2022 International Electron Devices Meeting (IEDM)最新文献

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Wafer-scale biologically sensitive carbon nanotube transistors: from fabrication to clinical applications 晶圆级生物敏感碳纳米管晶体管:从制造到临床应用
2022 International Electron Devices Meeting (IEDM) Pub Date : 2022-12-03 DOI: 10.1109/IEDM45625.2022.10019375
Mengmeng Xiao, Zhiyong Zhang
{"title":"Wafer-scale biologically sensitive carbon nanotube transistors: from fabrication to clinical applications","authors":"Mengmeng Xiao, Zhiyong Zhang","doi":"10.1109/IEDM45625.2022.10019375","DOIUrl":"https://doi.org/10.1109/IEDM45625.2022.10019375","url":null,"abstract":"Developing highly sensitive biosensors with the characteristics of label-free, rapidity and low-cost is of great significance for the early diagnosis of many diseases. Carbon nanotubes (CNTs) have atomic-thickness bodies and good biocompatibility, and thus have drown great interests in applications for field-effect transistor (FET)-based biosensors to achieve ultra-low biological detection limit and high selectivity through controlled chemical functionalization. The fabrication process of CNT FET biosensors is well compatible with Si based complementary metal–oxide–semiconductor (CMOS) technology, making them fit well with the requirements of highly integrated, multifunctional and low-cost portable bio-sensing systems. This paper reviews recent progresses in large scale fabrication of CNT FET based bio-chemical sensors and their application in various biomarkers ultra-sensitive detection and then reveal remaining challenges and the development direction of CNT FET based biosensors.","PeriodicalId":275494,"journal":{"name":"2022 International Electron Devices Meeting (IEDM)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124966180","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Low-voltage and high-speed switching of a magnetoelectric element for energy efficient compute 用于节能计算的磁电元件的低压高速开关
2022 International Electron Devices Meeting (IEDM) Pub Date : 2022-12-03 DOI: 10.1109/IEDM45625.2022.10019505
Punyashloka Debashis, J. Plombon, Chia-Ching Lin, Y. Liao, Hai Helen Li, Dmitri E. Nikonov, Dominique Adams, C. Rogan, Mahendra Dc, M. Radosavljevic, S. Clendenning, I. Young
{"title":"Low-voltage and high-speed switching of a magnetoelectric element for energy efficient compute","authors":"Punyashloka Debashis, J. Plombon, Chia-Ching Lin, Y. Liao, Hai Helen Li, Dmitri E. Nikonov, Dominique Adams, C. Rogan, Mahendra Dc, M. Radosavljevic, S. Clendenning, I. Young","doi":"10.1109/IEDM45625.2022.10019505","DOIUrl":"https://doi.org/10.1109/IEDM45625.2022.10019505","url":null,"abstract":"150 mV voltage-driven switching of a ferromagnet (FM) exchange-coupled to 6-nm-thick lanthanum-doped BiFeO3(LBFO) was demonstrated at room temperature (RT). Further, less than 2 ns 0%-90% switching of LBFO ferroelectric polarization was demonstrated through real-time oscilloscope measurements. These two results are respectively the lowest voltage magnetoelectric switching and the highest switching speed measured in LBFO, enabled by high quality epitaxial growth of ultra-thin LBFO/FM films. These results are key accomplishments for energy efficient computing as has been shown through circuit-level simulations of the magnetoelectric random access memory (ME-RAM) utilizing compact models calibrated to the experiments in this work.","PeriodicalId":275494,"journal":{"name":"2022 International Electron Devices Meeting (IEDM)","volume":"75 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130132292","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Low-Thermal-Budget BEOL-Compatible Beyond-Silicon Transistor Technologies for Future Monolithic-3D Compute and Memory Applications 面向未来单片3d计算和存储应用的低热预算beol兼容超硅晶体管技术
