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2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)最新文献

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Investigations on organic printed resistors based on PEDOT:PSS 基于PEDOT:PSS的有机印刷电阻研究
2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2012-12-24 DOI: 10.1109/SIITME.2012.6384352
C. Ionescu, P. Svasta, A. Vasile, D. Bonfert
{"title":"Investigations on organic printed resistors based on PEDOT:PSS","authors":"C. Ionescu, P. Svasta, A. Vasile, D. Bonfert","doi":"10.1109/SIITME.2012.6384352","DOIUrl":"https://doi.org/10.1109/SIITME.2012.6384352","url":null,"abstract":"The emerging of printed and organic electronics has been proven as a major trend in the last years. The only major commercial issue is represented by the organic light emitting diodes (OLED). In the current paper will be shown the results of electrical investigations of organic resistors based on poly(3,4-ethylenedioxythiophene) doped with polystyrenesulfonic acid (PEDOT:PSS). The influence of the track width and of aspect ratio is also investigated. The samples are prepared by ink-jetting, using two subsequent depositions, one is the silver termination and the second one is the active resistor material. It is expected that the results offer a guidance for organic resistor dimensioning and resistor overall parameters (rated power, temperature coefficient of resistance-TCR).","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128945962","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
New approach for measuring the surface tension of SnAgCu305 molten alloy 测量SnAgCu305合金熔液表面张力的新方法
2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2012-12-24 DOI: 10.1109/SIITME.2012.6384367
Ion Pencea, C. E. Sfat, M. Branzei, I. Plotog
{"title":"New approach for measuring the surface tension of SnAgCu305 molten alloy","authors":"Ion Pencea, C. E. Sfat, M. Branzei, I. Plotog","doi":"10.1109/SIITME.2012.6384367","DOIUrl":"https://doi.org/10.1109/SIITME.2012.6384367","url":null,"abstract":"The aim of the research is to improve the exactness of the measurement of the surface tension of the molten SnAgCu soldering alloy at different temperatures. The method used for surface tension measurement of molten alloys is of pendant drop type. The weak point of this method is the exactness of the curvature radius measurement, but mostly the exactness of the first order derivative of the droplet profile function depending on the droplet height measured from its apex. The authors propose a modeling approach of the droplet profile by analytical function of the class C2. Based on the analytical profile function were calculated the curvature of the droplet and subsequently the surface tension. The paper will present the main data and results obtained during the first part of the researches regarding implementation the method for temperature in the range of soldering process. There were measured the surface tension of a SnAgCu 305 alloy obtained in a laboratory of UPB at temperature ranging from 225 to 265°C. The expanded measurement uncertainty of the results, with 95% degree of confidence, was estimated based on multi-convolutional approach of uniform probability density functions. The main result of the paper consists in finding of a simple way of simulating of the symetric shape profile with analytical function. Based on the first and second order derivatives of the simulated profile function were calculated the surface tension. An other important result consists in improving the quality of the test results based on measurement uncertainty estimation.","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121624367","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Wireless sensor location systems comparative performances evaluation 无线传感器定位系统性能比较评价
2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2012-12-24 DOI: 10.1109/SIITME.2012.6384398
E. Coca, Valentin Popa
{"title":"Wireless sensor location systems comparative performances evaluation","authors":"E. Coca, Valentin Popa","doi":"10.1109/SIITME.2012.6384398","DOIUrl":"https://doi.org/10.1109/SIITME.2012.6384398","url":null,"abstract":"Object location and movement speed are of interest in real applications, efforts being made during the last years in the direction of improving the precision of such systems. In this paper we investigate the performances of a location system made of wireless sensor nodes build around the Chipcon CC2431 System on Chip wireless sensor nodes, compare the results obtained with similar systems in almost the same conditions, and investigate the possibility of using the location and time information to determine the movement speed of mobile nodes. Measurement results obtained in an indoor environment are presented. Some remarks regarding the theoretical and practical speed measurement precision are included at the end of the paper.","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"60 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126261644","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Process parameter optimization of selective soldering 选择性焊接工艺参数优化
