Delphi-like dynamical compact thermal models using model order reduction based on modal approach

Abstract

The Compact Thermal Models (CTMs) became a standard for low-cost modeling of single-chip electronic packages. According with Delphi's method, their creation is time consuming since numerical simulations of a Detailed Thermal Models (DTMs) of the package have to be repeated for large sets of Robin's Boundary Conditions (BCs). Moreover Jedec standards do not provide guidance to consider multi-chip packages or to investigate the creation of multi-path transient behavioral models. The present study proposes a complementary method to create Dynamical Delphi-style CTMs (DCTMs acronym). This one promotes the replacing of the heavy computational simulations of a given detailed model by a faster reduced order model, built by the means of modal approach. At first, that multi-stage reduction method is applied with success to a single-chip package (QFN16) then to a dual-chip package (DFN12). As relevant results, the mathematical computation time is drastically shortened, which allows speeding up the DCTM creation procedure by 80%, without degrading its accuracy.