{"title":"Programmable hybrid electric system with low electromagnetic emissions","authors":"B. Mihailescu, P. Svasta, A. Vasile","doi":"10.1109/SIITME.2012.6384355","DOIUrl":"https://doi.org/10.1109/SIITME.2012.6384355","url":null,"abstract":"The following paper is a study on an electrical system which is using a Electrochemical Double-Layer Capacitor (EDLC) battery pack and an electronic system with minimal electromagnetic interference for use in automotive applications. The design of the electronic control module incorporated into the system, which represents an original solution for assuring minimal conducted and radiated electromagnetic disturbances, emphasizes the importance of taking into consideration the nonideal behavior of electronic components and the necessity of including electromagnetic interference suppression components as well as filtering. The device enables communication with a computer system through a graphical user interface. Electromagnetic compatibility assessment has been conducted in a semi-anechoic chamber and a TEM-cell and compared with the specifications of the current standards.","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115231949","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Spherical coordinates control system for accurate orientation of directional antennas","authors":"I. Lita, D. Visan","doi":"10.1109/SIITME.2012.6384382","DOIUrl":"https://doi.org/10.1109/SIITME.2012.6384382","url":null,"abstract":"In this paper is presented a novel implementation of a spherical coordinates control system intended to be used for dynamic orientation of communication antennas. The proposed control system is composed by three electronic modules: the interface with the computer, the motor drivers and the stepper motors with mechanical elements for antenna orientation. The control algorithm is implemented as a LabVIEW software application that runs on the computer and sends periodic commands to the external modules. The connection between the external modules and the computer is realized through the parallel port. Also, the interface of the external modules ensures galvanic insulation for proper protection of the computer. In the presented implementation an angular resolution of 3,25 degrees was obtained using half-step command of motors but the accuracy can be easy improved with minor changes in hardware and software structure of the system. By programming the control application using LabVIEW environment are obtained important advantages as: intuitive interface for the user, modularity of the program, simple implementation, and flexibility in developing new features for the proposed system.","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123316174","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Georgiana Ionela PADURARU, A. Tudor, S. Cananau, I. Plotog, G. Vărzaru
{"title":"Mechanical test for vapor phase solder joint","authors":"Georgiana Ionela PADURARU, A. Tudor, S. Cananau, I. Plotog, G. Vărzaru","doi":"10.1109/SIITME.2012.6384401","DOIUrl":"https://doi.org/10.1109/SIITME.2012.6384401","url":null,"abstract":"The goal of present paper is to describe some aspects regarding the mechanical properties of the lead-free solder joint connections obtained by using the vapor phase soldering technology. In order to highlight the mechanical properties of solder joints in correlation with different pad finishes and different solder paste composition, there were performed some mechanical tests using a Share test system. Novelty is that the paper presents a mechanical experiment that wants to describe the adhesion of solder joint on cooper pad. The experiment was performed using two types of solder paste and three types of pad finish.","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122364147","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Solder paste optimization in thermal pad padstack","authors":"I. Damian, C. Branescu, V. Soare","doi":"10.1109/SIITME.2012.6384360","DOIUrl":"https://doi.org/10.1109/SIITME.2012.6384360","url":null,"abstract":"In this paper is presented an important solder paste optimization for thermal pads used for Quad Flat No leads (QFNs) and Small Outline No leads (SONs) packages. The PCB (printed circuit board) must be designed to have an excellent heat conductivity for them, incorporating a thermal pad and thermal vias on it. This can be achieved by creating a special padstack for thermal pad, with a complex solder paste, created in a matrix of squares leaving channels for thermal vias. This way, the quantity of solder paste used in fabrication process is smaller than the case of a full filled solder paste pad, avoiding solder leakage through vias. The novelty of the paper is represented by creating a complex solder paste pad, using a template, like a starting point for the rest of thermal pads included in Mentor Graphics Expedition software library.","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126681286","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Resonance in power converters circuits","authors":"I. Baciu, S. Lungu","doi":"10.1109/SIITME.2012.6384372","DOIUrl":"https://doi.org/10.1109/SIITME.2012.6384372","url":null,"abstract":"The story about resonant circuits it's important for understanding the operation behavior of resonant power converter. The aim of this study is to made the student's to understand how can they apply mathematics relations in study of this phenomenon and to know how we can apply it in power supply circuits. For the resonance we must have at least two reactive components. One of these components is a capacitor and another is an inductor. The difference between them is the phase angle between current and voltage. The most important thing is to put in evidence, in situation of resonance, the minimum impedance of equivalent circuit, the angle phase zero between voltage and current and the current and voltage