2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2012-12-24 DOI: 10.1109/SIITME.2012.6384359
Z. Oláh, M. Ruszinkó, R. Bátorfi, Z. Illyefalvi-Vitéz
{"title":"Process parameter optimization of selective soldering","authors":"Z. Oláh, M. Ruszinkó, R. Bátorfi, Z. Illyefalvi-Vitéz","doi":"10.1109/SIITME.2012.6384359","DOIUrl":"https://doi.org/10.1109/SIITME.2012.6384359","url":null,"abstract":"The topic of this paper refers to selective miniwave soldering. Experiments with a commercially available machine were made to determine the optimal values of the soldering parameters. The experiments were designed with choosing a multilayered, FR4-type, mixed assembly printed circuit board (PCB), and a plug connector, with 112 pins, arrayed in five rows. During soldering, the solder miniwave was moved along the pin rows, and the challenge was to avoid solder bridges between the pins with small pitch, while obtaining perfect and void-free joints. It was found that the proper settings of preheating could significantly decrease the number of defects, and the solder bridging could be eliminated by using the machine's wave-lowering (pull-down) function at the end of the pin rows.","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130922315","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Computation of a directional coupler for RFID systems RFID系统定向耦合器的计算
2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2012-12-24 DOI: 10.1109/SIITME.2012.6384397
D. Vuza, R. Frosch, M. Vlădescu
{"title":"Computation of a directional coupler for RFID systems","authors":"D. Vuza, R. Frosch, M. Vlădescu","doi":"10.1109/SIITME.2012.6384397","DOIUrl":"https://doi.org/10.1109/SIITME.2012.6384397","url":null,"abstract":"The question of establishing a connection point between the antenna circuit and the receiving part of the reader is of major importance for the reliable working of an RFID system, particularly for one of long-range type. Many systems used so far a direct or a voltage divider connection. A novel approach employing a directional coupler with transformers was pioneered by NXP and, according to [2], represents a state-of-the-art as concerns RFID. The computations of the coupler performed in [1] and [2] assumed ideal transformers, i.e., infinite inductances of the transformer coils. We present here a computational model based on admittance matrices that allows for finite inductances.","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133171793","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Thermocouple attachment methods for PCB profiling during Vapour Phase Soldering 气相焊接过程中PCB剖面的热电偶连接方法
2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2012-12-24 DOI: 10.1109/SIITME.2012.6384414
A. Géczy, B. Kvanduk, B. Illés, Z. Illyefalvi-Vitéz
{"title":"Thermocouple attachment methods for PCB profiling during Vapour Phase Soldering","authors":"A. Géczy, B. Kvanduk, B. Illés, Z. Illyefalvi-Vitéz","doi":"10.1109/SIITME.2012.6384414","DOIUrl":"https://doi.org/10.1109/SIITME.2012.6384414","url":null,"abstract":"Vapour Phase Soldering (VPS) is an alternative reflow soldering method, which had a comeback after the introduction of Galden fluid. The heat transfer in a VPS oven is totally different than in the case of conventional soldering methods, such as convectional and IR radiation soldering. Most of the energy (which is required to melt the solder alloy) is transferred to the board during the condensation of the Galden vapour. Printed Circuit Board (PCB) temperature profiling is usually done with thermocouples attached to the board itself with different attachment methods. An unprocessed laminate PCB was prepared for temperature profiling. Standard K-Type thermocouples were attached to it with the standard methods, such as thermocouple fixing with Polyimide tape, SMD adhesive and High-Temperature Solder (HTS) alloy. The paper highlights the importance of condensate film layer, which have an effect on attachments and the thermocouples themselves. The results of the measurements are investigated in the paper.","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116241018","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Investigating micro-alloyed solders with thermal shock tests 用热冲击试验研究微合金焊料
2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2012-12-24 DOI: 10.1109/SIITME.2012.6384361
