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2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)最新文献

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On wide frequency range airborne ultrasonic transducers 宽频率范围机载超声换能器
2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2012-12-24 DOI: 10.1109/SIITME.2012.6384358
S. Epure, D. Aiordachioaie
{"title":"On wide frequency range airborne ultrasonic transducers","authors":"S. Epure, D. Aiordachioaie","doi":"10.1109/SIITME.2012.6384358","DOIUrl":"https://doi.org/10.1109/SIITME.2012.6384358","url":null,"abstract":"Airborne ultrasonic transducers with wide range of working frequency (50-200 kHz) are considered in this paper. The transducers are made from a special electromechanical film (EMFIT). Previous works based on EMFIT have considered aluminum active surfaces, on one or both sides of the transducer. The present work considers active surfaces made from gold. The obtained ultrasonic transducers are measured and analyzed from frequency response and directivity points of view. The novelty of the work is on the gold surfaces of the transducers, which provides a more flexible and reliable technology of the manufacturing process comparing with aluminum based surfaces.","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"72 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126257563","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Laboratory platform for board temperature profiling inside reflow ovens 回流炉内板温度分析的实验室平台
2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2012-12-24 DOI: 10.1109/SIITME.2012.6384376
M. Vidrascu, N. Codreanu, R. Lecu, I. Plotog
{"title":"Laboratory platform for board temperature profiling inside reflow ovens","authors":"M. Vidrascu, N. Codreanu, R. Lecu, I. Plotog","doi":"10.1109/SIITME.2012.6384376","DOIUrl":"https://doi.org/10.1109/SIITME.2012.6384376","url":null,"abstract":"The paper presents the research and development activities performed by authors for the conception and realization of a laboratory platform destined for temperature profiling at the level of the printed circuit board (PCB) during the soldering process inside reflow ovens [1], [3]. The platform was developed in the last months, being based on contact temperature measurement (with K thermocouples). The radio communication [5] offers a reliable data transfer to a computer, plotting the thermal profile, representing the relationship between temperature and time during the heating of PCB for the components' soldering process. The platform consists in two main blocks: the acquisition system, which travels inside the oven together with the PCB, and the receiver system, which receives the radio signals from the reflow oven and transfers towards a computer the technical data for graphical displaying and further investigation. This contribution is focused only to the first system/block, which works in much harsher conditions than the second one.","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121806161","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Matlab tool for simulations of power resonant converters 功率谐振变换器仿真的Matlab工具
2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2012-12-24 DOI: 10.1109/SIITME.2012.6384395
A. Taut, O. Pop
{"title":"A Matlab tool for simulations of power resonant converters","authors":"A. Taut, O. Pop","doi":"10.1109/SIITME.2012.6384395","DOIUrl":"https://doi.org/10.1109/SIITME.2012.6384395","url":null,"abstract":"The intend of this paper is to present a new tool for simulations of power resonant converters. The load of converters represents an oscillating resonant circuits and the major problem consist in obtaining the maximum power at resonant switching frequency, imposed by load. In order to simulate and implementing the resonant converters, we develop a Matlab tool based of the differential equations that define the converter topology. This tool returns the corresponding waveforms for converter operation and allows changing in every moment the circuit parameters.","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131590868","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Application-oriented robustness optimization based on metamodels 基于元模型的面向应用的鲁棒性优化
2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2012-12-24 DOI: 10.1109/SIITME.2012.6384342
A. Oros, M. Topa, M. Neag, M. Rafaila, G. Pelz
{"title":"Application-oriented robustness optimization based on metamodels","authors":"A. Oros, M. Topa, M. Neag, M. Rafaila, G. Pelz","doi":"10.1109/SIITME.2012.6384342","DOIUrl":"https://doi.org/10.1109/SIITME.2012.6384342","url":null,"abstract":"Real-life systems should perform within tight limits even when affected by uncontrollable factors such as temperature and power supply variations. This paper outlines a methodology for robustness optimization based on the Design of Experiments and metamodelling concepts. The main idea is to derive metamodels of the mean response and its dispersion depending only on control factors; thus, the optimization can tackle more effectively the tasks of bringing the mean response to within a set range and minimize the response statistical dispersion. The proposed method was used to optimize the sizing of the external circuitry of a low dropout voltage regulator used in automotive applications; several parameters were improved, especially w.r.t. reducing their dispersion with temperature by up to 28.5%. The method makes no assumptions on the uncontrollable factors and can work with a large variety of metamodels employed; also, it can be easily extended to multiple-response optimization.","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"94 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134212075","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Implementation of interactive communicational elements on e-learning educational platforms 电子学习教育平台上互动交流元素的实现
2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2012-12-24 DOI: 10.1109/SIITME.2012.6384406
T. Vlad, D. Pitica, J. Rajmond
{"title":"Implementation of interactive communicational elements on e-learning educational platforms","authors":"T. Vlad, D. Pitica, J. Rajmond","doi":"10.1109/SIITME.2012.6384406","DOIUrl":"https://doi.org/10.1109/SIITME.2012.6384406","url":null,"abstract":"This paper presents interactive communicational elements that can be implemented on an already existing e-learning platform in order to optimize the educational process regarding young students. Thus, several tools have been developed to connect the educational practice to the information technology: information distribution, communication between students, interaction between teacher and students and monitoring the teaching process.","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123686294","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Automatic capacitor evaluation and testing with characteristic graph 具有特性图的自动电容评估和测试