sinusoidal shape. If we apply this circuit in a power converter supply and if we make an analysis about this the conclusion which we obtain is about the frequency of stimulation signal. To eliminate the multiple commutations we must have an equal or bigger commutation frequency like resonant frequency. For this paper I realize to a simple application in Matlab to compute the frequency of equivalent circuit and to simulate Buck converter with ZVS commutation and ZCS commutation.","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130647252","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Surface temperature measurement with thermocouple matrix using a switch control unit","authors":"R. Szabó, A. Gontean, I. Lie","doi":"10.1109/SIITME.2012.6384393","DOIUrl":"https://doi.org/10.1109/SIITME.2012.6384393","url":null,"abstract":"This paper presents a method to measure temperature on many channels with thermocouples. This can be useful to create a temperature matrix for recreating a temperature surface. The other usage could be to measure the temperature for many chips on a circuit board. The application is currently capable of measuring temperature in 20 points.","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"58 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128156009","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Effects of technological parameters onto OTFTs' electrical performance","authors":"A. Bonea, T. Hassinen, A. Vasile, P. Svasta","doi":"10.1109/SIITME.2012.6384349","DOIUrl":"https://doi.org/10.1109/SIITME.2012.6384349","url":null,"abstract":"The paper aims to asses and describe the optimal fabrication of organic thin film transistors (OTFTs) with commercially available materials. Several types of thermal treatments and substrate treatments are discussed. The speed and direction of the thermal treatment for solvent evaporation and polymerization of the dielectric and the semiconductor influences the final electrical parameters of the devices. Also, substrate treatments have an effect onto the uniformity and alignment of the coated materials. Transistors with various channel lengths are fabricated and their electrical parameters are assessed taking into account the effect of the processing steps and their geometry.","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132035811","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Application of particle filter algorithms in an accurate and reliable localization and tracking of WSN's mobile devices","authors":"D. Zevedei, M. Jurian, A. Scutariu","doi":"10.1109/SIITME.2012.6384403","DOIUrl":"https://doi.org/10.1109/SIITME.2012.6384403","url":null,"abstract":"This Wireless communication capabilities enable location-based applications such as management telecommunication work teams and other professional groups in field. The accuracy and reliability localization may be degraded by noise. In order to improve the localization precision is proposed a filtering algorithm that is characterized throw robustness and simplicity for estimation application. The particle filter (PF) algorithm offers a proper solution when the challenges studied are nonlinear or include non Gaussian noise. In this work are analyzed and compared two filtering algorithms: the standard particle filter and the cost reference particle filter, for tracking a mobile device. The results underline the robustness and the reliability of the cost reference particle filter to exemplify the errors which are characteristic in filtering algorithms.","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130111881","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Inertial navigation modular system","authors":"S. Sebastian, L. Claudiu, O. Ioan","doi":"10.1109/SIITME.2012.6384389","DOIUrl":"https://doi.org/10.1109/SIITME.2012.6384389","url":null,"abstract":"This document present implementation of an inertial navigation modular system that permit in some way onboard data processing. For this reason the module may be considered as intelligent sensor.","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131039959","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Thermal analysis of thin film transistor liquid crystal display (TFT-LCD) TV panels with single sided LED bars","authors":"I. Tavman, A. Turgut, M. Iz","doi":"10.1109/SIITME.2012.6384343","DOIUrl":"https://doi.org/10.1109/SIITME.2012.6384343","url":null,"abstract":"In this research thermal and fluid fields of a 32-inch commercial thin film transistor liquid crystal display (TFT-LCD) TV panel were investigated numerically and experimentally. The new trend in the production of TFT-LCD, TV panel is to have slimmer screen displays. The original design with 180 LEDs (light emitting diodes) placed at the top and bottom edges of the panels was modified. In the new design, the panels were illuminated using only 72 LEDs placed underside and inside the panels. By this modification an important cost reduction has been achieved alongside having slimmer screen displays. Heat dissipated by these 72 LEDs must be removed in order to assure good image quality and long service life. Hence an appropriate thermal management is indispensable. To analyze temperature distribution at steady state condition a CFD (computational fluid dynamics) computer code “FloEFD” was used. The results obtained from the computational analysis have been validated by using experimental techniques. For this purpose thermocouples were attached on the panel and after the steady state has been reached, temperatures have been recorded in order to compare them to the distribution obtained by “FloEFD”. Furthermore, a thermal camera image of the panel by FLIR Thermacam SC2000 test device was obtained as another validation for temperature distribution.","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131014725","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}