Smart labels-high volume applications using adhesive flip-chip-technologies

Abstract

The authors present requirements, conditions and experiences for the production of smart labels in a reel-to-reel assembly technique. They compare different adhesive flip-chip technologies as well as different types of adhesives for smart label production schemes. Technology advantages for low cost substrates like PET in combination with copper or aluminium antenna tracks are presented. Besides the technology and material adaptations, electrical and mechanical properties of flip-chip interconnections are presented. In the last part of the paper, the authors present a new generation of smart labels-active working smart labels. These labels include a battery and additional electronic functions.