2022 International Electron Devices Meeting (IEDM) Pub Date : 2022-12-03 DOI: 10.1109/IEDM45625.2022.10019511
A. Thean, Shih-Hao Tsai, Chun-Kuei Chen, M. Sivan, B. Tang, S. Hooda, Zihang Fang, Jieming Pan, J. Leong, H. Veluri, E. Zamburg
{"title":"Low-Thermal-Budget BEOL-Compatible Beyond-Silicon Transistor Technologies for Future Monolithic-3D Compute and Memory Applications","authors":"A. Thean, Shih-Hao Tsai, Chun-Kuei Chen, M. Sivan, B. Tang, S. Hooda, Zihang Fang, Jieming Pan, J. Leong, H. Veluri, E. Zamburg","doi":"10.1109/IEDM45625.2022.10019511","DOIUrl":"https://doi.org/10.1109/IEDM45625.2022.10019511","url":null,"abstract":"If Si CMOS for massive M3D is difficult due to need for high-thermal-budget processes, are there solutions that are beyond Si? In this article, we discuss two low-thermal-budget approaches: Oxide Semiconductor and 2D Materials for M3D integration. By reviewing some of our recent work with IGZO-based transistors and memories, followed by our investigation of the 2D material opportunities for 3D memories, we highlight the need for new low-thermal-budget additive techniques for heterogenous multi-material integration as well as low-temperature material modification. Given the unlikelihood of “perfect materials”, new system architecture-material-device co-design intervention will be essential to capitalize on the specific trade-offs of the components.","PeriodicalId":275494,"journal":{"name":"2022 International Electron Devices Meeting (IEDM)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130994610","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
3D Monolithic Integration of ScAlN-based GHz MEMS Acoustic Filters on 200mm RFSOI Wafer 基于scaln的GHz MEMS声滤波器在200mm RFSOI晶圆上的3D单片集成
2022 International Electron Devices Meeting (IEDM) Pub Date : 2022-12-03 DOI: 10.1109/IEDM45625.2022.10019557
Y. Zhang, X. Wang, C. Liu, E. Woo, W. Yang, Q. Zhang, H. Lin, D. Yan, R. Kumarasamy, B. Chen, N. Wang, Y. Zhu
{"title":"3D Monolithic Integration of ScAlN-based GHz MEMS Acoustic Filters on 200mm RFSOI Wafer","authors":"Y. Zhang, X. Wang, C. Liu, E. Woo, W. Yang, Q. Zhang, H. Lin, D. Yan, R. Kumarasamy, B. Chen, N. Wang, Y. Zhu","doi":"10.1109/IEDM45625.2022.10019557","DOIUrl":"https://doi.org/10.1109/IEDM45625.2022.10019557","url":null,"abstract":"A wafer-level 3D monolithic integration of the scandium aluminum nitride (ScAlN) based radio frequency (RF) bulk acoustic wave (BAW) filters with RF silicon-on-insulator (RFSOI) switches were demonstrated for the first time, aiming for significant reduction of footprint and parasitics for the next generation RF frontend modules in wireless communication systems. The integrated switched filter operating at 2.5GHz achieves an insertions loss of <3.6 dB and bandwidth of >120 MHz within a compact area of <1mm2. The cross coupling between the BAW filter and RFSOI switch circuitry was investigated and a circuit model was developed to capture the interconnection parasitics introduced by the integration. Further characterizations, including high power intermodulation, temperature sweep and wafer-level uniformity test, were carried out to ascertain the robustness of the integration scheme.","PeriodicalId":275494,"journal":{"name":"2022 International Electron Devices Meeting (IEDM)","volume":"64 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126762738","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
3-Tier BSI CIS with 3D Sequential & Hybrid Bonding Enabling a1.4um pitch,106dB HDR Flicker Free Pixel 3层BSI CIS具有3D顺序和混合键接,支持1.4um间距,106dB HDR无闪烁像素
2022 International Electron Devices Meeting (IEDM) Pub Date : 2022-12-03 DOI: 10.1109/IEDM45625.2022.10019432
F. Guyader, P. Batude, P. Malinge, E. Vire, J. Lacord, J. Jourdon, J. Poulet, L. Gay, F. Ponthenier, S. Joblot, A. Farcy, L. Brunet, A. Albouy, C. Theodorou, M. Ribotta, D. Bosch, E. Ollier, D. Muller, M. Neyens, D. Jeanjean, T. Ferrotti, E. Mortini, J.G. Mattei, A. Inard, R. Fillon, F. Lalanne, F. Roy, E. Josse
