet-technology and profits from the flexibility and precision of this technology due to the contactless drop ejection. Also, extremely aggressive organic solvents do not cause problems for the valve-free dispensers. This makes the microdrop technology very attractive for solved polymers as used for LEP (light emitting polymer) applications. Here, the actual applications and possibilities are illustrated and the current developments for improved processing strategies are described. There are some demands on the properties of such polymers usable for micro dispensing. These are explained and the limitations are discussed.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"216 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115979933","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 12

Polymer optical interconnects for PCB 用于PCB的聚合物光学互连

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973306

H. Schroder, J. Bauer, F. Ebling, W. Scheel

{"title":"Polymer optical interconnects for PCB","authors":"H. Schroder, J. Bauer, F. Ebling, W. Scheel","doi":"10.1109/POLYTR.2001.973306","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973306","url":null,"abstract":"Fraunhofer IZM has developed a packaging concept, which is based on a hybrid carrier, containing both electrical and optical interconnects: the Electrical Optical Circuit Board (EOCB). The key element is an additional optical layer with multimode waveguide structures. This layer is handled by standard PCB technology. As a result, the waveguides are completely incorporated into the circuit board. We used the hot embossing process for the first test of effective foil-structuring. After filling the core of the waveguides and sealing them with an over-cladding, the optical layer is given into the PCB process. Furthermore, waveguide structuring by photolithographic patterning is also a promising way to incorporate waveguide structures into the circuit board and is currently under test. The choice of appropriate polymer materials is a key problem when applying these techniques. They have to be compatible with the structuring and laminating processes and display excellent optical properties. We focus on recent results showing the optical characteristics of laminated polymer waveguides made by hot embossing and of waveguides made by photolithography.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129380927","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 24

A new structuring technique for polymer integrated circuits 一种新的聚合物集成电路结构技术

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973264

E. Becker, H. Johannes, T. Benstem, T. Dobbertin, D. Heithecker, D. Metzdorf, H. Neuner, W. Kowalsky

引用次数: 3

Evaluation of bismuth as a filler material for anisotropically conductive adhesive 铋作为各向异性导电胶粘剂填充材料的评价

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973280

M. Vuorela, J. Kivilahti

{"title":"Evaluation of bismuth as a filler material for anisotropically conductive adhesive","authors":"M. Vuorela, J. Kivilahti","doi":"10.1109/POLYTR.2001.973280","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973280","url":null,"abstract":"Summary form only given. Tin and bismuth are metallurgically compatible because they are unable to form intermetallics with each other. When in contact with each other, i.e. in a local chemical equilibrium, the melting point of the Sn/Bi interface is 139/spl deg/C. During the bonding procedure above 139/spl deg/C tin and bismuth atoms dissolve very fast into the liquid until local equilibrium has been reached. Between Sn-coated pads or bumps, Bi particles form small lentils, the volumes of which depend on the particle size and the bonding temperature. When the temperature is decreased the liquid lentils solidify and bond locally the mating pads together inside the adhesive. The procedure for the SnPb/Bi system is quite similar. Basically, the only difference is that the local melting of the SnPb/Bi interface is initiated at about 93 /spl deg/C. The bonding process of Sn-bumped chips on Sn-coated substrates with different adhesives being filled with Bi particles is also presented. The solder joints formed at different bonding temperatures and with different pressure settings are examined with optical and scanning electron microscopy as well as with energy dispersive spectroscopy.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125385874","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Calibrate piezoresistive stress sensors through the assembled structure 通过组装的结构校准压阻式应力传感器

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1115/1.1572904

B. Lwo, C. Kao, Tung-Sheng Chen, Shenqu Wu

引用次数: 18

Polycyanurate ester resins with low loss for use in integrated optics 集成光学用低损耗聚氰脲酸酯树脂

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI: 10.1109/POLYTR.2001.973294

C. Dreyer, M. Bauer, J. Bauer, N. Keil, H. Yao, C. Zawadzki

引用次数: 5