New fabrication technology of polymer/metal lamination and its application in electronic packaging

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI:10.1109/POLYTR.2001.973251

T. Suga, A. Takahashi, K. Saijo, S. Oosawa

引用次数: 16

Abstract

A new fabrication technology for lamination between LCP (liquid crystalline polymer)and copper is presented. The method is based on a surface activation process prior to the clad bonding process. The fabrication conditions and the microstructure of the bonded interface as well as the mechanism of the bonding are discussed with respect to various experimental results. Some practical applications of the new clad materials in electronic packaging are also presented.

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聚合物/金属层合新工艺及其在电子封装中的应用

提出了一种新的液晶聚合物与铜层合的制备工艺。该方法基于在包层粘合过程之前的表面活化过程。结合各种实验结果，讨论了键合界面的制备条件、微观结构和键合机理。介绍了新型包层材料在电子封装中的一些实际应用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)

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