{"title":"3-Tier BSI CIS with 3D Sequential & Hybrid Bonding Enabling a1.4um pitch,106dB HDR Flicker Free Pixel","authors":"F. Guyader, P. Batude, P. Malinge, E. Vire, J. Lacord, J. Jourdon, J. Poulet, L. Gay, F. Ponthenier, S. Joblot, A. Farcy, L. Brunet, A. Albouy, C. Theodorou, M. Ribotta, D. Bosch, E. Ollier, D. Muller, M. Neyens, D. Jeanjean, T. Ferrotti, E. Mortini, J.G. Mattei, A. Inard, R. Fillon, F. Lalanne, F. Roy, E. Josse","doi":"10.1109/IEDM45625.2022.10019432","DOIUrl":"https://doi.org/10.1109/IEDM45625.2022.10019432","url":null,"abstract":"This paper demonstrates a 3-tier CMOS image sensor combining 3D Sequential Integration (3DSI) for the 2tier pixel realization & Hybrid Bonding (HB) for the logic circuitry connection. The pixel transistors are fabricated sequentially above the photogate through innovative thin SOI device technology offering scalability advantages versus its bulk counterpart. The demonstrated 3DSI pixel with dual carrier collection offers an attractive dynamic range (106dB, Single Exposure) versus pixel pitch $(1,4 mu mathrm{m})$ trade-off.","PeriodicalId":275494,"journal":{"name":"2022 International Electron Devices Meeting (IEDM)","volume":"125 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126855096","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Dynamics of PSG-Based Nanosecond Protonic Programmable Resistors for Analog Deep Learning 基于psg的纳秒质子可编程电阻器的模拟深度学习动力学
2022 International Electron Devices Meeting (IEDM) Pub Date : 2022-12-03 DOI: 10.1109/IEDM45625.2022.10019365
M. Onen, J. Li, B. Yildiz, J. D. del Alamo
{"title":"Dynamics of PSG-Based Nanosecond Protonic Programmable Resistors for Analog Deep Learning","authors":"M. Onen, J. Li, B. Yildiz, J. D. del Alamo","doi":"10.1109/IEDM45625.2022.10019365","DOIUrl":"https://doi.org/10.1109/IEDM45625.2022.10019365","url":null,"abstract":"We study the dynamics of a new class of three-terminal programmable resistors based on proton intercalation into a metal oxide channel using PSG as electrolyte for energy-efficient analog deep-learning hardware accelerators. These CMOS- and BEOL-compatible nanoscale devices exhibit excellent characteristics in terms of high operation speed (5 ns/pulse), high energy efficiency (~fJ/pulse), many (1000) nonvolatile conductance states across a large dynamic range (10×), linear and symmetric modulation, and high endurance [1]. This work presents the first real-time study of the dynamics of these devices evidencing impulse-like non-volatile conductance modulation with nanosecond-range pulses without any visible equilibration dynamics. Our study also reveals that the bottleneck to channel conductance modulation is proton transfer across the PSG/WO3 interface and not proton transport across the PSG.","PeriodicalId":275494,"journal":{"name":"2022 International Electron Devices Meeting (IEDM)","volume":"193 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123363383","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 26
The Nanopore-FET as a High-Throughput Barcode Molecule Reader for Single-Molecule Omics and Read-out of DNA Digital Data Storage 纳米孔场效应晶体管作为单分子组学和DNA数字数据存储读出的高通量条形码分子阅读器
2022 International Electron Devices Meeting (IEDM) Pub Date : 2022-12-03 DOI: 10.1109/IEDM45625.2022.10019451
K. Martens, David Barge, Lijun Liu, S. Santermans, Colin Stoquart, Jacobus Delport, K. Willems, Dino Ruić, S. Marion, J. Gevers, B. D. Bois, A. Andrei, L. Lagae, Mark Veugelers, A. Verhulst, S. Severi, P. Dorpe