T. Garami, O. Krammer
{"title":"Investigating micro-alloyed solders with thermal shock tests","authors":"T. Garami, O. Krammer","doi":"10.1109/SIITME.2012.6384361","DOIUrl":"https://doi.org/10.1109/SIITME.2012.6384361","url":null,"abstract":"This paper presents how the low Ag content and micro-alloys in solders can influence the quality and the reliability of joints during thermal shock tests. The solder joints of 0603 (1.6 × 0.8 mm) size surface mounted resistors were compared, while the thermal shock cycle number was increased up to 2000 cycles. The low Ag content, micro-alloyed solders, named mSAC1 and mSAC2, were compared to normal SAC305, SAC405 and 62Sn36Pb2Ag solders. Cross-sections were made to measure the Cu3Sn and the Cu6Sn5 intermetallic layers' average thickness. By inspecting the cross-sections, it is also revealed what kind of typical crack path has formed in the solder joints.","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132988386","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Wireless sensor network localization scenario 无线传感器网络定位场景
2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2012-12-24 DOI: 10.1109/SIITME.2012.6384388
R. Rusnac, A. Gontean, L. Crisan
{"title":"Wireless sensor network localization scenario","authors":"R. Rusnac, A. Gontean, L. Crisan","doi":"10.1109/SIITME.2012.6384388","DOIUrl":"https://doi.org/10.1109/SIITME.2012.6384388","url":null,"abstract":"This paper presents a real life localization scenario. A small scale network based on Xbee transceivers is used in order to verify positioning algorithms. The localization method is RSSI based; the algorithms used for localization are maximum likelihood estimation, weighted centroid localization, Malguki spring, modified multidimensional scaling and iterative trilateration. The algorithm performance is evaluated based on the positioning error and on their computational time. An optimization criterion is proposed.","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121882783","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Determination of the Sn/IMC ratio in solder joints combining electrochemistry and confocal microscopy 电化学-共聚焦显微法测定焊点Sn/IMC比值
2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2012-12-24 DOI: 10.1109/SIITME.2012.6384351
T. Hurtony, A. Bonyár, M. Luniak, M. Muller
{"title":"Determination of the Sn/IMC ratio in solder joints combining electrochemistry and confocal microscopy","authors":"T. Hurtony, A. Bonyár, M. Luniak, M. Muller","doi":"10.1109/SIITME.2012.6384351","DOIUrl":"https://doi.org/10.1109/SIITME.2012.6384351","url":null,"abstract":"In this work we present a novel method to determine the Sn/IMC (intermetallic compound) ratio in various SAC (Sn-Ag-Cu) alloy based solder joints utilizing selective electrochemical etching and confocal microscopy. We discuss the principles and possibilities of this combined method and present pilot measurement results regarding the determination of the Sn/IMC ratio for solder joints prepared with different soldering techniques.","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117063190","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Improved performances filtering method for wireless sensor location positioning systems 改进的无线传感器定位系统性能滤波方法
2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2012-12-24 DOI: 10.1109/SIITME.2012.6384399
E. Coca, Valentin Popa
{"title":"Improved performances filtering method for wireless sensor location positioning systems","authors":"E. Coca, Valentin Popa","doi":"10.1109/SIITME.2012.6384399","DOIUrl":"https://doi.org/10.1109/SIITME.2012.6384399","url":null,"abstract":"Location and speed measurement services for industrial applications are still of great interest. Filtering algorithms are often used in order to minimize the positioning errors, but they are high energy consuming and difficult to implement in local node low power processors. We propose a filtering algorithm to be implemented in the central control node, based on the real maximum speed a wireless mobile node may have. The operating principle is quite simple as we calculate the speed between two consecutive node positions and eliminate those having values greater than a predefined maximum possible speed. The method is very fast, effective and easy to implement in real applications and with very good results when comparing with similar solutions. The theoretical results demonstrate the method could be a good alternative to existing solutions. Practical measurements setup, results and some conclusions are presented at the end of the paper.","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123507884","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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