2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)最新文献

Comparison of junction temperature prediction methods through analysis of isolated 1-D thermal resistance model variables of an application utilizing forced convection of heat sinks 通过对一个利用强迫对流散热片的孤立一维热阻模型变量的分析，比较结温预测方法

2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Pub Date : 2018-05-09 DOI: 10.1109/SEMI-THERM.2018.8357362

N. Klitzke, S. Polzer, W. Wilkins, B. Gilbert, C. Haider

{"title":"Comparison of junction temperature prediction methods through analysis of isolated 1-D thermal resistance model variables of an application utilizing forced convection of heat sinks","authors":"N. Klitzke, S. Polzer, W. Wilkins, B. Gilbert, C. Haider","doi":"10.1109/SEMI-THERM.2018.8357362","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2018.8357362","url":null,"abstract":"Discrepancies between estimated and actual thermal solution performance may negatively bias early system design decisions and ultimately result in costly redesigns. In particular, an overreliance on manufacturer-provided performance data and insufficiently accurate prediction methods are two potential causes of large discrepancies. To demonstrate deviations between predicted and end-thermal-performance, three methods of predicting thermal performance were investigated. The reference design was a forced convection air-cooled computer chassis, consisting of four printed circuit boards (PCBs), each populated with four processors that utilize heat sinks. The three predictive methods used were rudimentary analytical calculations, spreadsheet based modeling, and computational fluid dynamics (CFD) simulation. The results from these methods were compared to measured results taken from the physical hardware test bed. A thermal resistance network model was used to describe the problem, and the comparison between the measured and calculated results for each element of the model was reported as a percent error. Note that in cases in which physical measurements could not be obtained, the comparison was made between the CFD results and the other calculations. All predictive methods using manufacturer-supplied thermal interface material (TIM) data indicated adequate thermal margin. When corrected TIM values were used, both the hand calculation method and the spreadsheet modeling method indicated adequate thermal margin; however, the CFD analysis predicted significant thermal issues, which were observed in the thermal test bed measured results.","PeriodicalId":277758,"journal":{"name":"2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125714833","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Investigations of low temperature co-fired ceramic heat spreading interposer for the thermal management of three-dimensional packages 三维封装热管理用低温共烧陶瓷扩热器的研究

2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Pub Date : 2018-03-19 DOI: 10.1109/SEMI-THERM.2018.8357346

Si Huang, S. Ang

引用次数: 3

Application of thermal network approach to electrical-thermal co-simulation and chip-package-board extraction 热网络方法在电-热联合仿真和芯片封装板提取中的应用

2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Pub Date : 2018-03-19 DOI: 10.1109/SEMI-THERM.2018.8357345

Fengyun Zhao, Y. Cai, Zipeng Luo, A. Kuo, Xin Ai, C. Kao, Zhemin Zhuang

{"title":"Application of thermal network approach to electrical-thermal co-simulation and chip-package-board extraction","authors":"Fengyun Zhao, Y. Cai, Zipeng Luo, A. Kuo, Xin Ai, C. Kao, Zhemin Zhuang","doi":"10.1109/SEMI-THERM.2018.8357345","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2018.8357345","url":null,"abstract":"Today's electronic products are getting highly integrated. The thermal design can no longer be separated from the electrical design, and the chip, package and PCB (Printed Circuit Board) designs are tightening in the system design process. To address this challenge, the system level electrical-thermal co-design and optimization are of importance. In this paper, two different numerical approaches are presented on the system level electrical-thermal co-simulation of Huawei's computer server. The first one is based on the detailed modeling of chips, package and PCB, and the traditional finite element method (FEM) is used for the co-simulation. It has its accuracy advantage, and can provide detailed assessments of the system's electrical and thermal performances, and also the couplings between them. This approach is demonstrated through an electrical-thermal co-simulation of a merged chip, package and PCB design in the server. The second approach is based on a novel dynamic thermal model which has demonstrated high accuracy and efficiency especially in transient analysis of a complex system, and the fast network simulator is used for the system-level thermal simulation. In this paper, the computer server is decoupled into multiple domains such as air flows, chassis, heat sinks, PCB boards, packages, etc., and the thermal system can be reconstructed as an integrated model-based network. Both steady and transient thermal simulations are presented, and thermal simulation results are validated with the experimental data.","PeriodicalId":277758,"journal":{"name":"2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"219 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-03-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115988922","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Different questions of today's LED thermal testing procedures 不同的问题，今天的LED热测试程序

2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Pub Date : 2018-03-19 DOI: 10.1109/SEMI-THERM.2018.8357354