{"title":"The Nanopore-FET as a High-Throughput Barcode Molecule Reader for Single-Molecule Omics and Read-out of DNA Digital Data Storage","authors":"K. Martens, David Barge, Lijun Liu, S. Santermans, Colin Stoquart, Jacobus Delport, K. Willems, Dino Ruić, S. Marion, J. Gevers, B. D. Bois, A. Andrei, L. Lagae, Mark Veugelers, A. Verhulst, S. Severi, P. Dorpe","doi":"10.1109/IEDM45625.2022.10019451","DOIUrl":"https://doi.org/10.1109/IEDM45625.2022.10019451","url":null,"abstract":"Nanopore technology has augmented DNA sequencing, and nascent nanopore-based technology breakthroughs may lead to major steps forward in large-scale molecular analysis (omics) and DNA digital data storage. A major weakness of current nanopore technologies is the requisite recording of pico-to nanoampere ionic currents. Such low currents limit recording bandwidth in large integrated arrays and impose a limit on how quickly a detectable molecule can cross, or translocate the pore. The Nanopore Field Effect Transistor (NPFET) is a nanopore surrounded by a nanoscale field-effect transistor. The field-effect transistor senses single molecules translocating through the pore relying on much larger microampere currents. The NPFET potentially offers higher bandwidths in large integrated arrays and the breaking of the nanopore translocation speed limit. Moreover, because individual electrolyte contacts are not required for NPFETs they are more easily integrated into large arrays than nanopores. NPFETs may lead to major strides in high throughput reading of molecularly encoded information. We will introduce and elaborate on nanopore FET technology research for omics and DNA data storage and we will propose a scaling roadmap that aims to incrementally boost NPFET molecular read throughput.","PeriodicalId":275494,"journal":{"name":"2022 International Electron Devices Meeting (IEDM)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121834830","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
First Demonstration of Monolithic 3D Self-aligned GeSi Channel and Common Gate Complementary FETs by CVD Epitaxy Using Multiple P/N Junction Isolation 采用多P/N结隔离的CVD外延技术首次展示单片三维自对准GeSi通道和共栅互补场效应管
2022 International Electron Devices Meeting (IEDM) Pub Date : 2022-12-03 DOI: 10.1109/IEDM45625.2022.10019532
Chien-Te Tu, Yi-Chun Liu, B. Huang, Yu-Rui Chen, Wan-Hsuan Hsieh, Chung-En Tsai, Shee-Jier Chueh, Chun-Yi Cheng, Yichen Ma, C. Liu
{"title":"First Demonstration of Monolithic 3D Self-aligned GeSi Channel and Common Gate Complementary FETs by CVD Epitaxy Using Multiple P/N Junction Isolation","authors":"Chien-Te Tu, Yi-Chun Liu, B. Huang, Yu-Rui Chen, Wan-Hsuan Hsieh, Chung-En Tsai, Shee-Jier Chueh, Chun-Yi Cheng, Yichen Ma, C. Liu","doi":"10.1109/IEDM45625.2022.10019532","DOIUrl":"https://doi.org/10.1109/IEDM45625.2022.10019532","url":null,"abstract":"Monolithic 3D self-aligned vertically stacked Ge0.75 Si0.25 nanosheet complementary FETs with multiple P/N junction isolation by in-situ doped CVD epitaxy are experimentally demonstrated. The triple P/N junctions using Ge:B/Ge:P multilayers suppress the leakage current without extra dielectric layers. Both the top pFETs and bottom nFETs have the same uniform GeSi nanosheets thanks to the co-optimization of CVD epitaxy and highly selective HNO3 wet etching (selectivity~140). Self-aligned GeSi channels and common gate architecture are fabricated as a CMOS inverter with good voltage transfer characteristics. The post-metallization annealing with the low thermal budget of 400°C improves the inverter characteristics such as switching threshold voltage and voltage gain. The self-aligned 3D stacked GeSi nanosheet pFETs on GeSi nanosheet nFETs without wafer bonding, dielectric isolation, and selective epi regrowth can simplify the process for 3D transistor stacking.","PeriodicalId":275494,"journal":{"name":"2022 International Electron Devices Meeting (IEDM)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123795992","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Single-molecule field-effect transistors: carbon nanotube devices for temporally encoded biosensing 单分子场效应晶体管:用于时间编码生物传感的碳纳米管器件
