2022 International Electron Devices Meeting (IEDM)

Advanced Package FAB Solutions(APFS) for Chiplet Integration

Pub Date : 2022-12-03 DOI: 10.1109/IEDM45625.2022.10019419 S. Yoon

First Demonstration of Homomorphic Encryption using Multi-Functional RRAM Arrays with a Novel Noise-Modulation Scheme

Pub Date : 2022-12-03 DOI: 10.1109/IEDM45625.2022.10019409 Xueqi Li, B. Gao, Bohan Lin, Ruihua Yu, Han Zhao, Ze Wang, Qiao Qin, Jianshi Tang, Qingtian Zhang, Xinyi Li, Zhenqi Hao, Xiaotao Li, Dequn Kong, Liqiu Ma, Ning Deng, H. Qian, Huaqiang Wu

Enabling full fault tolerant quantum computing with silicon based VLSI technologies

Pub Date : 2022-12-03 DOI: 10.1109/IEDM45625.2022.10019418 M. Vinet