Investigations of low temperature co-fired ceramic heat spreading interposer for the thermal management of three-dimensional packages

The heat density in three-dimensional (3D) power module packages is significantly increased because of the stacked structure and the small footprints of devices, making thermal management a key issue to maintain the performance of these power modules. This paper proposes a low temperature co-fired ceramic (LTCC) heat spreading interposer as a novel cooling solution for 3D packages, and investigates the effects of various high thermally conductive materials on the thermal performance of the interposer, including graphene and pyrolytic graphite sheet (PGS). A two-chip face-to-face stacked configuration was used as the model for analysis and thermal simulations. Steady state temperature tests were performed on the LTCC interposers of different structures and integrated with different thermal spreading materials, and their thermal performance were compared.