2022 International Electron Devices Meeting (IEDM) Pub Date : 2022-12-03 DOI: 10.1109/IEDM45625.2022.10019504
D. Lynall, K. Shepard
{"title":"Single-molecule field-effect transistors: carbon nanotube devices for temporally encoded biosensing","authors":"D. Lynall, K. Shepard","doi":"10.1109/IEDM45625.2022.10019504","DOIUrl":"https://doi.org/10.1109/IEDM45625.2022.10019504","url":null,"abstract":"Observation of biomolecular interactions at the single-molecule level reveals kinetic information crucial for understanding biophysical processes and provide the basis for a new class of molecular diagnostics based on time-domain analysis of molecular interactions. Point-functionalized carbon nanotubes, otherwise known as single-molecule field-effect transistors (smFETs), have shown significant advantage over fluorescence-based approaches for such single-molecule applications due to their high measurement bandwidths, virtually unlimited observation times, low cost, and capabilities for integration with CMOS in large arrays. Here, we demonstrate the capabilities of single-molecule field-effect transistors to measure DNA hybridization kinetics and to selectively detect small molecules through conformational changes of a single-stranded DNA aptamer. In both cases, kinetics can also be modified electrostatically by changes in the bias between the smFET and the surrounding electrolyte.","PeriodicalId":275494,"journal":{"name":"2022 International Electron Devices Meeting (IEDM)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122730967","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Monolithic Integration of Top Si3N4 - Waveguided Germanium Quantum-Dots Microdisk Light Emitters and PIN Photodetectors for On-chip Ultrafine Sensing 用于片上超细传感的Top Si3N4 -波导锗量子点微盘光源和PIN光电探测器的单片集成
2022 International Electron Devices Meeting (IEDM) Pub Date : 2022-12-03 DOI: 10.1109/IEDM45625.2022.10019407
Chih-Hsuan Lin, P. Hong, Bing-Ju Lee, Horng-Chih Lin, T. George, Pei-Wen Li
{"title":"Monolithic Integration of Top Si3N4 - Waveguided Germanium Quantum-Dots Microdisk Light Emitters and PIN Photodetectors for On-chip Ultrafine Sensing","authors":"Chih-Hsuan Lin, P. Hong, Bing-Ju Lee, Horng-Chih Lin, T. George, Pei-Wen Li","doi":"10.1109/IEDM45625.2022.10019407","DOIUrl":"https://doi.org/10.1109/IEDM45625.2022.10019407","url":null,"abstract":"Using a coordinated combination of lithographic patterning and self-assembled growth, Ge spherical quantum-dots (QDs) were controllably generated within host $Si_{3}N_{4}$ layers as active medium for Si photonics. A significant fabrication advantage of our approach is the high-temperature thermal stability of Ge QDs that are formed by thermal oxidation of poly-SiGe at $900^{o}C$, offering process flexibility in the waveguide-material choices and device designs. Our Ge QDs enable monolithic integration of $mu$ disk light-emitters and PIN photodetectors (PDs) with top $Si_{3}N_{4}$/SiO2/Ge waveguide-coupled structures using standard Si processing. Over 95% coupling efficiency from SiN WGs to Ge QD PDs is achievable. Ultralow dark current of $0.1 pA/mu m$, high responsivity of 3,500 A/W at 850 nm and 10A/W at 1550 nm, 3dB frequency $gt10$ GHz for Ge-QD PDs and low threshold power of $0.6 kW/cm^{2}$ for optically-pumped Ge QD/SiN $mu$ - disks lasing evidence the high degree of crystallinity of our Ge QDs as an effective building block for 3D SiN PICs.","PeriodicalId":275494,"journal":{"name":"2022 International Electron Devices Meeting (IEDM)","volume":"89 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131229669","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
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