G. Hantos, J. Hegedüs, A. Poppe

引用次数: 6

Natural graphite sheet heat sinks: A review of the material properties, benefits, and challenges 天然石墨片散热器:材料性能，效益和挑战的回顾

2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Pub Date : 2018-03-19 DOI: 10.1109/SEMI-THERM.2018.8357353

M. Čermák, M. Bahrami, J. Kenna

{"title":"Natural graphite sheet heat sinks: A review of the material properties, benefits, and challenges","authors":"M. Čermák, M. Bahrami, J. Kenna","doi":"10.1109/SEMI-THERM.2018.8357353","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2018.8357353","url":null,"abstract":"A multidisciplinary feasibility study of natural graphite sheet (NGS) heat sinks, addressing the thermal, EMI/EMC, reliability, cost and manufacturing perspectives, is presented together with a brief overview of the relevant graphitic materials and a summary of the NGS properties (thermal conductivity, heat capacity, weight, electrical conductivity, emissivity, coefficient of thermal expansion). The high in-plane thermal conductivity (up to 600 W-m−1·K−1) of NGS and low interface resistance of NGS heat sinks can lead to good thermal performance despite the low through-plane thermal conductivity of NGS, but new designs are required. Low electrical conductivity offers a potential to decrease conducted and radiated electromagnetic emissions and significant weight reduction can be achieved due to the low density of NGS. The raw material cost of natural graphite is shown to be lower than aluminum and a high-volume manufacturing method is discussed. Low mechanical strength of NGS does not allow mounting using threaded holes in the heat sink, limits applications where a chance collision with other objects exists, and might have an impact on reliability of large power modules.","PeriodicalId":277758,"journal":{"name":"2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"335 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-03-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133958451","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Recent advances in oscillating heat pipes for passive electronics thermal management 无源电子热管理用振荡热管研究进展

2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Pub Date : 2018-03-19 DOI: 10.1109/SEMI-THERM.2018.8357350

J. Boswell, Corey Wilson, D. Pounds, B. Drolen

引用次数: 1

Delphi-like dynamical compact thermal models using model order reduction based on modal approach 基于模态方法的模型阶数约简的类德尔菲动态紧凑热模型

2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Pub Date : 2018-03-19 DOI: 10.1109/SEMI-THERM.2018.8357347

B. Rogié, S. Grosjean, E. Monier-Vinard, V. Bissuel, F. Joly, O. Daniel, N. Laraqi, K. Vera

{"title":"Delphi-like dynamical compact thermal models using model order reduction based on modal approach","authors":"B. Rogié, S. Grosjean, E. Monier-Vinard, V. Bissuel, F. Joly, O. Daniel, N. Laraqi, K. Vera","doi":"10.1109/SEMI-THERM.2018.8357347","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2018.8357347","url":null,"abstract":"The Compact Thermal Models (CTMs) became a standard for low-cost modeling of single-chip electronic packages. According with Delphi's method, their creation is time consuming since numerical simulations of a Detailed Thermal Models (DTMs) of the package have to be repeated for large sets of Robin's Boundary Conditions (BCs). Moreover Jedec standards do not provide guidance to consider multi-chip packages or to investigate the creation of multi-path transient behavioral models. The present study proposes a complementary method to create Dynamical Delphi-style CTMs (DCTMs acronym). This one promotes the replacing of the heavy computational simulations of a given detailed model by a faster reduced order model, built by the means of modal approach. At first, that multi-stage reduction method is applied with success to a single-chip package (QFN16) then to a dual-chip package (DFN12). As relevant results, the mathematical computation time is drastically shortened, which allows speeding up the DCTM creation procedure by 80%, without degrading its accuracy.","PeriodicalId":277758,"journal":{"name":"2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"106 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-03-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122603614","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7

Design and optimization of contra-rotating fans 对转风机的设计与优化

2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Pub Date : 2018-03-19 DOI: 10.1109/SEMI-THERM.2018.8357377

R. Mueller, O. Velde, C. Friebe

引用次数: 0

NASA ISS portable fan assembly acoustics 美国宇航局国际空间站便携式风扇总成声学

2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Pub Date : 2018-03-19 DOI: 10.1109/SEMI-THERM.2018.8357376

A. Boone, C. Allen

引用次数: 0

Multi-die packaging and thermal superposition modeling 多模封装和热叠加建模

2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Pub Date : 2018-03-19 DOI: 10.1109/SEMI-THERM.2018.8357348

M. Kelly, Phillip Fosnot, Jonathan C. J. Wei, Max Min, J. Galloway

引用次数: 3