2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2012-12-24 DOI: 10.1109/SIITME.2012.6384394
R. Szabó, A. Gontean, I. Lie
{"title":"Automatic capacitor evaluation and testing with characteristic graph","authors":"R. Szabó, A. Gontean, I. Lie","doi":"10.1109/SIITME.2012.6384394","DOIUrl":"https://doi.org/10.1109/SIITME.2012.6384394","url":null,"abstract":"This paper presents an automatic testing method of capacitors. The used equipment is an Agilent 4263B LCR Meter. This equipment can measure, capacitance, resistance and inductance as a function of frequency. This way we can evaluate capacitors, because their value changes with the frequency.","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127363980","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Investigating of electrochemical migration on low-ag lead-free solder alloys 低银无铅钎料合金的电化学迁移研究
2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2012-12-24 DOI: 10.1109/SIITME.2012.6384415
B. Medgyes, D. Rigler, B. Illés, G. Harsányi, L. Gál
{"title":"Investigating of electrochemical migration on low-ag lead-free solder alloys","authors":"B. Medgyes, D. Rigler, B. Illés, G. Harsányi, L. Gál","doi":"10.1109/SIITME.2012.6384415","DOIUrl":"https://doi.org/10.1109/SIITME.2012.6384415","url":null,"abstract":"Among the conditions of high humidity, elevated temperature, and voltage applied, metals and alloys in electronic components and assemblies can cause insulation failures by forming so called dendrites due to the electrochemical migration (ECM) failure phenomenon. This effect causes short-circuit failures of the electronic circuits, which might lead to catastrophic failure. The ECM behavior of lead-free micro-alloyed low Ag content solder alloys (SAC0307 and SAC0807) were compared with common used SAC305, SAC405 and with the traditionally lead-bearing solder alloys: Sn63Pb37 and Sn62Pb36Ag2 as references. In order to carry out the ECM investigations, water drop (WD) tests were made on standard comb patterns in 1 mMol NaCl and 1 mMol Na2SO4 solutions as well. The results have shown that the SAC0807 low Ag content micro-alloyed solder alloy could have a relative weak resistance against ECM.","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"200 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114379999","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
FSK transmission circuit for remote sensors integration in distributed measurement systems 分布式测量系统中遥感器集成的FSK传输电路
2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2012-12-24 DOI: 10.1109/SIITME.2012.6384383
D. Visan, I. Lita, M. Raducu
{"title":"FSK transmission circuit for remote sensors integration in distributed measurement systems","authors":"D. Visan, I. Lita, M. Raducu","doi":"10.1109/SIITME.2012.6384383","DOIUrl":"https://doi.org/10.1109/SIITME.2012.6384383","url":null,"abstract":"In this paper is presented an innovative design and the practical implementation of a communication circuit intended to be used for long distances transmission of the signals from sensors. The circuit is suitable for integration within the conditioning modules that are used for processing of signals from sensors that are connected to remote data acquisition systems. Regarding his structure, the proposed circuit is composed by two modules: the transmitter and the receiver. The transmission part operates with FSK (Frequency Shift Keying) modulation technique having two discrete transmission frequencies of 400kHz and 800kHz respectively. The receiver part of the circuit is implemented as an asynchronous FSK demodulator. The maximum data transmission rate obtained with the proposed circuit is around 100kbits/s but this value can be improved by using more rapid circuits and increasing the carrier frequency. By using the robust FSK modulation for sensor's signal transmission, the circuit achieves an improved immunity to electrical noises and spurious signals. This is an important advantage because interference problems are very frequently meet in the industrial environments where operates remote data acquisition systems. Another advantage of the proposed circuits is the possibility to multiplex signals from multiple sensors in order to be transmitted on the same physical channel.","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"88 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132460205","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Personal assistant robot 个人助理机器人
2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2012-12-24 DOI: 10.1109/SIITME.2012.6384348
Anca Alexan, A. R. Oşan, Stefan Oniga
{"title":"Personal assistant robot","authors":"Anca Alexan, A. R. Oşan, Stefan Oniga","doi":"10.1109/SIITME.2012.6384348","DOIUrl":"https://doi.org/10.1109/SIITME.2012.6384348","url":null,"abstract":"We live in a world in which technology embraces us, makes our lives easier and more enjoyable. Although we all benefit from this emerging technology, certain groups of people need more help and support then others: elderly or disable people. For them technology means a way of having an almost normal life. So we focused our attention on an age old concept: the smart house [1], more precisely a personal assistant robot that is a part of the smart house paradigm. This robot is mainly designed for this group of people as its main purpose is to offer assistance to an elderly or disabled person [2].","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"149 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114012796","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Method of emphasis, using second order active filters Sallen-Key 强调方法，采用二阶有源萨伦-基滤波器
2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2012-12-24 DOI: 10.1109/SIITME.2012.6384392
S. Gheorghe
{"title":"Method of emphasis, using second order active filters Sallen-Key","authors":"S. Gheorghe","doi":"10.1109/SIITME.2012.6384392","DOIUrl":"https://doi.org/10.1109/SIITME.2012.6384392","url":null,"abstract":"In this article I present the components of a circuit that is designed to improve the signal/noise communications using frequency modulation. Circuit was made interposing between two active filters, Sallen-Key second order, a non-inverting amplifier. The proposed scheme was analyzed with the program Macker circuit and voltage dependence graph/time has been translated in coordinates voltage/frequency to emphasize the function performed by the circuit.","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"69 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124034048","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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