2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)最新文献_第7页

Microstructure comparative analysis of the solder joints based on SAC/SN100 soldering alloy type depending on the cooling rate 基于SAC/SN100钎焊合金类型不同冷却速率的焊点组织对比分析

2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2012-12-24 DOI: 10.1109/SIITME.2012.6384369

I. Plotog, G. Dumitru, N. Codreanu, A. Vasile, M. Branzei, I. Pencea, M. Tarcolea

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引用次数: 3

LTCC integrated miniature Rb discharge lamp module for stable optical pumping in miniature atomic clocks and magnetometers LTCC集成微型Rb放电灯模块，用于微型原子钟和磁力计的稳定光泵浦

2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2012-12-24 DOI: 10.1109/SIITME.2012.6384357

V. Venkatraman, H. Shea, F. Vecchio, T. Maeder, P. Ryser

{"title":"LTCC integrated miniature Rb discharge lamp module for stable optical pumping in miniature atomic clocks and magnetometers","authors":"V. Venkatraman, H. Shea, F. Vecchio, T. Maeder, P. Ryser","doi":"10.1109/SIITME.2012.6384357","DOIUrl":"https://doi.org/10.1109/SIITME.2012.6384357","url":null,"abstract":"We report here on an integrated mini-lamp module (15×26×4 mm3) with a microfabricated rf-powered Rb dielectric barrier discharge (DBD) lamp (10×10×3 mm3) positioned on top of a 0.6 mm thick (thickness adjustable) 4-layer LTCC (Low Temperature Co-fired Ceramic) stacked platform containing a serpentine heating resistor design with high heating capacity (up to several hundred degree Celsius) for lamp heating, a fast response DP 5092D PTC temperature sensor for temperature stabilization using PID feedback and a patterned pad layout for the drive circuit components and interconnects. This is the first report of an LTCC integrated Rb mini-lamp module. The novelties of this design include: (1) compact module and independent heating design with thermal isolation of the drive components, (2) very low capacitive interference of the heating elements on the lamp electrodes leading to lower power coupling losses and higher optical power stability during pumping operation, and (3) the components can be batch-fabricated and the module can be independently used for optical pumping in other applications including magnetometers and gyroscopes.","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"115 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117261209","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Capacitive displacement sensor embedded in LTCC packaging 电容式位移传感器嵌入LTCC封装

2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2012-12-24 DOI: 10.1109/SIITME.2012.6384346

N. Blaz, A. Maric, L. Zivanov, G. Radosavljevic

引用次数: 2

Compact solution for mobile phono-cardiography 紧凑型解决方案的移动电话心动图

2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2012-12-24 DOI: 10.1109/SIITME.2012.6384391

F. Sandu, A. Stanca, A. I. Dumitru, C. Gerigan

引用次数: 0

A new methodology for dynamic reconfiguration of structured ASIC 结构化集成电路动态重构的新方法

2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2012-12-24 DOI: 10.1109/SIITME.2012.6384396

T. Tulbure

引用次数: 0